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MC100EP11DR2 Clock/Timing - Clock Buffers, Drivers от ON Semiconductor

MC100EP11DR2 — это компонент категории Clock/Timing - Clock Buffers, Drivers от ON Semiconductor в упаковке 8-SOIC. Его обычно проверяют для IC CLOCK BUFFER 1:2 3GHZ 8-SOIC. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

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MC100EP11DR2 Clock/Timing - Clock Buffers, Drivers от ON Semiconductor | TrustCompo
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  • Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
  • Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
  • 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.

Ключевые характеристики

Номер детали

MC100EP11DR2

Внутренний код

TCE000120160

Упаковка

8-SOIC

Производитель
ON Semiconductor

Ключевые характеристики

Серия

-

Минимальное количество

1

Категория
Integrated Circuits (ICs)
Описание

IC CLOCK BUFFER 1:2 3GHZ 8-SOIC

Основные характеристики

-

Сигналы доверия

Качество и доверие

Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.

4 сертификата
  • ISO 9001

    Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.

  • AS9120B

    Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.

  • ISO 14001

    Экологическая дисциплина в операционных и складских процессах.

  • ESD Control

    Стандарты защиты от электростатического разряда для чувствительных компонентов.

RFQ checklist

Процесс заказа

Подтвердите ключевые данные закупки для MC100EP11DR2 до RFQ, выпуска PO и планирования отгрузки.

  1. 1

    Подтвердить MPN

    Укажите точный part number, производителя, package и approval constraints в RFQ.

  2. 2

    Проверить склад и цену

    Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.

  3. 3

    Согласовать документы

    Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.

  4. 4

    Организовать отгрузку

    Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.

Перед выпуском PO

Проверка детали

  • Точный MPN подтвержден: MC100EP11DR2
  • Корпус для проверки: 8-SOIC

Коммерческие условия

  • Live stock и срок поставки подтверждены через RFQ
  • Финальная цена и налоговые условия подтверждены до выпуска PO

Отгрузка и документы

  • Ship-from location: склад Hong Kong
  • Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя

Технические параметры

Параметры

Сравните сгруппированные параметры MC100EP11DR2 от ON Semiconductor, включая package, series, key attributes и technical values для engineering и sourcing review.

  • Product Attribute

    Lead Free

    Contains Lead

  • Product Attribute

    Mounting Type

    Surface Mount

  • Product Attribute

    Published

    2006

  • Product Attribute

    Minimum Operating Temperature

    -40°C

  • Product Attribute

    Packaging

    Tape & Reel (TR)

  • Product Attribute

    Part Status

    Obsolete

MC100EP11DR2 Product Attribute
ПараметрЗначение
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Contains Lead
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2006
Minimum Operating Temperature

Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs.

-40°C
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tape & Reel (TR)
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Obsolete
Max Operating Temperature

Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage.

85°C
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

GULL WING
Qualification Status

Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements.

Not Qualified
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

3.9mm
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

8-SOIC (0.154, 3.90mm Width)
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

ON Semiconductor
Temperature Grade

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

INDUSTRIAL
Number of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Surface Mount

Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.

YES
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

no
Reflow Temperature-Max (s)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

30
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

1.27mm
Number of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

8
Number of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

8
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

8
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

4.9mm
Max Supply Voltage

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

5.5V
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

3.3V
Operating Temperature (Max)

Specifies the highest ambient temperature at which the component can operate reliably. Check this limit against your application's thermal environment to prevent overheating and ensure long-term stability. Always verify with the datasheet for derating curves.

85°C
Operating Temperature (Min)

Specifies the lowest ambient temperature at which the component remains fully functional. Check this limit against your application's environmental extremes to ensure reliable operation. Exceeding this minimum may cause performance degradation or failure, so always verify with the datasheet.

-40°C
Minimum Supply Voltage

Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.

3V
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

240
Number of Outputs

Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.

4
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

ECL
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

100EP
Ratio - Input/Output

Specifies the proportional relationship between input and output parameters, such as voltage or current. Engineers use this ratio to verify transformer, converter, or amplifier performance. Always compare it with the datasheet's electrical characteristics to ensure the component meets your circuit's requirements.

