CD74ACT245E Logic - Buffers, Drivers, Receivers, Transceivers от Texas Instruments

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Specifies the maximum current the output can sink when in a low logic state. Compare this with your load requirements to ensure reliable operation. Verify against the datasheet for absolute maximum ratings and thermal conditions.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.

Total number of electrical contacts in the connector, which determines the maximum number of circuits that can be connected. This is a critical parameter for matching the connector to your wire harness requirements. Ensure the contact count aligns with your signal and power needs.

Indicates the locking mechanism used to secure the connector or terminal in place. Choose the appropriate type for your application to ensure reliable mating and vibration resistance. Verify compatibility with the mating part and datasheet specifications.

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.

Specifies the number of bits the driver can handle, indicating the width of the data path or the number of channels. This determines the maximum data throughput and the number of outputs. Ensure it matches your system's bus width or channel requirements.

Specifies the physical size of the component body, either its length for rectangular parts or diameter for cylindrical ones. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure clearance and proper mounting in your enclosure or assembly.

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

Indicates the product family or series to which the component belongs. Helps identify related parts with similar characteristics. Verify the family name against the manufacturer's datasheet to ensure compatibility and correct sourcing.

Indicates how many independent connection points or interfaces the component provides. Compare this when selecting connectors, switches, or modules for multi-channel designs. Verify against the datasheet to ensure the port count matches your system's required I/O configuration.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Describes special mechanical characteristics for mounting, such as through-hole, surface mount, or specific clips. Ensures compatibility with your PCB layout and assembly process. Confirm before designing the footprint.

Thickness of the component, a critical dimension for PCB clearance, enclosure fit, and thermal performance. This measurement is especially important for capacitors, inductors, and connectors. Ensure the thickness meets your design constraints and does not interfere with adjacent components. Check the datasheet for tolerance and recommended mounting height.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

Height above board is the vertical distance from the PCB surface to the top of the component. This dimension is essential for mechanical fit in enclosures and for ensuring clearance under other components. Always check this value against your assembly's height constraints.

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Allowed deviation from the nominal value, expressed as a percentage. Determines precision of resistors, capacitors, and inductors. Choose tighter tolerance for precision circuits, but verify actual performance in the datasheet.

Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.

Specifies the coil's operational mode, such as latching or non-latching. This determines how the relay or solenoid maintains its state after power is removed. Verify the coil type against your circuit requirements to ensure proper latching behavior and power consumption.

This attribute specifies the thickness of a flat flexible cable (FFC) or flat circuit board (FCB). It is important for ensuring proper insertion into connectors and for mechanical fit in tight enclosures. Engineers must verify this dimension against the connector's specifications to guarantee reliable contact and avoid damage during assembly.

Physical dimensions of the component, typically length, width, and height. These measurements are critical for PCB layout and mechanical fit. Always verify against the datasheet for exact tolerances and mounting requirements.

Specifies the interface method used to operate the component, such as analog, digital, or PWM. Engineers compare this to ensure compatibility with their control circuitry. Verify the exact control protocol against the datasheet before integrating into your design.

Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.

Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.

Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.

This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.

Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.

Indicates the construction or configuration of the transformer, such as flyback, forward, or planar. Affects performance, size, and application suitability. Refer to datasheet for detailed specifications and recommended usage.

Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.

Range of maximum data transfer rates supported by the component, expressed in kilobits per second. This indicates the span of possible speeds the device can handle. Compare this range with your system's required throughput to ensure the component can support the necessary communication bandwidth without data loss.

Specifies the lowest switching frequency at which the power device can operate reliably. Compare this value with your application's required switching speed to ensure proper performance. Verify against the datasheet's recommended operating conditions.

Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.

Indicates the mechanical mounting or support method for the connector, such as panel mount, board mount, or free-hanging. This affects installation, vibration resistance, and space requirements. Verify compatibility with your enclosure and PCB layout before ordering.

Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.

Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance.

Specifies the resistance change curve of a potentiometer, such as linear or logarithmic. This affects how the output varies with rotation. Verify the taper type against your circuit requirements and the datasheet to ensure proper volume or control response.

Specifies the filter topology used in the component, such as low-pass, high-pass, band-pass, or notch. This determines the frequency response and attenuation characteristics. Engineers must verify the filter type against the datasheet to ensure it meets the required signal conditioning and interference rejection for the application.

Specifies the functional category of an integrated circuit designed for telecommunications, such as line interface, switching, or transceiver. This attribute helps engineers select the correct device for their communication system. Verify the exact type against the datasheet to ensure compatibility with your application.

Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions.

Select the primary classification that best describes the component type, such as semiconductor, passive, connector, or module. This helps narrow down the catalog and ensures you compare products within the same functional family. Verify the category matches the datasheet description.

Current required for modulation in optical or RF components. This parameter defines the operating point for signal modulation and affects power consumption and linearity. Check the datasheet to ensure your driver circuit can supply the necessary modulation current.

Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.

Maximum power the component can safely dissipate as heat under specified conditions. Compare this rating with your circuit's expected power loss to ensure reliable operation. Verify against the datasheet for derating curves and ambient temperature limits.

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

This attribute provides the component description from the Samacsys library. It summarizes key specifications and features for quick identification. Review it to understand the part's function and compare with the datasheet for detailed parameters.

Indicates the total count of input/output pins or channels available on the component. Engineers compare this to ensure sufficient connectivity for their application. Verify against the datasheet pinout to confirm exact configuration and compatibility with your design.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Specifies the amount of static RAM embedded within the microcontroller or processor die. This memory is used for data storage and stack operations, and its size directly impacts the complexity of firmware and real-time processing. Verify against the datasheet for exact memory organization and speed.