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S25FL128SAGMFI003 Memory от Cypress Semiconductor

S25FL128SAGMFI003 — это компонент категории Memory от Cypress Semiconductor в упаковке 16SOIC. Его обычно проверяют для IC FLASH 128M SPI 133MHZ 16SOIC. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

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S25FL128SAGMFI003 Memory от Cypress Semiconductor | TrustCompo
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  • Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
  • Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
  • 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.

Ключевые характеристики

Номер детали

S25FL128SAGMFI003

Внутренний код

TCE000082246

Упаковка

16SOIC

Производитель
Cypress Semiconductor

Ключевые характеристики

Серия

FL-S

Минимальное количество

1

Категория
Integrated Circuits (ICs)
Подкатегория
Memory
Описание

IC FLASH 128M SPI 133MHZ 16SOIC

Основные характеристики

-

Техническое описание
Открыть datasheet S25FL128SAGMFI003

Сигналы доверия

Качество и доверие

Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.

4 сертификата
  • ISO 9001

    Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.

  • AS9120B

    Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.

  • ISO 14001

    Экологическая дисциплина в операционных и складских процессах.

  • ESD Control

    Стандарты защиты от электростатического разряда для чувствительных компонентов.

RFQ checklist

Процесс заказа

Подтвердите ключевые данные закупки для S25FL128SAGMFI003 до RFQ, выпуска PO и планирования отгрузки.

  1. 1

    Подтвердить MPN

    Укажите точный part number, производителя, package и approval constraints в RFQ.

  2. 2

    Проверить склад и цену

    Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.

  3. 3

    Согласовать документы

    Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.

  4. 4

    Организовать отгрузку

    Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.

Перед выпуском PO

Проверка детали

  • Точный MPN подтвержден: S25FL128SAGMFI003
  • Корпус для проверки: 16SOIC

Коммерческие условия

  • Live stock и срок поставки подтверждены через RFQ
  • Финальная цена и налоговые условия подтверждены до выпуска PO

Отгрузка и документы

  • Ship-from location: склад Hong Kong
  • Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя

Технические параметры

Параметры

Сравните сгруппированные параметры S25FL128SAGMFI003 от Cypress Semiconductor, включая package, series, key attributes и technical values для engineering и sourcing review.

  • Product Parameter

    Triac Type

    Active

  • Product Parameter

    Accessory Type

    DUAL

  • Product Parameter

    Maximum Data Rate Range (Kbps)

    1

  • Product Parameter

    Total Resistance

    Tape & Reel (TR)

  • Product Parameter

    Maximum Data Rate

    1.27mm

  • Product Parameter

    Nominal Attenuation

    e3

S25FL128SAGMFI003 Product Parameter
ПараметрЗначение
Triac Type

Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.

Active
Accessory Type

Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.

DUAL
Maximum Data Rate Range (Kbps)

Range of maximum data transfer rates supported by the component, expressed in kilobits per second. This indicates the span of possible speeds the device can handle. Compare this range with your system's required throughput to ensure the component can support the necessary communication bandwidth without data loss.

1
Total Resistance

Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.

Tape & Reel (TR)
Maximum Data Rate

Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.

1.27mm
Nominal Attenuation

Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.

e3
Transmission Media Type

Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.

3V
Minimum Switching Frequency

Specifies the lowest switching frequency at which the power device can operate reliably. Compare this value with your application's required switching speed to ensure proper performance. Verify against the datasheet's recommended operating conditions.

3/3.3V
Programming Voltage

Programming voltage is the specific voltage required to write or erase data in programmable devices like EEPROMs, flash memory, or microcontrollers. It must be applied precisely during programming; incorrect levels can cause write failures or permanent damage, so always follow the datasheet's programming procedure.

3V
Output Current Flow Direction

Specifies whether the output current flows from the device into the load or from the load into the device. This matters for sourcing versus sinking configurations. Verify against the datasheet to ensure correct circuit topology and avoid reverse current damage.

8542.32.00.51
Memory Density

Total storage capacity of the memory chip, typically expressed in bits or bytes. Compare densities to match your application's code and data requirements. Verify against the datasheet to ensure sufficient headroom for firmware and runtime variables.

