
EFR32MG13P632F512GM32-DR RF Transceiver ICs от Silicon Labs
EFR32MG13P632F512GM32-DR — это компонент категории RF Transceiver ICs от Silicon Labs в упаковке QFN. Его обычно проверяют для MIGHTY GECKO QFN32 2.4 GHZ 512KB. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
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- Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
- Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
- 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.
Ключевые характеристики
- Номер детали
EFR32MG13P632F512GM32-DR
- Внутренний код
TCE000120550
- Упаковка
QFN
- Производитель
- Silicon Labs
Ключевые характеристики
- Серия
-
- Минимальное количество
1
- Категория
- RF/IF and RFID
- Подкатегория
- RF Transceiver ICs
- Описание
MIGHTY GECKO QFN32 2.4 GHZ 512KB
- Основные характеристики
-
Сигналы доверия
Качество и доверие
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для EFR32MG13P632F512GM32-DR до RFQ, выпуска PO и планирования отгрузки.
- 1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
- 2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
- 3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
- 4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
- Точный MPN подтвержден: EFR32MG13P632F512GM32-DR
- Корпус для проверки: QFN
Коммерческие условия
- Live stock и срок поставки подтверждены через RFQ
- Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
- Ship-from location: склад Hong Kong
- Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Технические параметры
Параметры
Сравните сгруппированные параметры EFR32MG13P632F512GM32-DR от Silicon Labs, включая package, series, key attributes и technical values для engineering и sourcing review.
Package Parameter
GPIO
16
Export Classifications & Environmental
RoHS Status
ROHS3 Compliant
Export Classifications & Environmental
HTSUS
8542.39.0001
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Product Parameter
Supply Voltage
1.8V~3.8V
Product Parameter
Memory Size
512kB Flash 64kB RAM
| Параметр | Значение |
|---|---|
GPIO Number of general-purpose input/output pins available on the component. Compare this count to your design's requirements for interfacing with peripherals, sensors, or LEDs. Verify the exact pin functions and electrical characteristics in the datasheet. | 16 |
| Параметр | Значение |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.39.0001 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
| Параметр | Значение |
|---|---|
Supply Voltage Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage. | 1.8V~3.8V |
Memory Size Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in. | 512kB Flash 64kB RAM |
| Параметр | Значение |
|---|---|
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Active |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Factory Lead Time Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions. | 8 Weeks |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tape & Reel (TR) |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~85°C TA |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 32-VFQFN Exposed Pad |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | 5A992C |
RF Family/Standard Select the RF standard or family that the component complies with, such as Bluetooth, Wi-Fi, Zigbee, or proprietary protocols. This defines compatibility with existing wireless infrastructure and regulatory certifications. Verify against the datasheet to ensure the device meets your target network requirements. | 802.15.4, Bluetooth |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | RF Transceiver ICs |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | RF/IF and RFID |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Silicon Labs |
Type Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches. | TxRx + MCU |
Power - Output Output power rating of the component. This is critical for amplifiers, transmitters, and power supplies. Ensure the component can deliver the required power to your load without exceeding its ratings. Check the datasheet for conditions and tolerances. | 10dBm |
Data Rate (Max) Maximum data transfer rate supported. This is crucial for high-speed communication interfaces. Ensure the component can handle your required throughput with margin. Compare with the datasheet's specifications to avoid bottlenecks in your data path. | 2Mbps |
Current - Transmitting Indicates the current consumption or output current during transmission mode. Essential for power budget calculations and thermal management in wireless modules. Check this value against your supply capability and compare with receiving current to estimate battery life. | 8.5mA~134.3mA |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | Mighty Gecko |
Protocol Communication protocol supported by the device, such as I2C, SPI, UART, CAN, or USB. This determines how the component interfaces with microcontrollers or other system devices. Ensure compatibility with your system's bus architecture and check protocol version and features in the datasheet. | Bluetooth v5.0, Thread, Zigbee® |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 2.4GHz~2.4835GHz |
Serial Interfaces List of supported serial communication interfaces, such as SPI, I2C, UART, or CAN. This determines how the component communicates with your system. Verify that the required interfaces are available and compatible with your microcontroller or processor. | I2C, I2S, SPI, IrDA, UART, USART |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | EFR32MG13P632F512GM32-DR |
Current - Receiving Specify the current consumption during receiving operation. This value is critical for battery life estimation in portable devices. Compare it with the datasheet's typical and maximum ratings to ensure your power supply can handle the load under worst-case conditions. | 8.4mA~14mA |
Sensitivity Specifies the minimum input signal level required for the component to operate correctly. Compare sensitivity values when selecting sensors, microphones, or receivers for low-signal applications. Always verify against the datasheet for exact test conditions and frequency response. | -103.3dBm |
Modulation Specifies the modulation scheme used by the component for signal encoding. Compare modulation types to ensure compatibility with your communication protocol and system bandwidth. Verify the supported modulation formats in the datasheet before design-in. | 2-FSK, 4-FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, MSK, OOK, O-QPSK |
Документы уведомлений
PCN / product notice documents
Публичные PCN / PDN записи сейчас не показаны
Для EFR32MG13P632F512GM32-DR сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
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Частые вопросы
FAQ по товару
Точные ответы для покупателей, которые проверяют ordering code EFR32MG13P632F512GM32-DR, упаковку, наличие, datasheet и путь замены.
Что означает EFR32MG13P632F512GM32-DR?
EFR32MG13P632F512GM32-DR — это точный ordering code для компонента категории RF Transceiver ICs от Silicon Labs. Текущий корпус указан как QFN, а контекст позиции включает MIGHTY GECKO QFN32 2.4 GHZ 512KB. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code EFR32MG13P632F512GM32-DR?
Рассматривайте EFR32MG13P632F512GM32-DR как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус QFN, документацию производителя Silicon Labs, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется EFR32MG13P632F512GM32-DR?
EFR32MG13P632F512GM32-DR сейчас указан с корпусом QFN от Silicon Labs. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
EFR32MG13P632F512GM32-DR есть в наличии у TrustCompo?
На этой странице сейчас показано 2 публичные складские записи для EFR32MG13P632F512GM32-DR с указанным количеством 10,878 шт. Перед заказом подтвердите корпус (QFN), нужное количество, live availability, срок поставки, финальную цену, date code, MOQ, упаковку и документы RFQ.
Где сравнить альтернативы для EFR32MG13P632F512GM32-DR?
Для EFR32MG13P632F512GM32-DR сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.
