
AT91SAM9M11-CU Embedded - Microprocessors от Microchip Technology
AT91SAM9M11-CU — это компонент категории Embedded - Microprocessors от Microchip Technology в упаковке упаковке, указанной производителем. Его обычно проверяют для IC MCU 32BIT 64KB ROM 324TFBGA. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
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- Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
- Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
- 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.
Ключевые характеристики
- Номер детали
AT91SAM9M11-CU
- Внутренний код
TCE000085144
- Упаковка
-
- Производитель
- Microchip Technology
Ключевые характеристики
- Серия
SAM9M
- Минимальное количество
1
- Категория
- Integrated Circuits (ICs)
- Подкатегория
- Embedded - Microprocessors
- Описание
IC MCU 32BIT 64KB ROM 324TFBGA
- Основные характеристики
-
Сигналы доверия
Качество и доверие
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для AT91SAM9M11-CU до RFQ, выпуска PO и планирования отгрузки.
- 1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
- 2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
- 3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
- 4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
- Точный MPN подтвержден: AT91SAM9M11-CU
- Корпус для проверки: -
Коммерческие условия
- Live stock и срок поставки подтверждены через RFQ
- Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
- Ship-from location: склад Hong Kong
- Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Технические параметры
Параметры
Сравните сгруппированные параметры AT91SAM9M11-CU от Microchip Technology, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Attribute
Packaging
Tray
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
Minimum Operating Temperature
-40°C
Product Attribute
Published
2009
Product Attribute
Part Status
Obsolete
Product Attribute
Max Operating Temperature
85°C
| Параметр | Значение |
|---|---|
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tray |
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
Minimum Operating Temperature Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs. | -40°C |
Published Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions. | 2009 |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Max Operating Temperature Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage. | 85°C |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~85°C TA |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Microchip Technology |
Minimum Supply Voltage Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges. | 1.65V |
Number of Cores/Bus Width Specifies the number of processor cores and the width of the data bus in bits. This determines the processing capability and data throughput of the component. Compare with your system requirements and verify against the datasheet for compatibility. | 1 Core 32-Bit |
Voltage - I/O I/O interface voltage level for digital circuits, microcontrollers, and logic devices. Specifies the voltage range for input and output pins to ensure compatibility with other components. Check datasheet to match logic levels and avoid damage or unreliable operation. | 1.8V 3.3V |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - Microprocessors |
Number of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 324 |
USB Indicates the USB standard or version supported by the component, such as USB 2.0 or USB 3.2. Determines data transfer rates and power delivery capabilities. Verify compatibility with your host controller and cable. | USB 2.0 (3) |
Memory Type Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed. | FLASH, ROM |
Security Features Hardware-level security features integrated into the component, such as secure boot, cryptographic acceleration, or tamper detection. Compare these capabilities when selecting devices for secure applications. Verify the specific security features and their implementation against the datasheet to ensure they meet your system's requirements. | Cryptography |
Radiation Hardening Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet. | No |
Number of ADC Channels Specifies how many analog input signals the ADC can sample and convert to digital. Compare this when selecting microcontrollers or data acquisition ICs. Verify against the datasheet to ensure enough channels for your application. | 8 |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Height Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations. | 800μm |
Graphics Acceleration Indicates whether the component integrates hardware acceleration for graphics processing. This is critical for embedded systems, SoCs, and display controllers. Verify the supported APIs and performance levels in the datasheet to ensure it meets your application's rendering requirements. | No |
Ethernet Ethernet interface support on microcontrollers, processors, or modules. Specifies the presence and type of Ethernet connectivity (10/100/1000 Mbps, MAC/PHY). Critical for networked applications; verify speed and physical layer requirements in datasheet. | 10/100Mbps |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 324-TFBGA |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 15.05mm |
Number of I/O Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application. | 160 |
RAM Controllers Supported RAM controller types for microprocessors and system-on-chip devices. Indicates which memory standards (DDR, LPDDR, etc.) are integrated. Essential for selecting a processor that matches your memory design and performance requirements. | LPDDR, LPSDR, DDR2, SDR, SRAM |
Additional Interfaces Specifies other communication or control interfaces beyond the primary ones. Helps engineers verify compatibility with system peripherals and protocols. Check the datasheet for exact interface types and electrical characteristics. | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 15.05mm |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 400MHz |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | 1.95V |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | 5A002A1 ATM |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | SAM9M |
