
LM3S812-EQN50-C2T Embedded - Microcontrollers от Texas Instruments
LM3S812-EQN50-C2T — это компонент категории Embedded - Microcontrollers от Texas Instruments в упаковке LQFP. Его обычно проверяют для IC MCU 32BIT 64KB FLASH 48LQFP. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
Изображения приведены только для справки. Пожалуйста, свяжитесь с нами для получения последних изображений.

- Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
- Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
- 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.
Ключевые характеристики
- Номер детали
LM3S812-EQN50-C2T
- Внутренний код
TCE000095542
- Упаковка
LQFP
- Производитель
- Texas Instruments
Ключевые характеристики
- Серия
Stellaris® ARM® Cortex®-M3S 800
- Минимальное количество
1
- Категория
- Integrated Circuits (ICs)
- Подкатегория
- Embedded - Microcontrollers
- Описание
IC MCU 32BIT 64KB FLASH 48LQFP
- Основные характеристики
-
Сигналы доверия
Качество и доверие
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для LM3S812-EQN50-C2T до RFQ, выпуска PO и планирования отгрузки.
- 1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
- 2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
- 3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
- 4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
- Точный MPN подтвержден: LM3S812-EQN50-C2T
- Корпус для проверки: LQFP
Коммерческие условия
- Live stock и срок поставки подтверждены через RFQ
- Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
- Ship-from location: склад Hong Kong
- Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Обзор продукта
Обзор
Проверьте sourcing context для LM3S812-EQN50-C2T от Texas Instruments, включая идентификацию товара, применимость, package notes и закупочные детали.
LUMINARY MICRO
The Luminary Micro Stellaris® family of microcontrollers—the first ARM® Cortex™-M3 based controllers—brings high-performance 32-bit computing to cost-sensitive embedded microcontroller applications.
These pioneering parts deliver customers 32-bit performance at a cost equivalent to legacy 8- and 16-bit devices, all in a package with a small footprint.
Features
The LM3S817 microcontroller includes the following product features:
• 32-Bit RISC Performance
– 32-bit ARM® Cortex™-M3 v7M architecture optimized for small-footprint embedded applications
– System timer (SysTick) provides a simple, 24-bit clear-on-write, decrementing, wrap-on-zero counter with a flexible control mechanism
– Thumb®-compatible Thumb-2-only instruction set processor core for high code density
– 50-MHz operation
– Hardware-division and single-cycle-multiplication
– Integrated Nested Vectored Interrupt Controller (NVIC) providing deterministic interrupt handling
– 26 interrupts with eight priority levels
– Memory protection unit (MPU) provides a privileged mode for protected operating system functionality
– Unaligned data access, enabling data to be efficiently packed into memory
– Atomic bit manipulation (bit-banding) delivers maximum memory utilization and streamlined peripheral control
• Internal Memory
– 64-KB single-cycle flash
• User-managed flash block protection on a 2-KB block basis
• User-managed flash data programming
• User-defined and managed flash-protection block
– 8-KB single-cycle SRAM
• General-Purpose Timers
– Three timers, each of which can be configured: as a single 32-bit timer, as two 16-bit timers, or to initiate an ADC event
– 32-bit Timer modes:
• Programmable one-shot timer
• Programmable periodic timer
• Real-Time Clock when using an external 32.768-KHz clock as the input
• User-enabled stalling in periodic and one-shot mode when the controller asserts the CPU Halt flag during debug
• ADC event trigger
– 16-bit Timer modes:
• General-purpose timer function with an 8-bit prescaler
• Programmable one-shot timer
• Programmable periodic timer
• User-enabled stalling when the controller asserts CPU Halt flag during debug
• ADC event trigger
– 16-bit Input Capture modes:
• Input edge count capture
• Input edge time capture
– 16-bit PWM mode:
• Simple PWM mode with software-programmable output inversion of the PWM signal
• ARM FiRM-compliant Watchdog Timer
– 32-bit down counter with a programmable load register
– Separate watchdog clock with an enable
– Programmable interrupt generation logic with interrupt masking
– Lock register protection from runaway software
– Reset generation logic with an enable/disable
– User-enabled stalling when the controller asserts the CPU Halt flag during debug
• Synchronous Serial Interface (SSI)
– Master or slave operation
– Programmable clock bit rate and prescale
– Separate transmit and receive FIFOs, 16 bits wide, 8 locations deep
– Programmable interface operation for Freescale SPI, MICROWIRE, or Texas Instruments synchronous serial interfaces
– Programmable data frame size from 4 to 16 bits
– Internal loopback test mode for diagnostic/debug testing
• UART
– Two fully programmable 16C550-type UARTs
– Separate 16x8 transmit (TX) and 16x12 receive (RX) FIFOs to reduce CPU interrupt service loading
– Programmable baud-rate generator with fractional divider
– Programmable FIFO length, including 1-byte deep operation providing conventional double-buffered interface
– FIFO trigger levels of 1/8, 1/4, 1/2, 3/4, and 7/8
– Standard asynchronous communication bits for start, stop, and parity
– False-start-bit detection
– Line-break generation and detection(Continue ...)
