
OMAP3503DCUS Embedded - Microprocessors от Texas Instruments
OMAP3503DCUS — это компонент категории Embedded - Microprocessors от Texas Instruments в упаковке упаковке, указанной производителем. Его обычно проверяют для IC MPU OMAP-35XX 600MHZ 423FCBGA. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
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- Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
- Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
- 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.
Ключевые характеристики
- Номер детали
OMAP3503DCUS
- Внутренний код
TCE000088581
- Упаковка
-
- Производитель
- Texas Instruments
Ключевые характеристики
- Серия
OMAP-35xx
- Минимальное количество
1
- Категория
- Integrated Circuits (ICs)
- Подкатегория
- Embedded - Microprocessors
- Описание
IC MPU OMAP-35XX 600MHZ 423FCBGA
- Основные характеристики
-
Сигналы доверия
Качество и доверие
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для OMAP3503DCUS до RFQ, выпуска PO и планирования отгрузки.
- 1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
- 2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
- 3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
- 4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
- Точный MPN подтвержден: OMAP3503DCUS
- Корпус для проверки: -
Коммерческие условия
- Live stock и срок поставки подтверждены через RFQ
- Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
- Ship-from location: склад Hong Kong
- Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Обзор продукта
Обзор
Проверьте sourcing context для OMAP3503DCUS от Texas Instruments, включая идентификацию товара, применимость, package notes и закупочные детали.
The NM95MS16 is the smaller of a family of devices designed to provide complete Plug and Play Capability for ISA bus systems.
The NM95MS16 includes the necessary state machine logic to manage the Plug and Play protocol in addition to switches for steering Interrupt and DMA requests. It also features a built-in 2 kbits of serial EEPROM for storing the resource data specified in the Plug and Play Standard. In addition, 4 kbits of EEPROM is available for use by other on-board logic. This device provides a “truly complete” single-chip solution for implementing Plug and Play on ISA-Bus Adapter cards.
The NM95MS16 supports one logical device with a flexible choice of DMA/IRQ selection and I/O Chipselect generation as well as offering 16-bit addressing in Mode 1.NM95MS16 is implemented using Fairchild’s Advanced CMOS process and operates single power supply.
The NM95MS16 is available in a 48-pin TQFP package and 52-pin PLCC package.
Features
• Complete Implementation of Plug and Play Standard — Direct interface to ISA bus
• Two modes of operation — DMA mode — Extended Interrupt mode (Windows® 95 logo compatible)
• 6 or 8 ISA bus interrupt lines and 2 DRQ/DACK lines supported
• On-chip EEPROM for resource request table
• Additional 4 kbits of on-chip EEPROM available for external access
• 24 mA Drivers for Data outputs
• Complete compliance to ISA PnP specification (Ver. 1.0A)
• 48-Pin TQFP, and 52-Pin PLCC Packages
Технические параметры
Параметры
Сравните сгруппированные параметры OMAP3503DCUS от Texas Instruments, включая package, series, key attributes и technical values для engineering и sourcing review.
Parameter
Supply Voltage - Max
USB 1.x (3), USB 2.0 (1)
Product Attribute
Packaging
Tray
Product Attribute
Lead Free
Contains Lead
Product Attribute
Part Status
Obsolete
Product Attribute
Length
16mm
Product Attribute
Categories
Integrated Circuits (ICs)
| Параметр | Значение |
|---|---|
Supply Voltage - Max Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the application's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings, as exceeding this limit may cause permanent failure. | USB 1.x (3), USB 2.0 (1) |
| Параметр | Значение |
|---|---|
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tray |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Contains Lead |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 16mm |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.8mm |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | BALL |
Co-Processors/DSP Indicates whether the component integrates a co-processor or digital signal processor for specialized tasks. Compare processing capabilities and supported algorithms when selecting devices for compute-intensive applications. Verify architecture and instruction set against your software requirements. | Multimedia; NEON™ SIMD |
Number of Cores/Bus Width Specifies the number of processor cores and the width of the data bus in bits. This determines the processing capability and data throughput of the component. Compare with your system requirements and verify against the datasheet for compatibility. | 1 Core 32-Bit |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - Microprocessors |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | 0°C~90°C TJ |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | no |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | BOTTOM |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 1.8V |
Number of Bits Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs. | 32 |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 600MHz |
Number of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 423 |
Number of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 423 |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 423-LFBGA, FCBGA |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 423 |
Memory Type Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed. | L2 Cache, ROM, SRAM |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | OMAP-35xx |
Voltage - I/O I/O interface voltage level for digital circuits, microcontrollers, and logic devices. Specifies the voltage range for input and output pins to ensure compatibility with other components. Check datasheet to match logic levels and avoid damage or unreliable operation. | 1.8V 3.0V |
Voltage Indicates the maximum voltage the component can withstand or operate at, depending on context. Critical for ensuring the part is not overstressed in your application. Always compare with your circuit's voltage levels and consider transient spikes. | 1.35V |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Graphics Processors |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | OMAP3503 |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | 1.35V |
