SST39LF802C-55-4C-B3KE Memory от Microchip Technology

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed.

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Standardized interface for flash memory devices, enabling host controllers to identify and program them. It ensures compatibility across manufacturers. Engineers use this to verify that the memory can be accessed with standard commands. Check the datasheet for supported commands and timing.

Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.

Specifies the duration needed to program a single word or a page in non-volatile memory. Compare this timing when selecting EEPROM or flash devices for write-intensive applications. Verify against the datasheet to ensure your system meets the required write throughput.

Specifies the memory region reserved for boot code in microcontrollers, flash, or EEPROM devices. This block is protected to ensure reliable startup. Verify its size and protection features against the datasheet when selecting parts for firmware updates or secure boot applications.

Data polling is a method used in memory devices to verify that a write operation has completed. It involves reading a specific data bit until it matches the expected value. Engineers compare this feature to ensure reliable programming and to avoid premature read operations.

Specifies the protocol or bus standard used to connect the component to external memory. Common types include SPI, I2C, parallel, and DDR. Verify compatibility with your host controller and memory device to ensure proper communication and data transfer rates.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

Indicates whether the device is ready to accept commands or busy processing. Check this status pin or register before initiating operations to avoid communication errors. Verify timing and logic levels in the datasheet for reliable system integration.

Interface for sending commands to a device, typically for configuration or control. It defines the protocol and command set. Engineers compare this to ensure the device can be integrated with their system. Verify the command set and response timing in the datasheet.

Indicates whether the component operates in synchronous or asynchronous mode. This affects timing, clocking, and data transfer protocols. Verify the mode against your system requirements and the datasheet to ensure proper integration and performance.

A status bit that toggles state to indicate a change in device condition, such as program completion or error. It is used for polling or interrupt generation. Engineers monitor this bit to track device status. Check the datasheet for its behavior and timing.

Specifies the number of bits in a single data word for memory or processor components. Compare word sizes when selecting devices for data throughput and processing capability. Verify the exact word size in the datasheet to ensure compatibility with your system architecture.

Specifies the internal organization of the memory device, such as DRAM, SRAM, or Flash. This affects how data is accessed and stored. Verify the format against your application requirements and the datasheet to ensure compatibility with your system's memory controller.

Specifies the number of bits transferred simultaneously between the memory device and the controller. Wider buses enable higher data throughput. Verify this parameter against the datasheet to ensure compatibility with your system's bus architecture and expected performance.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Maximum current drawn by the component when in standby or sleep mode. Lower values extend battery life in portable designs. Verify against datasheet conditions, as standby current can vary with supply voltage and temperature.

Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design.

Specifies the smallest erasable block size in memory devices. Compare sector sizes when selecting flash or EEPROM for firmware updates or data storage. Verify against the datasheet to ensure compatibility with your file system and wear-leveling requirements.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration.

Specifies the number of sectors and their individual size for rotary switches or encoders. This attribute helps engineers determine the number of positions and the angular spacing between them. Verify against the datasheet to ensure compatibility with your control panel or circuit design.

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance.

Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly.

Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

Programming voltage is the specific voltage required to write or erase data in programmable devices like EEPROMs, flash memory, or microcontrollers. It must be applied precisely during programming; incorrect levels can cause write failures or permanent damage, so always follow the datasheet's programming procedure.

Shows whether the component includes an integrated cache memory to speed up data access for the processor. Compare cache presence and size to assess performance for real-time or high-throughput tasks. Verify details in the datasheet.

Supply voltage is the DC voltage required to power the device, typically denoted as Vcc for bipolar or Vdd for CMOS circuits. It defines the operating range and logic levels. Designers must ensure the supply is within the specified limits to guarantee proper functionality and avoid damage.

Indicates the total count of serial input/output lines available on the component. Compare this specification when selecting microcontrollers, FPGAs, or interface ICs to ensure sufficient connectivity for your communication peripherals. Verify against the datasheet pinout and alternate function mappings.

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.