Технические параметры
Параметры
Сравните сгруппированные параметры LM3S812-EQN50-C2T от Texas Instruments, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Parameter
Supply Voltage-Max (Vsup)
3.6V
Product Parameter
Oscillator Type
Internal
Product Parameter
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Product Parameter
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Product Parameter
Core Architecture
ARM
Product Parameter
RAM Size
8K x 8
| Параметр | Значение |
|---|---|
Supply Voltage-Max (Vsup) Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings. | 3.6V |
Oscillator Type Specifies the oscillator circuit type used for clock generation in the component. Compare crystal, ceramic, RC, or MEMS types to match frequency stability and startup requirements. Verify against the datasheet for your application. | Internal |
uPs/uCs/Peripheral ICs Type Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements. | MICROCONTROLLER, RISC |
Peripherals Lists the integrated peripheral components such as ADCs, DACs, PWM controllers, comparators, and communication modules. These features reduce external component count and system cost. Engineers should compare available peripherals to ensure they cover all required functions without additional ICs. | Brown-out Detect/Reset, POR, PWM, WDT |
Core Architecture Specifies the processor core design, such as ARM Cortex-M or RISC-V. This determines instruction set compatibility, development tools, and software ecosystem. Verify against the datasheet to ensure firmware and RTOS support match your application requirements. | ARM |
RAM Size Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering. | 8K x 8 |
Core Size Indicates the bit width of the processor core, such as 8-bit, 16-bit, or 32-bit. This determines the maximum data size the CPU can handle in one operation. Compare this with your software requirements and memory addressing needs to ensure compatibility with your application. | 32-Bit |
Core Processor Identifies the processor architecture and core type, such as ARM Cortex-M or RISC-V. Determines instruction set, toolchain compatibility, and performance characteristics. Check the datasheet for core frequency and features to ensure it meets your processing needs. | ARM® Cortex®-M3 |
Memory Size Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in. | 64kB |
Program Memory Size Indicates the amount of non-volatile memory available for storing firmware or program code. This determines the maximum code size that can be executed. Verify that the program memory size is sufficient for your application's firmware, including future updates or additional features. | 64KB 64K x 8 |
Connectivity Indicates the communication interfaces supported by the component, such as UART, SPI, I2C, USB, or Ethernet. Engineers compare this to ensure the device can interface with the rest of the system. Verify the exact interface versions and pin assignments in the datasheet. | I2C, Microwire, SPI, SSI, UART/USART |
Data Converter Specifies whether the component is an analog-to-digital or digital-to-analog converter. This attribute helps identify the conversion direction and architecture. Verify the exact type and resolution in the datasheet to ensure compatibility with your signal chain and system requirements. | A/D 2x10b |
Program Memory Type Technology used for storing firmware, such as Flash, EEPROM, or OTP. Determines reprogrammability, endurance, and write speed. Choose based on update requirements and production volume. Verify the memory size and programming interface in the datasheet. | FLASH |
DMA Channels Number of independent direct memory access channels available on the microcontroller or processor. Compare this when selecting devices for data-intensive applications to ensure sufficient bandwidth for peripherals without CPU load. Verify against the datasheet for exact channel mapping and features. | NO |
Watchdog Timer Indicates whether the component includes a watchdog timer and its type. This timer resets the system if software hangs, improving reliability. Verify the timeout period and enable/disable options in the datasheet for your application. | Yes |
Has ADC Check this attribute to confirm whether the component integrates an analog-to-digital converter. This is critical for microcontrollers, sensors, and mixed-signal ICs where analog inputs need digital processing. Verify against the datasheet to ensure the ADC meets your resolution and sampling requirements. | YES |
PWM Channels Number of independent pulse-width modulation outputs available on the component. Compare this when selecting microcontrollers, motor drivers, or LED controllers to ensure enough channels for your application. Verify against the datasheet for channel mapping and shared timer limitations. | YES |