Address Bus Width Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design. | 26 |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | I2C, MMC, SDIO, UART, USB |
Data Interface Specifies the communication protocol used by the component for data exchange. Common interfaces include I2C, SPI, UART, CAN, and USB. Verify the supported protocol and voltage levels in the datasheet to ensure compatibility with your system design. | LCD |
Minimum Supply Voltage Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges. | 985mV |
Connector Type Specifies the connector series or family, such as USB, RJ45, or D-Sub. This determines mechanical compatibility, pin layout, and mating standards. Verify against the datasheet to ensure the connector matches your board design and mating counterpart. | LPDDR |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | OMAP3503DCUS |
| Параметр | Значение |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
REACH SVHC Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status. | No SVHC |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e1 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 4 (72 Hours) |
| Параметр | Значение |
|---|---|
Height Seated (Max) Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts. | 1.4mm |
| Параметр | Значение |
|---|---|
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Tin/Silver/Copper (Sn/Ag/Cu) |
uPs/uCs/Peripheral ICs Type Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements. | DIGITAL SIGNAL PROCESSOR, OTHER |
Data Bus Width Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance. | 32b |
Boundary Scan Indicates whether the device supports JTAG boundary scan for testing interconnections and internal logic. Useful for board-level testing and debugging. Confirm the boundary scan description in the datasheet to ensure compatibility with your test tools and chain configuration. | YES |
Number of Timers Indicates the count of independent timer modules integrated into the microcontroller or IC. Compare this when selecting devices for time-critical tasks like PWM generation, event counting, or real-time scheduling. Verify the exact timer features and resolution in the datasheet. | NO |
Supply Voltage Limit-Max Specifies the absolute maximum supply voltage that can be applied to the device without causing damage or malfunction. Engineers must verify this limit against the datasheet to ensure safe operating conditions and avoid overvoltage stress in the application. | YES |
RAM Size Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering. | 64kB |
Number of Timers/Counters Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features. | 12 |
Peak Reflow Temperature-Max (s) Specifies the maximum duration in seconds that a component can withstand at its peak reflow temperature during soldering. Critical for PCB assembly process control to prevent thermal damage. Verify against the datasheet for your specific soldering profile. | ARM |
Number of I2C Channels Specifies how many independent I2C bus interfaces the component provides. Compare this when selecting a device for multi-peripheral systems. Verify against the datasheet to ensure sufficient channels for your design. | SINGLE |
UART Channel Count Number of independent UART interfaces for serial communication. Each channel supports bidirectional data transfer with configurable baud rate. Ensure the count meets your connectivity needs for peripherals, debugging, or inter-processor links. Verify pin availability in the datasheet. | FLOATING POINT |
Manufacturer Identifies the brand or company that fabricated the electronic component. Buyers and engineers use this to verify sourcing, quality standards, and datasheet availability. Always confirm the manufacturer matches the part number and packaging for authenticity. | ARM® Cortex®-A8 |
Standby Voltage-Min Specifies the minimum supply voltage required for the device to maintain standby operation. This is crucial for low-power designs where the component must retain state or wake-up capability. Check this value against your power rail to ensure reliable standby performance and avoid unintended shutdown. | No |
Voltage - Supply (Vcc/Vdd) Supply voltage is the DC voltage required to power the device, typically denoted as Vcc for bipolar or Vdd for CMOS circuits. It defines the operating range and logic levels. Designers must ensure the supply is within the specified limits to guarantee proper functionality and avoid damage. | 288kB |
Ti Ti is a specific parameter value for this component. Engineers compare it to datasheet specifications to ensure the part meets design requirements. Verify Ti against the manufacturer's datasheet for your application. | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART |
Документы уведомлений
PCN / product notice documents
Публичные PCN / PDN записи сейчас не показаны
Для OMAP3503DCUS сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
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Частые вопросы
FAQ по товару
Точные ответы для покупателей, которые проверяют ordering code OMAP3503DCUS, упаковку, наличие, datasheet и путь замены.
Что означает OMAP3503DCUS?
OMAP3503DCUS — это точный ordering code для компонента категории Embedded - Microprocessors от Texas Instruments. Текущий корпус указан как -, а контекст позиции включает IC MPU OMAP-35XX 600MHZ 423FCBGA. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code OMAP3503DCUS?
Рассматривайте OMAP3503DCUS как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус -, документацию производителя Texas Instruments, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется OMAP3503DCUS?
OMAP3503DCUS сейчас указан с корпусом - от Texas Instruments. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
OMAP3503DCUS сейчас доступен для заказа?
OMAP3503DCUS сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (-), указанный склад (68950), доступное количество (25100), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для OMAP3503DCUS?
Для OMAP3503DCUS сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.





