EPM7128AETC144-7 Встраиваемые ПЛИС (Программируемые логические интегральные схемы) от Intel

General DescriptionMAX 7000A (including MAX 7000AE) devices are high-density, highperformance devices based on Altera’s second-generation MAX architecture. Fabricated with advanced CMOS technology, the EEPROMbased MAX 7000A devices operate with a 3.3-V supply voltage and provide 600 to 10,000 usable gates, ISP, pin-to-pin delays as fast as 4.5 ns, and counter speeds of up to 227.3 MHz. MAX 7000A devices in the -4, -5, -6, -7, and some -10 speed grades are compatible with the timing requirements for 33 MHz operation of the PCI Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2. See Table 2.
Features...
• High-performance 3.3-V EEPROM-based programmable logic devices (PLDs) built on second-generation Multiple Array MatriX (MAX®) architecture (see Table 1)
• 3.3-V in-system programmability (ISP) through the built-in IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface with advanced pin-locking capability
– MAX 7000AE device in-system programmability (ISP) circuitry compliant with IEEE Std. 1532
– EPM7128A and EPM7256A device ISP circuitry compatible with IEEE Std. 1532
• Built-in boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1
• Supports JEDEC Jam Standard Test and Programming Language (STAPL) JESD-71
• Enhanced ISP features
– Enhanced ISP algorithm for faster programming (excluding EPM7128A and EPM7256A devices)
– ISP_Done bit to ensure complete programming (excluding EPM7128A and EPM7256A devices)
– Pull-up resistor on I/O pins during in-system programming
• Pin-compatible with the popular 5.0-V MAX 7000S devices
• High-density PLDs ranging from 600 to 10,000 usable gates
• Extended temperature range
• 4.5-ns pin-to-pin logic delays with counter frequencies of up to227.3 MHz
• MultiVoltTM I/O interface enables device core to run at 3.3 V, while I/O pins are compatible with 5.0-V, 3.3-V, and 2.5-V logic levels
• Pin counts ranging from 44 to 256 in a variety of thin quad flat pack (TQFP), plastic quad flat pack (PQFP), ball-grid array (BGA), spacesaving FineLine BGATM, and plastic J-lead chip carrier (PLCC) packages
• Supports hot-socketing in MAX 7000AE devices
• Programmable interconnect array (PIA) continuous routing structure for fast, predictable performance
• PCI-compatible
• Bus-friendly architecture, including programmable slew-rate control
• Open-drain output option
• Programmable macrocell registers with individual clear, preset, clock, and clock enable controls
• Programmable power-up states for macrocell registers in MAX 7000AE devices
• Programmable power-saving mode for 50% or greater power reduction in each macrocell
• Configurable expander product-term distribution, allowing up to 32 product terms per macrocell
• Programmable security bit for protection of proprietary designs
• 6 to 10 pin- or logic-driven output enable signals
• Two global clock signals with optional inversion
• Enhanced interconnect resources for improved routability
• Fast input setup times provided by a dedicated path from I/O pin to macrocell registers
• Programmable output slew-rate control
• Programmable ground pins