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C8051F326-GM Embedded - Microcontrollers от Silicon Labs

C8051F326-GM — это компонент категории Embedded - Microcontrollers от Silicon Labs в упаковке упаковке, указанной производителем. Его обычно проверяют для IC MCU 8BIT 16KB FLASH 28QFN. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

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C8051F326-GM Embedded - Microcontrollers от Silicon Labs | TrustCompo
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  • Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
  • Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
  • 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.

Ключевые характеристики

Номер детали

C8051F326-GM

Внутренний код

TCE000057771

Упаковка

-

Производитель
Silicon Labs

Ключевые характеристики

Серия

C8051F32x

Минимальное количество

1

Категория
Integrated Circuits (ICs)
Подкатегория
Embedded - Microcontrollers
Описание

IC MCU 8BIT 16KB FLASH 28QFN

Основные характеристики

-

Техническое описание
Открыть datasheet C8051F326-GM

Сигналы доверия

Качество и доверие

Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.

4 сертификата
  • ISO 9001

    Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.

  • AS9120B

    Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.

  • ISO 14001

    Экологическая дисциплина в операционных и складских процессах.

  • ESD Control

    Стандарты защиты от электростатического разряда для чувствительных компонентов.

RFQ checklist

Процесс заказа

Подтвердите ключевые данные закупки для C8051F326-GM до RFQ, выпуска PO и планирования отгрузки.

  1. 1

    Подтвердить MPN

    Укажите точный part number, производителя, package и approval constraints в RFQ.

  2. 2

    Проверить склад и цену

    Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.

  3. 3

    Согласовать документы

    Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.

  4. 4

    Организовать отгрузку

    Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.

Перед выпуском PO

Проверка детали

  • Точный MPN подтвержден: C8051F326-GM
  • Корпус для проверки: -

Коммерческие условия

  • Live stock и срок поставки подтверждены через RFQ
  • Финальная цена и налоговые условия подтверждены до выпуска PO

Отгрузка и документы

  • Ship-from location: склад Hong Kong
  • Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя

Технические параметры

Параметры

Сравните сгруппированные параметры C8051F326-GM от Silicon Labs, включая package, series, key attributes и technical values для engineering и sourcing review.

  • Product Attribute

    ECCN

    EAR99

  • Product Attribute

    Lead Free

    Lead Free

  • Product Attribute

    Packaging

    Tube

  • Product Attribute

    Mounting Type

    Surface Mount

  • Product Attribute

    Factory Lead Time

    6 Weeks

  • Product Attribute

    Published

    2000

C8051F326-GM Product Attribute
ПараметрЗначение
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tube
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

6 Weeks
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2000
Termination

Describes the method used to connect the component to the circuit board, such as solder, press-fit, or wire wrap. This affects assembly processes, reliability, and repairability. Check the termination type against your PCB footprint and soldering process to ensure compatibility.

SMD/SMT
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

CMOS
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

QUAD
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~85°C TA
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Microcontrollers
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Embedded - Microcontrollers
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Not For New Designs
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

28-VFQFN Exposed Pad
Surface Mount

Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.

YES
Contact Plating

Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.

Tin
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Number of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

28
Number of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

28
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

28
Number of Bits

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

8
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

5mm
Operating Supply Voltage

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

3.3V
Height

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

1mm
Number of I/O

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

15
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

3.3V
Frequency

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

25MHz
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

5mm
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Silicon Labs
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

C8051F32
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

C8051F32x
Manufacturer's Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

C8051F326-GM
C8051F326-GM Product Parameter
ПараметрЗначение
Supply Voltage-Max (Vsup)

Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.

3.6V
Oscillator Type

Specifies the oscillator circuit type used for clock generation in the component. Compare crystal, ceramic, RC, or MEMS types to match frequency stability and startup requirements. Verify against the datasheet for your application.

Internal
Memory Density

Total storage capacity of the memory chip, typically expressed in bits or bytes. Compare densities to match your application's code and data requirements. Verify against the datasheet to ensure sufficient headroom for firmware and runtime variables.

128 kb
Memory Size

Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in.

16kB
Core Size

Indicates the bit width of the processor core, such as 8-bit, 16-bit, or 32-bit. This determines the maximum data size the CPU can handle in one operation. Compare this with your software requirements and memory addressing needs to ensure compatibility with your application.

8-Bit
uPs/uCs/Peripheral ICs Type

Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements.