Number of A/D Converters Indicates how many analog-to-digital converters are integrated in the component. Compare this when selecting devices for multi-channel data acquisition or mixed-signal processing. Verify the exact number and channel configuration in the datasheet. | 1 |
DAC Channels Number of digital-to-analog converter channels integrated in the device. Compare this to the number of analog outputs you need in your system. Verify against the datasheet to ensure the DAC resolution and output drive capability match your application requirements. | NO |
Number of Timers/Counters Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features. | 5 |
Voltage - Supply (Vcc/Vdd) Indicates the recommended supply voltage range for the component. This is critical for proper operation and must be matched to your power rail. Always verify the absolute maximum ratings and recommended operating conditions in the datasheet to avoid damage or malfunction. | 3V~3.6V |
UART Channel Count Number of independent UART interfaces for serial communication. Each channel supports bidirectional data transfer with configurable baud rate. Ensure the count meets your connectivity needs for peripherals, debugging, or inter-processor links. Verify pin availability in the datasheet. | 2 |
Bit Size Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements. | 32 |
Data Bus Width Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance. | 32b |
| Параметр | Значение |
|---|---|
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Contains Lead |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tape & Reel (TR) |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 50MHz |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | GULL WING |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | QUAD |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Microcontrollers |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - Microcontrollers |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~105°C TA |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | 3A991A2 |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | I2C, SPI, UART, USART |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 48-LQFP |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | Stellaris® ARM® Cortex®-M3S 800 |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | LM3S812 |
Radiation Hardening Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet. | No |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Operating Supply Voltage Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction. | 3.3V |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 3.3V |
Number of I/O Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application. | 34 |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 7mm |
Number of Bits Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs. | 10 |
Number of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 48 |
Number of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 48 |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 48 |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | LM3S812-EQN50-C2T |
| Параметр | Значение |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.31.0001 |
Документы уведомлений
PCN / product notice documents
Публичные PCN / PDN записи сейчас не показаны
Для LM3S812-EQN50-C2T сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
Рекомендуемые товары
Посмотрите больше компонентов из той же подкатегории, чтобы сравнить наличие, совместимость и варианты закупки.
Частые вопросы
FAQ по товару
Точные ответы для покупателей, которые проверяют ordering code LM3S812-EQN50-C2T, упаковку, наличие, datasheet и путь замены.
Что означает LM3S812-EQN50-C2T?
LM3S812-EQN50-C2T — это точный ordering code для компонента категории Embedded - Microcontrollers от Texas Instruments. Текущий корпус указан как LQFP, а контекст позиции включает IC MCU 32BIT 64KB FLASH 48LQFP. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code LM3S812-EQN50-C2T?
Рассматривайте LM3S812-EQN50-C2T как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус LQFP, документацию производителя Texas Instruments, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется LM3S812-EQN50-C2T?
LM3S812-EQN50-C2T сейчас указан с корпусом LQFP от Texas Instruments. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
LM3S812-EQN50-C2T сейчас доступен для заказа?
LM3S812-EQN50-C2T сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (LQFP), указанный склад (56113), доступное количество (35564), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для LM3S812-EQN50-C2T?
Для LM3S812-EQN50-C2T сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.





