
ATAES132A-MAHER-T Memory от Microchip Technology
ATAES132A-MAHER-T — это компонент категории Memory от Microchip Technology в упаковке упаковке, указанной производителем. Его обычно проверяют для IC EEPROM 32K I2C 1MHZ 8UDFN. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
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- Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
- Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
- 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.
Ключевые характеристики
- Номер детали
ATAES132A-MAHER-T
- Внутренний код
TCE000061743
- Упаковка
-
- Производитель
- Microchip Technology
Ключевые характеристики
- Серия
CryptoAuthentication™
- Минимальное количество
1
- Категория
- Integrated Circuits (ICs)
- Подкатегория
- Memory
- Описание
IC EEPROM 32K I2C 1MHZ 8UDFN
- Основные характеристики
-
Сигналы доверия
Качество и доверие
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для ATAES132A-MAHER-T до RFQ, выпуска PO и планирования отгрузки.
- 1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
- 2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
- 3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
- 4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
- Точный MPN подтвержден: ATAES132A-MAHER-T
- Корпус для проверки: -
Коммерческие условия
- Live stock и срок поставки подтверждены через RFQ
- Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
- Ship-from location: склад Hong Kong
- Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Технические параметры
Параметры
Сравните сгруппированные параметры ATAES132A-MAHER-T от Microchip Technology, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Attribute
Part Status
Active
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
Mounting Type
Surface Mount
Product Attribute
Minimum Operating Temperature
-40°C
Product Attribute
Packaging
Tape & Reel (TR)
Product Attribute
Max Operating Temperature
85°C
| Параметр | Значение |
|---|---|
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Active |
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Minimum Operating Temperature Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs. | -40°C |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tape & Reel (TR) |
Max Operating Temperature Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage. | 85°C |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | DUAL |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.5mm |
Published Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions. | 2015 |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Microchip Technology |
Factory Lead Time Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions. | 2 Weeks |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | NO LEAD |
Temperature Grade Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements. | INDUSTRIAL |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | 5A992C |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | 2-Wire, I2C, Serial |
Contact Plating Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment. | Gold |
Number of Functions Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements. | 1 |
Reflow Temperature-Max (s) Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions. | 40 |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Number of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 8 |
Number of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 8 |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | 5.5V |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 3mm |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 3.3V |
Number of Ports Indicates how many independent connection points or interfaces the component provides. Compare this when selecting connectors, switches, or modules for multi-channel designs. Verify against the datasheet to ensure the port count matches your system's required I/O configuration. | 1 |
Minimum Supply Voltage Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges. | 2.5V |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 2mm |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 1MHz |
Data Polling Data polling is a method used in memory devices to verify that a write operation has completed. It involves reading a specific data bit until it matches the expected value. Engineers compare this feature to ensure reliable programming and to avoid premature read operations. | YES |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Memory |
Ready/Busy Indicates whether the device is ready to accept commands or busy processing. Check this status pin or register before initiating operations to avoid communication errors. Verify timing and logic levels in the datasheet for reliable system integration. | YES |
Endurance Indicates the number of program/erase cycles a memory device can withstand before performance degrades. This is critical for flash and EEPROM in applications with frequent writes. Engineers compare endurance to ensure data retention and reliability over the product's lifetime. Verify the specified endurance rating in the datasheet. | 100000 Write/Erase Cycles |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 8-UFDFN Exposed Pad |
Write Protection Describes the mechanism that prevents unintended writes to memory, such as hardware pins, software commands, or OTP fuses. This is critical for firmware integrity and security. Engineers must understand the write protection features to safeguard critical data. Check the datasheet for available protection modes and activation procedures. | SOFTWARE |