MICROCONTROLLER
Program Memory Size

Indicates the amount of non-volatile memory available for storing firmware or program code. This determines the maximum code size that can be executed. Verify that the program memory size is sufficient for your application's firmware, including future updates or additional features.

16KB 16K x 8
RAM Size

Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering.

1.5K x 8
Bit Size

Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements.

8
Program Memory Type

Technology used for storing firmware, such as Flash, EEPROM, or OTP. Determines reprogrammability, endurance, and write speed. Choose based on update requirements and production volume. Verify the memory size and programming interface in the datasheet.

FLASH
DMA Channels

Number of independent direct memory access channels available on the microcontroller or processor. Compare this when selecting devices for data-intensive applications to ensure sufficient bandwidth for peripherals without CPU load. Verify against the datasheet for exact channel mapping and features.

NO
Data Bus Width

Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance.

8b
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

5V
DAC Channels

Number of digital-to-analog converter channels integrated in the device. Compare this to the number of analog outputs you need in your system. Verify against the datasheet to ensure the DAC resolution and output drive capability match your application requirements.

NO
Has ADC

Check this attribute to confirm whether the component integrates an analog-to-digital converter. This is critical for microcontrollers, sensors, and mixed-signal ICs where analog inputs need digital processing. Verify against the datasheet to ensure the ADC meets your resolution and sampling requirements.

NO
PWM Channels

Number of independent pulse-width modulation outputs available on the component. Compare this when selecting microcontrollers, motor drivers, or LED controllers to ensure enough channels for your application. Verify against the datasheet for channel mapping and shared timer limitations.

NO
Voltage - Supply (Vcc/Vdd)

Indicates the recommended supply voltage range for the component. This is critical for proper operation and must be matched to your power rail. Always verify the absolute maximum ratings and recommended operating conditions in the datasheet to avoid damage or malfunction.

2.7V~3.6V
UART Channel Count

Number of independent UART interfaces for serial communication. Each channel supports bidirectional data transfer with configurable baud rate. Ensure the count meets your connectivity needs for peripherals, debugging, or inter-processor links. Verify pin availability in the datasheet.

1
Core Processor

Identifies the processor architecture and core type, such as ARM Cortex-M or RISC-V. Determines instruction set, toolchain compatibility, and performance characteristics. Check the datasheet for core frequency and features to ensure it meets your processing needs.

8051
Access Time

Specifies the delay from address or control signal assertion until valid data is available at the output. Critical for memory and FPGA configuration devices. Compare with system clock requirements and verify against datasheet timing diagrams.

25 μs
Number of Timers/Counters

Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features.

2
Peripherals

Lists the integrated peripheral components such as ADCs, DACs, PWM controllers, comparators, and communication modules. These features reduce external component count and system cost. Engineers should compare available peripherals to ensure they cover all required functions without additional ICs.

POR
Connectivity

Indicates the communication interfaces supported by the component, such as UART, SPI, I2C, USB, or Ethernet. Engineers compare this to ensure the device can interface with the rest of the system. Verify the exact interface versions and pin assignments in the datasheet.

UART/USART, USB
C8051F326-GM Export Classifications & Environmental
ПараметрЗначение
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
REACH SVHC

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

Unknown
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.31.0001

Предпросмотр datasheet

Datasheet PDF viewer

Просмотрите datasheet для C8051F326-GM от Silicon Labs, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.

Silicon Labs

C8051F326-GM

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Документы уведомлений

PCN / product notice documents

0 документов

Публичные PCN / PDN записи сейчас не показаны

Для C8051F326-GM сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.

Частые вопросы

FAQ по товару

Точные ответы для покупателей, которые проверяют ordering code C8051F326-GM, упаковку, наличие, datasheet и путь замены.

Что означает C8051F326-GM?

C8051F326-GM — это точный ordering code для компонента категории Embedded - Microcontrollers от Silicon Labs. Текущий корпус указан как -, а контекст позиции включает IC MCU 8BIT 16KB FLASH 28QFN. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.

Как покупателям проверить ordering code C8051F326-GM?

Рассматривайте C8051F326-GM как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус -, документацию производителя Silicon Labs, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.

В каком корпусе поставляется C8051F326-GM?

C8051F326-GM сейчас указан с корпусом - от Silicon Labs. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.

C8051F326-GM сейчас доступен для заказа?

C8051F326-GM сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (-), указанный склад (154163), доступное количество (27041), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.

Где сравнить альтернативы для C8051F326-GM?

Для C8051F326-GM сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.