128 Mb
Output Peak Current Limit

Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.

2.65mm
Alternate Memory Width

Specifies an alternative memory bus width configuration supported by the device. This is relevant for memory modules, microcontrollers, and FPGAs. Compare this attribute to understand flexibility in interfacing with different memory types or to optimize bandwidth versus pin count.

2
Access Time

Specifies the delay from address or control signal assertion until valid data is available at the output. Critical for memory and FPGA configuration devices. Compare with system clock requirements and verify against datasheet timing diagrams.

8 ns
Typical Quiescent Current (mA)

Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.

FLASH - NOR
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

FL-S
Output Format

Specifies the electrical or digital format of the output signal, such as analog voltage, current loop, or digital protocol. Engineers compare this to ensure compatibility with downstream circuitry or controllers. Verify the exact format and levels in the datasheet before integration.

HARDWARE/SOFTWARE
Linearity Error-Max (EL)

Maximum deviation from ideal linearity in the conversion characteristic. This parameter indicates how accurately the output follows a straight-line response. Compare values across similar converters to assess precision. Verify against the datasheet for guaranteed limits.

20
Number of Channels

Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.

IT ALSO CONFIGURED AS 256M X 1
S25FL128SAGMFI003 Product Attribute
ПараметрЗначение
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

16-SOIC (0.295, 7.50mm Width)
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Cypress Semiconductor
Housing Material

Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.

ROHS3 Compliant
Number of Contacts

Total number of electrical contacts in the connector, which determines the maximum number of circuits that can be connected. This is a critical parameter for matching the connector to your wire harness requirements. Ensure the contact count aligns with your signal and power needs.

No SVHC
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Surface Mount
Locking Feature

Indicates the locking mechanism used to secure the connector or terminal in place. Choose the appropriate type for your application to ensure reliable mating and vibration resistance. Verify compatibility with the mating part and datasheet specifications.

Lead Free
Number of Bits

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

No
Max Supply Voltage

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Surface Mount
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

-40°C~85°C TA
Temperature Grade

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

16
Data Rate

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

16
Converter Type

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

3 (168 Hours)
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Memory
Boot Block

Specifies the memory region reserved for boot code in microcontrollers, flash, or EEPROM devices. This block is protected to ensure reliable startup. Verify its size and protection features against the datasheet when selecting parts for firmware updates or secure boot applications.

BOTTOM
Threshold Voltage

The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.

10.3mm
Driver Number of Bits

Specifies the number of bits the driver can handle, indicating the width of the data path or the number of channels. This determines the maximum data throughput and the number of outputs. Ensure it matches your system's bus width or channel requirements.

Tin
Sync/Async

Indicates whether the component operates in synchronous or asynchronous mode. This affects timing, clocking, and data transfer protocols. Verify the mode against your system requirements and the datasheet to ensure proper integration and performance.

Synchronous
Operating Supply Voltage

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

SPI, Serial
Standby Current-Max

Maximum current drawn by the component when in standby or sleep mode. Lower values extend battery life in portable designs. Verify against datasheet conditions, as standby current can vary with supply voltage and temperature.

0.0001A
Input Power-Max (CW)

Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.

13 Weeks
Connector/Contact Type

Specifies the connector or contact style, such as pin, socket, or blade. This determines mating compatibility and mechanical fit. Verify against the datasheet to ensure correct pairing with the mating connector and proper application.

3.6V
Material Flammability Rating

Indicates the flammability classification of the insulating material used in the component, typically following UL 94 standards. This rating helps engineers assess fire safety and compliance with regulatory requirements. Check the datasheet for the specific test method and thickness conditions.

Non-Volatile
Reverse Recovery Time-Max

Specifies the maximum time required for a diode or rectifier to switch from conducting to blocking state. This parameter is critical for high-frequency rectification and switching power supplies. Compare this value to minimize switching losses and improve efficiency.

FLASH
Temperature Coefficient

Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.