Memory Width Specifies the number of bits transferred simultaneously between the memory device and the controller. Wider buses enable higher data throughput. Verify this parameter against the datasheet to ensure compatibility with your system's bus architecture and expected performance. | 1 |
Operating Mode Specifies the functional mode of the component, such as continuous, pulsed, or burst. Engineers compare this to ensure the device operates correctly in their circuit topology. Verify the mode against the datasheet to match your application's requirements. | SYNCHRONOUS |
Reverse Pinout Indicates whether the pinout is reversed, meaning the pin functions are mirrored compared to standard configurations. This is critical for correct PCB layout and connector mating. Always verify the pinout diagram in the datasheet to avoid reverse polarity or signal misconnection. | NO |
Memory Organization Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration. | 32KX1 |
Applications Specify the typical end-use scenarios for this electronic component, such as consumer electronics, automotive, industrial, or telecommunications. This helps engineers quickly assess suitability for their design. Verify against the datasheet's application section. | Networking and Communications |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | ATAES132A |
Memory Type Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed. | EEPROM |
Standby Current-Max Maximum current drawn by the component when in standby or sleep mode. Lower values extend battery life in portable designs. Verify against datasheet conditions, as standby current can vary with supply voltage and temperature. | 0.00004A |
Type Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches. | Authentication Chip |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | CryptoAuthentication™ |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | ATAES132A-MAHER-T |
Write Cycle Time-Max (tWC) Specifies the maximum duration required to complete a single write operation in non-volatile memory. Compare this timing parameter across devices to ensure compatibility with your system's write timing budget. Always verify against the datasheet for worst-case conditions. | 16ms |
Additional Feature Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts. | I2C BUS INTERFACE; FMAX IS 1MHZ |
| Параметр | Значение |
|---|---|
Height Seated (Max) Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts. | 0.6mm |
| Параметр | Значение |
|---|---|
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 1 (Unlimited) |
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e4 |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.32.0051 |
| Параметр | Значение |
|---|---|
Memory Size Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in. | 4kB |
Memory Density Total storage capacity of the memory chip, typically expressed in bits or bytes. Compare densities to match your application's code and data requirements. Verify against the datasheet to ensure sufficient headroom for firmware and runtime variables. | 32 kb |
Supply Current-Max Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load. | 0.01mA |
Data Retention Time-Min Specifies the minimum duration that stored data remains valid without applied power. Critical for non-volatile memories, EEPROMs, and RTCs. Verify against datasheet to ensure data integrity over product lifetime, especially for industrial or automotive applications. | 10 |
Access Time Specifies the delay from address or control signal assertion until valid data is available at the output. Critical for memory and FPGA configuration devices. Compare with system clock requirements and verify against datasheet timing diagrams. | 550 ns |
| Параметр | Значение |
|---|---|
Page Size Memory page size determines the granularity of read and write operations in flash or EEPROM devices. Compare this value with your application's data block size to ensure efficient programming and erase cycles. Always verify against the datasheet for exact page boundaries. | 32words |
Документы уведомлений
PCN / product notice documents
Публичные PCN / PDN записи сейчас не показаны
Для ATAES132A-MAHER-T сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
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Частые вопросы
FAQ по товару
Точные ответы для покупателей, которые проверяют ordering code ATAES132A-MAHER-T, упаковку, наличие, datasheet и путь замены.
Что означает ATAES132A-MAHER-T?
ATAES132A-MAHER-T — это точный ordering code для компонента категории Memory от Microchip Technology. Текущий корпус указан как -, а контекст позиции включает IC EEPROM 32K I2C 1MHZ 8UDFN. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code ATAES132A-MAHER-T?
Рассматривайте ATAES132A-MAHER-T как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус -, документацию производителя Microchip Technology, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется ATAES132A-MAHER-T?
ATAES132A-MAHER-T сейчас указан с корпусом - от Microchip Technology. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
ATAES132A-MAHER-T сейчас доступен для заказа?
ATAES132A-MAHER-T сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (-), указанный склад (126839), доступное количество (20446), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для ATAES132A-MAHER-T?
Для ATAES132A-MAHER-T сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.





