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TLV5616IDGKR Data Acquisition - Digital to Analog Converters (DAC) от Texas Instruments

TLV5616IDGKR — это компонент категории Data Acquisition - Digital to Analog Converters (DAC) от Texas Instruments в упаковке TSSOP. Его обычно проверяют для IC 12 BIT 3US DAC S/O 8VSSOP. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

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TLV5616IDGKR Data Acquisition - Digital to Analog Converters (DAC) от Texas Instruments | TrustCompo
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  • Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
  • Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
  • 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.

Ключевые характеристики

Номер детали

TLV5616IDGKR

Внутренний код

TCE000050356

Упаковка

TSSOP

Производитель
Texas Instruments

Ключевые характеристики

Серия

-

Минимальное количество

1

Категория
Integrated Circuits (ICs)
Описание

IC 12 BIT 3US DAC S/O 8VSSOP

Основные характеристики

-

Сигналы доверия

Качество и доверие

Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.

4 сертификата
  • ISO 9001

    Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.

  • AS9120B

    Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.

  • ISO 14001

    Экологическая дисциплина в операционных и складских процессах.

  • ESD Control

    Стандарты защиты от электростатического разряда для чувствительных компонентов.

RFQ checklist

Процесс заказа

Подтвердите ключевые данные закупки для TLV5616IDGKR до RFQ, выпуска PO и планирования отгрузки.

  1. 1

    Подтвердить MPN

    Укажите точный part number, производителя, package и approval constraints в RFQ.

  2. 2

    Проверить склад и цену

    Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.

  3. 3

    Согласовать документы

    Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.

  4. 4

    Организовать отгрузку

    Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.

Перед выпуском PO

Проверка детали

  • Точный MPN подтвержден: TLV5616IDGKR
  • Корпус для проверки: TSSOP

Коммерческие условия

  • Live stock и срок поставки подтверждены через RFQ
  • Финальная цена и налоговые условия подтверждены до выпуска PO

Отгрузка и документы

  • Ship-from location: склад Hong Kong
  • Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя

Обзор продукта

Обзор

Проверьте sourcing context для TLV5616IDGKR от Texas Instruments, включая идентификацию товара, применимость, package notes и закупочные детали.

105℃ Long Life, Low Impedance, Lead Free Reflow Soldering.◆
FEATURES
• Load Life 105℃ 5000 hours.
• Reflow soldering is available.
• Large can-size SMD.
• RoHS compliance.

Технические параметры

Параметры

Сравните сгруппированные параметры TLV5616IDGKR от Texas Instruments, включая package, series, key attributes и technical values для engineering и sourcing review.

  • Export Classifications & Environmental

    RoHS Status

    ROHS3 Compliant

  • Export Classifications & Environmental

    Moisture Sensitivity Level (MSL)

    1 (Unlimited)

  • Export Classifications & Environmental

    JESD-609 Code

    e4

  • Product Attribute

    Part Status

    Active

  • Product Attribute

    Lead Free

    Lead Free

  • Product Attribute

    Lifecycle Status

    ACTIVE (Last Updated: 2 days ago)

TLV5616IDGKR Export Classifications & Environmental
ПараметрЗначение
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e4
TLV5616IDGKR Product Attribute
ПараметрЗначение
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Lifecycle Status

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

ACTIVE (Last Updated: 2 days ago)
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

6 Weeks
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tape & Reel (TR)
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~85°C
Output Type

Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches.

Voltage - Buffered
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Other Converters
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Data Acquisition - Digital to Analog Converters (DAC)
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

GULL WING
Converter Type

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

D/A CONVERTER
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

CMOS
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Texas
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

3V
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.65mm
Resolution

Resolution defines the smallest detectable change in a sensor's output or measurement. For electronic components, it determines precision and accuracy. Engineers compare resolution to ensure the component meets system requirements. Always verify the datasheet for exact resolution specifications under operating conditions.

1.5 B
Integral Nonlinearity (INL)

Indicates the maximum deviation of the ADC or DAC transfer function from an ideal straight line. Compare this value to ensure conversion accuracy for precision measurement and control applications. Verify against the datasheet's specified conditions, such as temperature and supply voltage.

4 LSB
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Height

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

1.07mm
Nominal Supply Current

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

900μA
Voltage - Supply, Analog

Specifies the acceptable range for the analog supply voltage input. This rail powers internal analog circuitry and affects accuracy and noise performance. Ensure your power design stays within this range to maintain specified operation.

2.7V~3.3V 5V
Number of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Surface Mount

Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.

YES
Minimum Supply Voltage

Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.

2.7V
Number of Bits

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

12
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Number of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

8
Number of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

8
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

8
Max Supply Voltage

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

5.5V
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

3mm
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

3mm
Differential Output

Indicates if the output is differential, meaning it provides two complementary signals. This is important for noise immunity and long-distance transmission. Engineers select differential outputs for high-speed or precision applications and verify the output type in the datasheet.

No
Number of Converters

Indicates how many independent converter channels or units are integrated in the component. Use this to match the required number of output rails or isolated sections in your power design, and verify channel-to-channel isolation and load sharing in the datasheet.

1
Receiver Hysteresis

This attribute specifies the voltage difference between the input thresholds of a receiver, ensuring noise immunity and stable switching. Engineers compare this value to match signal integrity requirements and to prevent false triggering in noisy environments. Always verify against the datasheet for the specific operating conditions.

