
MSC1212Y5PAGR Data Acquisition - ADCs/DACs - Special Purpose от Texas Instruments
MSC1212Y5PAGR — это компонент категории Data Acquisition - ADCs/DACs - Special Purpose от Texas Instruments в упаковке TQFP. Его обычно проверяют для IC 8051 CPU PREC ADC/DAC 64-TQFP. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
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- Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
- Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
- 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.
Ключевые характеристики
- Номер детали
MSC1212Y5PAGR
- Внутренний код
TCE000083624
- Упаковка
TQFP
- Производитель
- Texas Instruments
Ключевые характеристики
- Серия
-
- Минимальное количество
1
- Категория
- Integrated Circuits (ICs)
- Подкатегория
- Data Acquisition - ADCs/DACs - Special Purpose
- Описание
IC 8051 CPU PREC ADC/DAC 64-TQFP
- Основные характеристики
-
Сигналы доверия
Качество и доверие
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для MSC1212Y5PAGR до RFQ, выпуска PO и планирования отгрузки.
- 1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
- 2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
- 3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
- 4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
- Точный MPN подтвержден: MSC1212Y5PAGR
- Корпус для проверки: TQFP
Коммерческие условия
- Live stock и срок поставки подтверждены через RFQ
- Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
- Ship-from location: склад Hong Kong
- Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Обзор продукта
Обзор
Проверьте sourcing context для MSC1212Y5PAGR от Texas Instruments, включая идентификацию товара, применимость, package notes и закупочные детали.
GENERAL
The MSC1212-01 is a driver IC for VFD implemented in BiCMOS technology.
The circuit consists of a 48-bit shift register and a 48-bit latch; they control display data, which is output from the display drivers.Since a 64-pin plastic QFP package is used, the display unit size can be reduced.
FEATURES
• Logic supply voltage (VCC) : 4.5 to 5.5 V
• Driver supply voltage (VDISP) : 8 to 18 V
• Operating temperature range : –40 to +105°C
• Driver output current : IO2-1 = –6 mA (for only one driver on state) IO2-2 = –50 mA (total current for all drivers on state) IO2-3 = 0.2 mA
• Built-in 48-bit output Driver (with latch)
• Built-in 48-bit shift register
• Clock frequency : 0.5 MHz
• Package: 64-pin plastic QFP (QFP64-P-1414-0.80-BK) (Product name: MSC1212-01GS-BK)
Технические параметры
Параметры
Сравните сгруппированные параметры MSC1212Y5PAGR от Texas Instruments, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
ECCN
EAR99
Product Attribute
Lead Free
Lead Free
Product Attribute
Mounting Type
Surface Mount
Product Attribute
Packaging
Tape & Reel (TR)
Product Attribute
Part Status
Obsolete
| Параметр | Значение |
|---|---|
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | EAR99 |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tape & Reel (TR) |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | GULL WING |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~125°C |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 5V |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Qualification Status Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements. | Not Qualified |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | QUAD |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.5mm |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Microcontrollers |
Weight Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity. | 274.706879mg |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 64-TQFP |
Sampling Rate Number of analog signal samples taken per second by an ADC or digital sensor. Determines maximum signal frequency that can be accurately captured. Verify against datasheet for your application's bandwidth needs. | 1 ksps |
Resolution Resolution defines the smallest detectable change in a sensor's output or measurement. For electronic components, it determines precision and accuracy. Engineers compare resolution to ensure the component meets system requirements. Always verify the datasheet for exact resolution specifications under operating conditions. | 3 B |
Data Interface Specifies the communication protocol used by the component for data exchange. Common interfaces include I2C, SPI, UART, CAN, and USB. Verify the supported protocol and voltage levels in the datasheet to ensure compatibility with your system design. | Serial, Parallel |
Type Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches. | ADC and DAC: MCU Based |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Data Acquisition - ADCs/DACs - Special Purpose |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | Parallel, Serial |
Number of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 64 |
Number of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 64 |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 64 |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | NOT SPECIFIED |
Reflow Temperature-Max (s) Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions. | NOT SPECIFIED |
Address Bus Width Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design. | 16 |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 40MHz |
Number of I/O Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application. | 32 |
Number of Bits Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs. | 24 |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | MSC1212Y5 |
Conversion Rate Indicates how many analog-to-digital or digital-to-analog conversions the device completes per second. Compare this rate with your system's sampling requirements to ensure real-time data acquisition. Verify the specified rate under the datasheet's operating conditions, as it may vary with clock frequency and supply voltage. | 1 ksps |
