IRGS6B60KDPBF Transistors - IGBTs - Single от Infineon Technologies

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

JEDEC standard code that defines the package outline and dimensions. Use it to verify physical compatibility and footprint before PCB design. Compare with the datasheet to ensure the component meets your assembly and manufacturing requirements.

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

Specifies the maximum continuous current the component can safely carry under specified conditions. Compare this value with your circuit's expected load to ensure reliable operation. Always verify against the datasheet for temperature derating and mounting considerations.

Describes the internal arrangement of components, such as resistor networks or switch contacts. This affects the circuit topology and pinout. Engineers must verify this configuration against the datasheet to ensure correct integration into the PCB layout and proper functionality.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Specifies the semiconductor material used in the transistor's active region. This affects electrical characteristics such as switching speed and voltage rating. Verify the material against the datasheet when selecting for high-frequency or high-power applications.

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

Specifies the maximum DC voltage the component can safely handle under rated conditions. Engineers compare this to the circuit's operating voltage to ensure adequate margin. Always verify against the datasheet's derating curves for temperature and reliability.

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

Indicates how the component's case or package is electrically connected, such as to ground, a supply rail, or left floating. This affects thermal management, shielding, and circuit isolation. Always confirm with the datasheet to ensure proper PCB layout and avoid unintended shorts or noise coupling.

Maximum allowable voltage between gate and emitter terminals. Exceeding this rating can damage the device. Ensure your gate driver output stays within this limit, including overshoot and ringing. Check datasheet for absolute maximum ratings.

Specifies the intended circuit role, such as switching, amplification, or RF. Engineers compare this to ensure the transistor's characteristics match the design's requirements. Verify against the datasheet's application section before selecting.

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Indicates whether the semiconductor is N-channel, P-channel, NPN, PNP, or other polarity type. This determines the required gate or base drive voltage and circuit configuration. Verify against the datasheet to ensure compatibility with your application's power supply and control logic.

Specifies the maximum voltage that can be applied between collector and emitter without causing breakdown. Critical for power transistors and switching circuits. Verify against datasheet to ensure safe operating margin under worst-case conditions.

Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions.

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

Voltage drop across collector-emitter when the device is fully on. Determines conduction losses and efficiency. Lower saturation voltage means less power dissipation. Verify against datasheet for collector current and temperature.

Maximum allowable voltage between collector and emitter with the base terminal open. Exceeding this rating can cause breakdown or permanent damage. Verify against the datasheet for safe operating conditions in your circuit design.

Maximum continuous collector current that the transistor can handle without damage. Compare this rating with your circuit's peak current demand. Always verify against the datasheet for thermal limits and derating conditions.

Total charge required to drive the gate to a specified voltage. Determines gate drive power and switching speed. Lower gate charge enables faster switching and higher efficiency. Check datasheet for test conditions and gate voltage.

Maximum gate-emitter voltage at which the device begins to conduct. Important for determining drive voltage requirements and ensuring reliable turn-on. Compare with your gate driver output to avoid insufficient drive or accidental turn-on.

Maximum collector-emitter saturation voltage when the IGBT is fully on, specified at a given gate-emitter voltage and collector current. Compare this value to assess conduction losses and thermal performance. Verify against the datasheet for your operating conditions.

Maximum time required for the output signal to transition from high to low level. Critical for high-speed switching circuits to ensure signal integrity and minimize timing errors. Verify against datasheet for load conditions and temperature.

Nominal time required for the device to turn off after the control signal is removed. Affects switching losses and dead-time requirements in bridge circuits. Verify against datasheet for load and temperature conditions.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Time required for the device to transition from off state to fully on state. This parameter is critical for timing analysis in power supplies, drivers, and switching circuits. Verify this value against your system's timing budget and switching frequency requirements.

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

Delay time from the input signal edge to the beginning of output transition, measured at 25°C. Critical for timing analysis in switching circuits. Verify against datasheet for load conditions and supply voltage.

Specifies the environmental and electrical conditions under which the component's parameters are measured. Essential for comparing datasheet values across different manufacturers. Always check that test conditions match your application's operating environment.

Energy dissipated during each switching transition (turn-on and turn-off). Directly impacts efficiency and thermal management in power converters. Lower switching energy reduces losses and heat. Verify against datasheet for test conditions and load.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.

Specifies the configuration of the input signal path, such as single-ended or differential. This affects noise immunity and interface compatibility. Verify the input type against your signal source and the datasheet to ensure proper connection and performance.

Time required for a signal to transition from a low to a high level, typically measured between 10% and 90% of the amplitude. Important for digital interfaces, switching regulators, and pulse circuits. Check the datasheet for test conditions and load capacitance.

Specifies the internal structure or technology variant of the insulated-gate bipolar transistor, such as trench field-stop or planar. Affects switching losses, saturation voltage, and ruggedness. Confirm the type matches your application's voltage and frequency demands.

Time for a diode to transition from conducting to blocking state. Critical for switching losses in power circuits. Compare values when designing high-frequency converters or rectifiers. Verify against datasheet under specified test conditions.

Maximum allowable collector current during short pulses, typically higher than continuous rating. Important for applications with transient loads or inrush currents. Check pulse duration and duty cycle in the datasheet to avoid exceeding safe operating area.