DSPIC33FJ64MC802-I/SP Embedded - Microcontrollers от Microchip Technology

Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance.

Specifies the oscillator circuit type used for clock generation in the component. Compare crystal, ceramic, RC, or MEMS types to match frequency stability and startup requirements. Verify against the datasheet for your application.

Indicates the bit width of the processor core, such as 8-bit, 16-bit, or 32-bit. This determines the maximum data size the CPU can handle in one operation. Compare this with your software requirements and memory addressing needs to ensure compatibility with your application.

Specifies the data format or package type of the component. This helps identify the physical or logical configuration, such as tape and reel, tray, or specific file format. Verify against the datasheet to ensure compatibility with your assembly process.

Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements.

Specifies whether the component is an analog-to-digital or digital-to-analog converter. This attribute helps identify the conversion direction and architecture. Verify the exact type and resolution in the datasheet to ensure compatibility with your signal chain and system requirements.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Identifies the processor architecture and core type, such as ARM Cortex-M or RISC-V. Determines instruction set, toolchain compatibility, and performance characteristics. Check the datasheet for core frequency and features to ensure it meets your processing needs.

Lists the integrated peripheral components such as ADCs, DACs, PWM controllers, comparators, and communication modules. These features reduce external component count and system cost. Engineers should compare available peripherals to ensure they cover all required functions without additional ICs.

Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering.

Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in.

Indicates the amount of non-volatile memory available for storing firmware or program code. This determines the maximum code size that can be executed. Verify that the program memory size is sufficient for your application's firmware, including future updates or additional features.

Indicates the communication interfaces supported by the component, such as UART, SPI, I2C, USB, or Ethernet. Engineers compare this to ensure the device can interface with the rest of the system. Verify the exact interface versions and pin assignments in the datasheet.

Total storage capacity of the memory chip, typically expressed in bits or bytes. Compare densities to match your application's code and data requirements. Verify against the datasheet to ensure sufficient headroom for firmware and runtime variables.

Technology used for storing firmware, such as Flash, EEPROM, or OTP. Determines reprogrammability, endurance, and write speed. Choose based on update requirements and production volume. Verify the memory size and programming interface in the datasheet.

Indicates whether the component includes a watchdog timer and its type. This timer resets the system if software hangs, improving reliability. Verify the timeout period and enable/disable options in the datasheet for your application.

Check this attribute to confirm whether the component integrates an analog-to-digital converter. This is critical for microcontrollers, sensors, and mixed-signal ICs where analog inputs need digital processing. Verify against the datasheet to ensure the ADC meets your resolution and sampling requirements.

Shows whether the component includes an integrated cache memory to speed up data access for the processor. Compare cache presence and size to assess performance for real-time or high-throughput tasks. Verify details in the datasheet.

Number of independent pulse-width modulation outputs available on the component. Compare this when selecting microcontrollers, motor drivers, or LED controllers to ensure enough channels for your application. Verify against the datasheet for channel mapping and shared timer limitations.

Indicates how many analog-to-digital converters are integrated in the component. Compare this when selecting devices for multi-channel data acquisition or mixed-signal processing. Verify the exact number and channel configuration in the datasheet.

Specifies the available low power modes for the component, such as sleep, standby, or shutdown. Compare modes to match your system's power budget and wake-up requirements. Verify supported modes and current consumption in the datasheet.

Defines the number of external interrupt input pins available on the microcontroller or processor. This is important for real-time event handling. Check the datasheet for interrupt priority levels and edge/level sensitivity options to ensure they match your application's needs.

Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements.

Indicates how many serial input/output interfaces the component provides. Compare this when selecting microcontrollers, FPGAs, or interface ICs to ensure enough UART, SPI, or I2C channels for your design. Verify against the datasheet pinout and peripheral list.

Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features.

Number of independent direct memory access channels available on the microcontroller or processor. Compare this when selecting devices for data-intensive applications to ensure sufficient bandwidth for peripherals without CPU load. Verify against the datasheet for exact channel mapping and features.

Defines the number of independent SPI interface channels available on the device. This is critical for connecting multiple peripherals or sensors. Check the datasheet to see if channels share resources or have dedicated pins, ensuring your design can accommodate all required SPI devices.

Indicates the recommended supply voltage range for the component. This is critical for proper operation and must be matched to your power rail. Always verify the absolute maximum ratings and recommended operating conditions in the datasheet to avoid damage or malfunction.

Indicates whether the device supports JTAG boundary scan for testing interconnections and internal logic. Useful for board-level testing and debugging. Confirm the boundary scan description in the datasheet to ensure compatibility with your test tools and chain configuration.

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

Specifies how many analog input signals the ADC can sample and convert to digital. Compare this when selecting microcontrollers or data acquisition ICs. Verify against the datasheet to ensure enough channels for your application.

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.