
AM3357ZCZD72 Embedded - Microprocessors от Texas Instruments
AM3357ZCZD72 — это компонент категории Embedded - Microprocessors от Texas Instruments в упаковке упаковке, указанной производителем. Его обычно проверяют для IC MPU SITARA 720MHZ 324NFBGA. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
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- Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
- Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
- 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.
Ключевые характеристики
- Номер детали
AM3357ZCZD72
- Внутренний код
TCE000084964
- Упаковка
-
- Производитель
- Texas Instruments
Ключевые характеристики
- Серия
Sitara™
- Минимальное количество
1
- Категория
- Integrated Circuits (ICs)
- Подкатегория
- Embedded - Microprocessors
- Описание
IC MPU SITARA 720MHZ 324NFBGA
- Основные характеристики
-
Сигналы доверия
Качество и доверие
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для AM3357ZCZD72 до RFQ, выпуска PO и планирования отгрузки.
- 1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
- 2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
- 3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
- 4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
- Точный MPN подтвержден: AM3357ZCZD72
- Корпус для проверки: -
Коммерческие условия
- Live stock и срок поставки подтверждены через RFQ
- Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
- Ship-from location: склад Hong Kong
- Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Технические параметры
Параметры
Сравните сгруппированные параметры AM3357ZCZD72 от Texas Instruments, включая package, series, key attributes и technical values для engineering и sourcing review.
Parameter
Supply Voltage - Max
USB 2.0 + PHY (2)
Export Classifications & Environmental
RoHS Status
ROHS3 Compliant
Export Classifications & Environmental
JESD-609 Code
e1
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Export Classifications & Environmental
ECCN Code
3A991.A.2
Package Parameter
Height Seated (Max)
1.4mm
| Параметр | Значение |
|---|---|
Supply Voltage - Max Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the application's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings, as exceeding this limit may cause permanent failure. | USB 2.0 + PHY (2) |
| Параметр | Значение |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e1 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
ECCN Code Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally. | 3A991.A.2 |
| Параметр | Значение |
|---|---|
Height Seated (Max) Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts. | 1.4mm |
| Параметр | Значение |
|---|---|
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Tin/Silver/Copper (Sn/Ag/Cu) |
uPs/uCs/Peripheral ICs Type Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements. | MICROPROCESSOR, RISC |
Bit Size Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements. | 32 |
Data Bus Width Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance. | 32b |
Boundary Scan Indicates whether the device supports JTAG boundary scan for testing interconnections and internal logic. Useful for board-level testing and debugging. Confirm the boundary scan description in the datasheet to ensure compatibility with your test tools and chain configuration. | YES |
Supply Voltage Limit-Max Specifies the absolute maximum supply voltage that can be applied to the device without causing damage or malfunction. Engineers must verify this limit against the datasheet to ensure safe operating conditions and avoid overvoltage stress in the application. | YES |
Integrated Cache Shows whether the component includes an integrated cache memory to speed up data access for the processor. Compare cache presence and size to assess performance for real-time or high-throughput tasks. Verify details in the datasheet. | YES |
RAM Size Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering. | 64kB |
Peak Reflow Temperature-Max (s) Specifies the maximum duration in seconds that a component can withstand at its peak reflow temperature during soldering. Critical for PCB assembly process control to prevent thermal damage. Verify against the datasheet for your specific soldering profile. | ARM |
Voltage - Supply (Vcc/Vdd) Supply voltage is the DC voltage required to power the device, typically denoted as Vcc for bipolar or Vdd for CMOS circuits. It defines the operating range and logic levels. Designers must ensure the supply is within the specified limits to guarantee proper functionality and avoid damage. | 64kB |
UART Channel Count Number of independent UART interfaces for serial communication. Each channel supports bidirectional data transfer with configurable baud rate. Ensure the count meets your connectivity needs for peripherals, debugging, or inter-processor links. Verify pin availability in the datasheet. | FIXED POINT |
Standby Voltage-Min Specifies the minimum supply voltage required for the device to maintain standby operation. This is crucial for low-power designs where the component must retain state or wake-up capability. Check this value against your power rail to ensure reliable standby performance and avoid unintended shutdown. | Yes |
Manufacturer Identifies the brand or company that fabricated the electronic component. Buyers and engineers use this to verify sourcing, quality standards, and datasheet availability. Always confirm the manufacturer matches the part number and packaging for authenticity. | ARM® Cortex®-A8 |
