BSS138N Transistors - FETs, MOSFETs - Single от Infineon Technologies

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Classification of field-effect transistor based on channel polarity and mode, such as N-channel or P-channel, enhancement or depletion. This determines the required gate drive polarity and circuit topology. Engineers select the appropriate type for switching or amplification applications. Always confirm the exact type from the datasheet before design.

Gate-source voltage is the potential difference between the gate and source terminals of a MOSFET or IGBT. It determines the device's on-state and threshold behavior. Engineers must verify this parameter against the datasheet to ensure proper gate drive levels and avoid breakdown.

Specifies the maximum continuous drain current the MOSFET can handle without exceeding thermal limits. Compare this rating with your circuit's peak and average current demands. Always verify against the datasheet's thermal resistance and operating conditions to ensure reliable performance.

Maximum voltage that can be applied between drain and source terminals without causing breakdown. Critical for MOSFET selection in power circuits. Verify against datasheet to ensure adequate margin for voltage spikes and transients.

Drain-to-source on-resistance of a MOSFET when fully enhanced. Lower values reduce conduction losses and heat. Verify at your operating gate voltage and temperature to ensure efficient switching performance.

Gate-source voltage at which a MOSFET begins to conduct, or input voltage at which a comparator switches. Essential for level shifting, power switching, and logic interface design. Confirm with datasheet curves.

Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this value with your application's power losses to ensure reliable operation. Always verify against the datasheet's thermal resistance and ambient temperature ratings.

Manufacturer-assigned identifier for the component. Use it to locate datasheets, verify specifications, and ensure compatibility with your design. Always cross-check the part number against the manufacturer's official documentation to avoid counterfeit or obsolete parts.