Settling Time Settling time is the duration for an output to reach and stay within a specified accuracy band after a step change. Engineers compare this to ensure fast, stable response in control loops, data acquisition, and precision circuits. Verify against datasheet conditions. | 8 μs |
External Data Bus Width Number of parallel data lines on the external bus. Determines data transfer rate and interface complexity. Important for microcontrollers, DSPs, and memory devices. Verify with datasheet to match your system's bus architecture and timing requirements. | 8 |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | MSC1212Y5PAGR |
| Параметр | Значение |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.39.0001 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 4 (72 Hours) |
| Параметр | Значение |
|---|---|
Power Supplies Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues. | 3/5V |
Supply Type Indicates the required power source, such as AC or DC, for the component. Engineers compare this to ensure compatibility with the system's power architecture. Verify the supply type against the datasheet to avoid incorrect power connections. | Analog, Digital |
RAM Size Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering. | 1.3kB |
Sampling Rate Indicates how many times per second the device captures an analog signal. Higher rates capture faster changes but increase data volume. Verify against your application's bandwidth needs and the datasheet's maximum rating. | 1k |
Supply Source Type Defines whether the component is powered by a single, dual, or multiple supply rails, or by a specific source like a battery or regulator. This helps designers plan power distribution and avoid incorrect biasing. Check the datasheet for recommended supply configurations. | Analog Digital |
Core Architecture Specifies the processor core design, such as ARM Cortex-M or RISC-V. This determines instruction set compatibility, development tools, and software ecosystem. Verify against the datasheet to ensure firmware and RTOS support match your application requirements. | 8051 |
Power Consumption Typical power consumption of the component under normal operating conditions. This is important for power budget calculations and thermal management. Check the datasheet for maximum ratings and test conditions to ensure your design stays within safe limits. | 4mW |
Bit Size Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements. | 8 |
DMA Channels Number of independent direct memory access channels available on the microcontroller or processor. Compare this when selecting devices for data-intensive applications to ensure sufficient bandwidth for peripherals without CPU load. Verify against the datasheet for exact channel mapping and features. | NO |
Has ADC Check this attribute to confirm whether the component integrates an analog-to-digital converter. This is critical for microcontrollers, sensors, and mixed-signal ICs where analog inputs need digital processing. Verify against the datasheet to ensure the ADC meets your resolution and sampling requirements. | YES |
PWM Channels Number of independent pulse-width modulation outputs available on the component. Compare this when selecting microcontrollers, motor drivers, or LED controllers to ensure enough channels for your application. Verify against the datasheet for channel mapping and shared timer limitations. | YES |
Number of A/D Converters Indicates how many analog-to-digital converters are integrated in the component. Compare this when selecting devices for multi-channel data acquisition or mixed-signal processing. Verify the exact number and channel configuration in the datasheet. | 1 |
DAC Channels Number of digital-to-analog converter channels integrated in the device. Compare this to the number of analog outputs you need in your system. Verify against the datasheet to ensure the DAC resolution and output drive capability match your application requirements. | YES |
Number of Channels Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections. | 8 |
Number of D/A Converters Specifies how many digital-to-analog converter channels are integrated in the component. Engineers compare this to the number of analog output signals required in the system, and should verify the resolution and output range in the datasheet. | 4 |
Supply Voltage Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage. | 2.7V~5.25V |
ROM Programmability Indicates whether the read-only memory can be programmed or is factory-fixed. Buyers should verify if the device supports one-time or field programming, and check the datasheet for programming voltage and timing requirements. | FLASH |
Документы уведомлений
PCN / product notice documents
Публичные PCN / PDN записи сейчас не показаны
Для MSC1212Y5PAGR сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
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Частые вопросы
FAQ по товару
Точные ответы для покупателей, которые проверяют ordering code MSC1212Y5PAGR, упаковку, наличие, datasheet и путь замены.
Что означает MSC1212Y5PAGR?
MSC1212Y5PAGR — это точный ordering code для компонента категории Data Acquisition - ADCs/DACs - Special Purpose от Texas Instruments. Текущий корпус указан как TQFP, а контекст позиции включает IC 8051 CPU PREC ADC/DAC 64-TQFP. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code MSC1212Y5PAGR?
Рассматривайте MSC1212Y5PAGR как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус TQFP, документацию производителя Texas Instruments, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется MSC1212Y5PAGR?
MSC1212Y5PAGR сейчас указан с корпусом TQFP от Texas Instruments. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
MSC1212Y5PAGR сейчас доступен для заказа?
MSC1212Y5PAGR сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (TQFP), указанный склад (127785), доступное количество (47947), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для MSC1212Y5PAGR?
Для MSC1212Y5PAGR сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.