Number of Ethernet Channels Indicates how many independent Ethernet interfaces the component supports. Compare this with your system's networking requirements to ensure sufficient connectivity. Verify against the datasheet for exact port configurations and supported protocols. | 10/100/1000Mbps (2) |
Ti Ti is a specific parameter value for this component. Engineers compare it to datasheet specifications to ensure the part meets design requirements. Verify Ti against the manufacturer's datasheet for your application. | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART |
| Параметр | Значение |
|---|---|
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tray |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 15mm |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.8mm |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
HTS Code Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping. | 8542.31.00.01 |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | BALL |
Contact Plating Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment. | Copper, Silver, Tin |
Co-Processors/DSP Indicates whether the component integrates a co-processor or digital signal processor for specialized tasks. Compare processing capabilities and supported algorithms when selecting devices for compute-intensive applications. Verify architecture and instruction set against your software requirements. | Multimedia; NEON™ SIMD |
Number of Cores/Bus Width Specifies the number of processor cores and the width of the data bus in bits. This determines the processing capability and data throughput of the component. Compare with your system requirements and verify against the datasheet for compatibility. | 1 Core 32-Bit |
Voltage - I/O I/O interface voltage level for digital circuits, microcontrollers, and logic devices. Specifies the voltage range for input and output pins to ensure compatibility with other components. Check datasheet to match logic levels and avoid damage or unreliable operation. | 1.8V 3.3V |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - Microprocessors |
Number of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 324 |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Microprocessors |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 324-LFBGA |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | Sitara™ |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~90°C TJ |
Operating Supply Voltage Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction. | 1.26V |
Surface Mount Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process. | YES |
Radiation Hardening Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet. | No |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | BOTTOM |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 1.26V |
Number of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 324 |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | AM3357 |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | CAN, I2C, SPI, UART |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 324 |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 720MHz |
Voltage Indicates the maximum voltage the component can withstand or operate at, depending on context. Critical for ensuring the part is not overstressed in your application. Always compare with your circuit's voltage levels and consider transient spikes. | 1.15V |
Address Bus Width Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design. | 28 |
Connector Type Specifies the connector series or family, such as USB, RJ45, or D-Sub. This determines mechanical compatibility, pin layout, and mating standards. Verify against the datasheet to ensure the connector matches your board design and mating counterpart. | LPDDR, DDR2, DDR3, DDR3L |
Data Interface Specifies the communication protocol used by the component for data exchange. Common interfaces include I2C, SPI, UART, CAN, and USB. Verify the supported protocol and voltage levels in the datasheet to ensure compatibility with your system design. | LCD, Touchscreen |
Supplied Contents Indicates the items included in the product package, such as cables, connectors, mounting hardware, or documentation. Verify this list against the datasheet or manual to ensure you have all necessary components for installation and operation. | Cryptography, Random Number Generator |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | AM3357ZCZD72 |
Документы уведомлений
PCN / product notice documents
Публичные PCN / PDN записи сейчас не показаны
Для AM3357ZCZD72 сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
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Частые вопросы
FAQ по товару
Точные ответы для покупателей, которые проверяют ordering code AM3357ZCZD72, упаковку, наличие, datasheet и путь замены.
Что означает AM3357ZCZD72?
AM3357ZCZD72 — это точный ordering code для компонента категории Embedded - Microprocessors от Texas Instruments. Текущий корпус указан как -, а контекст позиции включает IC MPU SITARA 720MHZ 324NFBGA. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code AM3357ZCZD72?
Рассматривайте AM3357ZCZD72 как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус -, документацию производителя Texas Instruments, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется AM3357ZCZD72?
AM3357ZCZD72 сейчас указан с корпусом - от Texas Instruments. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
AM3357ZCZD72 сейчас доступен для заказа?
AM3357ZCZD72 сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (-), указанный склад (122318), доступное количество (41321), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для AM3357ZCZD72?
Для AM3357ZCZD72 сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.