Display & Interface Controllers Specifies the type of controller IC used to drive displays or manage communication interfaces. Verify compatibility with your display panel or bus protocol. Compare power consumption, supported resolutions, and interface standards before selecting a part for your design. | LCD, Touchscreen, Video Decoder |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | 2-Wire, EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | AT91SAM9M11 |
Supplier Device Package Indicates the physical package type as designated by the component manufacturer, such as SOIC, QFN, or BGA. This affects PCB footprint, thermal performance, and assembly processes. Confirm compatibility with your board layout and soldering requirements before design finalization. | 324-TFBGA (15x15) |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | AT91SAM9M11-CU |
| Параметр | Значение |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
REACH SVHC Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status. | No SVHC |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.31.0001 |
| Параметр | Значение |
|---|---|
Oscillator Type Specifies the oscillator circuit type used for clock generation in the component. Compare crystal, ceramic, RC, or MEMS types to match frequency stability and startup requirements. Verify against the datasheet for your application. | Internal |
Core Architecture Specifies the processor core design, such as ARM Cortex-M or RISC-V. This determines instruction set compatibility, development tools, and software ecosystem. Verify against the datasheet to ensure firmware and RTOS support match your application requirements. | ARM |
Memory Size Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in. | 64kB |
Peripherals Lists the integrated peripheral components such as ADCs, DACs, PWM controllers, comparators, and communication modules. These features reduce external component count and system cost. Engineers should compare available peripherals to ensure they cover all required functions without additional ICs. | DMA, LCD, POR, PWM, WDT |
Core Processor Identifies the processor architecture and core type, such as ARM Cortex-M or RISC-V. Determines instruction set, toolchain compatibility, and performance characteristics. Check the datasheet for core frequency and features to ensure it meets your processing needs. | ARM926EJ-S |
Watchdog Timer Indicates whether the component includes a watchdog timer and its type. This timer resets the system if software hangs, improving reliability. Verify the timeout period and enable/disable options in the datasheet for your application. | Yes |
Number of PWM Channels Indicates the number of pulse-width modulation output channels available. This is essential for motor control, dimming, or audio applications. Verify the resolution and frequency range of each channel in the datasheet to ensure they meet your control requirements. | 4 |
Number of I2C Channels Specifies how many independent I2C bus interfaces the component provides. Compare this when selecting a device for multi-peripheral systems. Verify against the datasheet to ensure sufficient channels for your design. | 2 |
Number of Ethernet Channels Indicates how many independent Ethernet interfaces the component supports. Compare this with your system's networking requirements to ensure sufficient connectivity. Verify against the datasheet for exact port configurations and supported protocols. | 1 |
Number of SPI Channels Defines the number of independent SPI interface channels available on the device. This is critical for connecting multiple peripherals or sensors. Check the datasheet to see if channels share resources or have dedicated pins, ensuring your design can accommodate all required SPI devices. | 2 |
UART Channel Count Number of independent UART interfaces for serial communication. Each channel supports bidirectional data transfer with configurable baud rate. Ensure the count meets your connectivity needs for peripherals, debugging, or inter-processor links. Verify pin availability in the datasheet. | 1 |
Data Bus Width Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance. | 32b |
Number of Timers/Counters Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features. | 6 |
RAM Size Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering. | 64kB |
Number of Programmable I/O Indicates the total number of input/output pins that can be configured by the user. This is critical for FPGA, CPLD, and microcontroller designs. Verify against the datasheet to ensure sufficient I/O for your application. | 160 |
Speed Specifies the maximum clock frequency or data rate of the component. This is critical for timing and performance. Verify the speed grade in the datasheet to ensure it meets your system's throughput requirements and that signal integrity is maintained at that speed. | 400MHz |
Max Frequency Specifies the highest frequency at which the component can operate reliably. Compare this value with your application's required frequency range. Always verify against the datasheet for derating conditions and test setup. | 400MHz |
Документы уведомлений
PCN / product notice documents
Публичные PCN / PDN записи сейчас не показаны
Для AT91SAM9M11-CU сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
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Частые вопросы
FAQ по товару
Точные ответы для покупателей, которые проверяют ordering code AT91SAM9M11-CU, упаковку, наличие, datasheet и путь замены.
Что означает AT91SAM9M11-CU?
AT91SAM9M11-CU — это точный ordering code для компонента категории Embedded - Microprocessors от Microchip Technology. Текущий корпус указан как -, а контекст позиции включает IC MCU 32BIT 64KB ROM 324TFBGA. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code AT91SAM9M11-CU?
Рассматривайте AT91SAM9M11-CU как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус -, документацию производителя Microchip Technology, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется AT91SAM9M11-CU?
AT91SAM9M11-CU сейчас указан с корпусом - от Microchip Technology. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
AT91SAM9M11-CU сейчас доступен для заказа?
AT91SAM9M11-CU сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (-), указанный склад (186135), доступное количество (83437), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для AT91SAM9M11-CU?
Для AT91SAM9M11-CU сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.