1:2
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Clock Drivers
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Clock/Timing - Clock Buffers, Drivers
Number of True Outputs

Indicates how many outputs deliver the non-inverted logic state. Compare this with the number of complementary or inverted outputs when selecting logic devices, and verify against the datasheet to ensure the output configuration matches your circuit requirements.

2
Input Conditioning

Specifies the type of signal conditioning applied to the input, such as filtering, amplification, or isolation. This affects signal integrity and compatibility with your system. Verify the conditioning method against the datasheet to ensure proper interface with your application.

DIFFERENTIAL
Type

Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches.

Fanout Buffer (Distribution)
Additional Feature

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V
Family

Indicates the product family or series to which the component belongs. Helps identify related parts with similar characteristics. Verify the family name against the manufacturer's datasheet to ensure compatibility and correct sourcing.

LOW SKEW CLOCK DRIVER
Manufacturer's Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

MC100EP11DR2
Propagation Delay at Nominal Supply

Time from input transition to output response under nominal supply voltage. Compare across devices to gauge speed for timing-critical logic. Verify against datasheet conditions, including load capacitance and temperature, as these affect measured delay.

0.32 ns
Power Rating

Specifies the maximum power the component can safely dissipate under defined operating conditions. Compare this value with your circuit's power requirements to prevent overheating and ensure reliable operation. Always verify against the datasheet for derating curves and ambient temperature limits.

10EP
MC100EP11DR2 Product Parameter
ПараметрЗначение
Supply Voltage-Max (Vsup)

Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.

5.5V
Time at Peak Reflow Temperature (Max)

Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly.

30
Supply Voltage-Min (Vsup)

Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.

3V
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

TIN LEAD
Propagation Delay

Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.

270 ps
Min Input Voltage (DC)

Specifies the lowest DC voltage at which the device reliably operates. Compare this with your supply rail and tolerances to ensure proper startup and functionality. Always verify against the datasheet's operating conditions.

0.3 ns
Same Edge Skew-Max (tskwd)

Maximum time difference between the same edges of different output signals in a clock or timing device. Critical for high-speed digital systems where synchronized outputs are required. Check datasheet for guaranteed limits under specified conditions.

0.12 ns
MC100EP11DR2 Export Classifications & Environmental
ПараметрЗначение
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

RoHS Compliant
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e0
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

3 (168 Hours)
JESD-30 Code

JEDEC standard code that defines the package outline and dimensions. Use it to verify physical compatibility and footprint before PCB design. Compare with the datasheet to ensure the component meets your assembly and manufacturing requirements.

R-PDSO-G8
MC100EP11DR2 Package Parameter
ПараметрЗначение
Height Seated (Max)

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.

1.75mm

Документы уведомлений

PCN / product notice documents

0 документов

Публичные PCN / PDN записи сейчас не показаны

Для MC100EP11DR2 сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.

Частые вопросы

FAQ по товару

Точные ответы для покупателей, которые проверяют ordering code MC100EP11DR2, упаковку, наличие, datasheet и путь замены.

Что означает MC100EP11DR2?

MC100EP11DR2 — это точный ordering code для компонента категории Clock/Timing - Clock Buffers, Drivers от ON Semiconductor. Текущий корпус указан как 8-SOIC, а контекст позиции включает IC CLOCK BUFFER 1:2 3GHZ 8-SOIC. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.

Как покупателям проверить ordering code MC100EP11DR2?

Рассматривайте MC100EP11DR2 как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус 8-SOIC, документацию производителя ON Semiconductor, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.

В каком корпусе поставляется MC100EP11DR2?

MC100EP11DR2 сейчас указан с корпусом 8-SOIC от ON Semiconductor. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.

MC100EP11DR2 сейчас доступен для заказа?

MC100EP11DR2 сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (8-SOIC), указанный склад (43025), доступное количество (43025), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.

Где сравнить альтернативы для MC100EP11DR2?

Для MC100EP11DR2 сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.