
21143TD Interface - Controllers от Intel
21143TD — это компонент категории Interface - Controllers от Intel в упаковке QFP. Его обычно проверяют для Interface - Controllers. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
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- Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
- Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
- 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.
Ключевые характеристики
- Номер детали
21143TD
- Внутренний код
TCE000120649
- Упаковка
QFP
- Производитель
- Intel
Ключевые характеристики
- Серия
-
- Минимальное количество
1
- Категория
- Integrated Circuits (ICs)
- Подкатегория
- Interface - Controllers
- Описание
-
- Основные характеристики
-
Сигналы доверия
Качество и доверие
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для 21143TD до RFQ, выпуска PO и планирования отгрузки.
- 1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
- 2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
- 3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
- 4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
- Точный MPN подтвержден: 21143TD
- Корпус для проверки: QFP
Коммерческие условия
- Live stock и срок поставки подтверждены через RFQ
- Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
- Ship-from location: склад Hong Kong
- Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Технические параметры
Параметры
Сравните сгруппированные параметры 21143TD от Intel, включая package, series, key attributes и technical values для engineering и sourcing review.
Export Classifications & Environmental
JESD-609 Code
e0
Export Classifications & Environmental
RoHS Status
Non-RoHS Compliant
Export Classifications & Environmental
JESD-30 Code
S-PQFP-G144
Product Attribute
Categories
Integrated Circuits (ICs)
Product Attribute
Terminal Form
GULL WING
Product Attribute
Technology
CMOS
| Параметр | Значение |
|---|---|
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e0 |
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | Non-RoHS Compliant |
JESD-30 Code JEDEC standard code that defines the package outline and dimensions. Use it to verify physical compatibility and footprint before PCB design. Compare with the datasheet to ensure the component meets your assembly and manufacturing requirements. | S-PQFP-G144 |
| Параметр | Значение |
|---|---|
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | GULL WING |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 20mm |
Qualification Status Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements. | Not Qualified |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | QUAD |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.5mm |
HTS Code Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping. | 8542.31.00.01 |
Operating Temperature (Max) Specifies the highest ambient temperature at which the component can operate reliably. Check this limit against your application's thermal environment to prevent overheating and ensure long-term stability. Always verify with the datasheet for derating curves. | 70°C |
Surface Mount Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process. | YES |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 20mm |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | NOT SPECIFIED |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 3.3V |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 144 |
Temperature Grade Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements. | COMMERCIAL |
Address Bus Width Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design. | 32 |
External Data Bus Width Number of parallel data lines on the external bus. Determines data transfer rate and interface complexity. Important for microcontrollers, DSPs, and memory devices. Verify with datasheet to match your system's bus architecture and timing requirements. | 32 |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Serial IO/Communication Controllers |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Intel |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Interface - Controllers |
Data Transfer Rate-Max Maximum data transfer rate specifies the highest speed at which a component or interface can transmit data, typically in bits per second. This is critical for communication interfaces and storage devices. Ensure your system's required throughput does not exceed this rating. | 12.5 MBps |
Data Encoding/Decoding Method Specifies the protocol or algorithm used to convert data between its raw form and a transmittable format. This attribute is critical for ensuring compatibility with your system's communication interface. Verify the method against the datasheet to avoid data corruption or interoperability issues. | BIPH-LEVEL(MANCHESTER) |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | 21143TD |
Clock Frequency Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values. | 33.33MHz |
Bus Compatibility Indicates the bus standards or protocols the component supports, such as I2C, SPI, UART, or CAN. Check this attribute to ensure the part interfaces correctly with your system's communication architecture. Verify against the datasheet for protocol versions and electrical compatibility. | PCI; CARDBUS |
Thickness Thickness of the component, a critical dimension for PCB clearance, enclosure fit, and thermal performance. This measurement is especially important for capacitors, inductors, and connectors. Ensure the thickness meets your design constraints and does not interfere with adjacent components. Check the datasheet for tolerance and recommended mounting height. | 144 |
Seated Height (Max) Maximum height of the component above the mounting surface when installed. Critical for mechanical fit in enclosures or when spacing is tight. Verify this dimension against your PCB clearance and assembly tolerances to avoid interference. | 1.6mm |
| Параметр | Значение |
|---|---|
Supply Voltage-Max (Vsup) Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings. | 3.6V |
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Tin/Lead (Sn/Pb) |
Supply Voltage-Min (Vsup) Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures. | 3V |
Number of Serial I/Os Indicates how many serial input/output interfaces the component provides. Compare this when selecting microcontrollers, FPGAs, or interface ICs to ensure enough UART, SPI, or I2C channels for your design. Verify against the datasheet pinout and peripheral list. | 2 |
Time at Peak Reflow Temperature (Max) Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly. | NOT SPECIFIED |
Boundary Scan Indicates whether the device supports JTAG boundary scan for testing interconnections and internal logic. Useful for board-level testing and debugging. Confirm the boundary scan description in the datasheet to ensure compatibility with your test tools and chain configuration. | YES |
Supply Current-Max Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load. | 230mA |
Supply Voltage Limit-Max Specifies the absolute maximum supply voltage that can be applied to the device without causing damage or malfunction. Engineers must verify this limit against the datasheet to ensure safe operating conditions and avoid overvoltage stress in the application. | YES |
Power Supplies Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues. | 3.33.3/5V |
uPs/uCs/Peripheral ICs Type Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements. | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Документы уведомлений
PCN / product notice documents
Публичные PCN / PDN записи сейчас не показаны
Для 21143TD сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
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Частые вопросы
FAQ по товару
Точные ответы для покупателей, которые проверяют ordering code 21143TD, упаковку, наличие, datasheet и путь замены.
Что означает 21143TD?
21143TD — это точный ordering code для компонента категории Interface - Controllers от Intel. Текущий корпус указан как QFP, а контекст позиции включает -. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code 21143TD?
Рассматривайте 21143TD как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус QFP, документацию производителя Intel, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется 21143TD?
21143TD сейчас указан с корпусом QFP от Intel. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
21143TD сейчас доступен для заказа?
21143TD сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (QFP), указанный склад (90323), доступное количество (72203), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для 21143TD?
Для 21143TD сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.