External
Settling Time

Settling time is the duration for an output to reach and stay within a specified accuracy band after a step change. Engineers compare this to ensure fast, stable response in control loops, data acquisition, and precision circuits. Verify against datasheet conditions.

20μs
Digital Supply Voltage

Specifies the voltage level required for the digital core or interface circuitry of the component. Verify this parameter against the datasheet to ensure compatibility with your system's power rails and avoid damage or malfunction.

2.7V~3.3V 5V
Weight

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

23.303308mg
Max Power Dissipation

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

2.1mW
Conversion Rate

Indicates how many analog-to-digital or digital-to-analog conversions the device completes per second. Compare this rate with your system's sampling requirements to ensure real-time data acquisition. Verify the specified rate under the datasheet's operating conditions, as it may vary with clock frequency and supply voltage.

102 ksps
Sampling Rate

Number of analog signal samples taken per second by an ADC or digital sensor. Determines maximum signal frequency that can be accurately captured. Verify against datasheet for your application's bandwidth needs.

102 ksps
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

TLV5616
Manufacturer's Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

TLV5616IDGKR
INL/DNL (LSB)

Integral and differential nonlinearity in LSB units indicate how closely the ADC or DAC output matches an ideal transfer function. Compare these values to ensure conversion accuracy for your application. Verify against the datasheet for guaranteed limits.

±1.9, ±0.5
TLV5616IDGKR Product Parameter
ПараметрЗначение
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Nickel/Palladium/Gold (Ni/Pd/Au)
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

3/5V
Signal to Noise Ratio (SNR)

The ratio of signal power to noise power, expressed in decibels. Higher SNR indicates better signal quality and less noise interference. Compare this value when selecting components for high-fidelity or precision applications, and verify it under specified test conditions.

74 dB
Supply Type

Indicates the required power source, such as AC or DC, for the component. Engineers compare this to ensure compatibility with the system's power architecture. Verify the supply type against the datasheet to avoid incorrect power connections.

Single
Differential Nonlinearity

Indicates the maximum deviation of an actual code step from the ideal one-step size in an ADC or DAC. Compare this parameter across converters to assess linearity and potential distortion. Verify the specified value in the datasheet for your operating conditions.

1 LSB
Special Feature

Highlight any distinctive capabilities or design aspects that set this component apart, such as integrated protection, low power consumption, or high-speed switching. Compare these features against your application requirements and verify them in the datasheet to ensure compatibility.

SPI
Total Dose

Total ionizing dose tolerance for radiation-hardened components. Indicates maximum cumulative radiation exposure before performance degrades. Critical for aerospace, nuclear, and medical applications. Verify against datasheet for mission-specific radiation requirements.

970μm
Number of Lines

Specifies the number of signal lines or channels supported by the component. Compare this value with your circuit's required data or power paths. Always verify against the datasheet to ensure the part matches your design's channel count and pinout.

String DAC
Low-Bias

Indicates that the amplifier is designed with low input bias current, minimizing errors in high-impedance circuits. This is critical for precision applications like sensor interfaces and integrators. Check the datasheet for typical and maximum bias current values to confirm suitability.

BINARY
Power (Typ) @ Conditions

Typical power dissipation under specified conditions

0.0977%
Spurious-free dynamic range (SFDR)

SFDR measures the difference between the fundamental signal and the largest spurious tone in the output spectrum. It indicates signal purity and linearity, crucial for high-performance ADCs, DACs, and RF systems. Compare values across devices and verify against datasheet conditions.

70 dB
Micropower

Indicates the component is optimized for extremely low power consumption, often in microampere range. Ideal for battery-powered and energy-harvesting devices. Verify quiescent current and supply voltage range in the datasheet to ensure they meet your system's power budget.

SERIAL
Analog Output Voltage-Max

Specifies the highest voltage the analog output can deliver under specified conditions. Compare this limit with your input range and supply rails to avoid clipping or damage. Verify against the datasheet's absolute maximum ratings and recommended operating conditions for reliable performance.

3.2V

Документы уведомлений

PCN / product notice documents

0 документов

Публичные PCN / PDN записи сейчас не показаны

Для TLV5616IDGKR сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.

Частые вопросы

FAQ по товару

Точные ответы для покупателей, которые проверяют ordering code TLV5616IDGKR, упаковку, наличие, datasheet и путь замены.

Что означает TLV5616IDGKR?

TLV5616IDGKR — это точный ordering code для компонента категории Data Acquisition - Digital to Analog Converters (DAC) от Texas Instruments. Текущий корпус указан как TSSOP, а контекст позиции включает IC 12 BIT 3US DAC S/O 8VSSOP. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.

Как покупателям проверить ordering code TLV5616IDGKR?

Рассматривайте TLV5616IDGKR как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус TSSOP, документацию производителя Texas Instruments, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.

В каком корпусе поставляется TLV5616IDGKR?

TLV5616IDGKR сейчас указан с корпусом TSSOP от Texas Instruments. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.

TLV5616IDGKR сейчас доступен для заказа?

TLV5616IDGKR сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (TSSOP), указанный склад (62177), доступное количество (92242), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.

Где сравнить альтернативы для TLV5616IDGKR?

Для TLV5616IDGKR сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.