2.7V~3.6V
Cable End Type

This attribute indicates how the cable is terminated at its end, such as stripped, tinned, ferrule, or connectorized. It affects the ease of installation, reliability of the connection, and compatibility with terminal blocks or other components. Buyers should select the appropriate type based on the application and verify with the datasheet.

2.7V
Word Size

Specifies the number of bits in a single data word for memory or processor components. Compare word sizes when selecting devices for data throughput and processing capability. Verify the exact word size in the datasheet to ensure compatibility with your system architecture.

1b
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

8b
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

2013
Diode Capacitance-Nom

Nominal capacitance of the diode, typically measured at a specified reverse voltage and frequency. This parameter is important for high-frequency applications, affecting switching speed and signal integrity. Check the datasheet for the test conditions and ensure the capacitance meets your circuit design.

SPI - Quad I/O
Current - Receiving

Specify the current consumption during receiving operation. This value is critical for battery life estimation in portable devices. Compare it with the datasheet's typical and maximum ratings to ensure your power supply can handle the load under worst-case conditions.

SPI
Tolerance

Allowed deviation from the nominal value, expressed as a percentage. Determines precision of resistors, capacitors, and inductors. Choose tighter tolerance for precision circuits, but verify actual performance in the datasheet.

1b
Current - Transmitting

Indicates the current consumption or output current during transmission mode. Essential for power budget calculations and thermal management in wireless modules. Check this value against your supply capability and compare with receiving current to estimate battery life.

100000 Write/Erase Cycles
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

128Mb 16M x 8
Bottom Termination

Defines the method used to connect wires on the bottom side of the terminal block, such as solder lug, quick-connect, or PCB pin. This determines how the component mounts and connects to your circuit. Ensure compatibility with your board layout and assembly process.

32MX4
Wire Gauge (Max)

Indicates the largest wire size that can be terminated or accommodated by this connector or terminal. Compare with your application's wire gauge to ensure proper fit and reliable electrical contact. Verify against the datasheet for specific wire ranges and strip lengths.

4
Write Cycle Time-Max (tWC)

Specifies the maximum duration required to complete a single write operation in non-volatile memory. Compare this timing parameter across devices to ensure compatibility with your system's write timing budget. Always verify against the datasheet for worst-case conditions.

500ms
Manufacturer's Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

S25FL128SAGMFI003
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

133MHz
FFC, FCB Thickness

This attribute specifies the thickness of a flat flexible cable (FFC) or flat circuit board (FCB). It is important for ensuring proper insertion into connectors and for mechanical fit in tight enclosures. Engineers must verify this dimension against the connector's specifications to guarantee reliable contact and avoid damage during assembly.

75mA

Предпросмотр datasheet

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Просмотрите datasheet для S25FL128SAGMFI003 от Cypress Semiconductor, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.

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S25FL128SAGMFI003

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Документы уведомлений

PCN / product notice documents

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Публичные PCN / PDN записи сейчас не показаны

Для S25FL128SAGMFI003 сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.

Частые вопросы

FAQ по товару

Точные ответы для покупателей, которые проверяют ordering code S25FL128SAGMFI003, упаковку, наличие, datasheet и путь замены.

Что означает S25FL128SAGMFI003?

S25FL128SAGMFI003 — это точный ordering code для компонента категории Memory от Cypress Semiconductor. Текущий корпус указан как 16SOIC, а контекст позиции включает IC FLASH 128M SPI 133MHZ 16SOIC. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.

Как покупателям проверить ordering code S25FL128SAGMFI003?

Рассматривайте S25FL128SAGMFI003 как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус 16SOIC, документацию производителя Cypress Semiconductor, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.

В каком корпусе поставляется S25FL128SAGMFI003?

S25FL128SAGMFI003 сейчас указан с корпусом 16SOIC от Cypress Semiconductor. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.

S25FL128SAGMFI003 сейчас доступен для заказа?

S25FL128SAGMFI003 сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (16SOIC), указанный склад (132446), доступное количество (63884), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.

Где сравнить альтернативы для S25FL128SAGMFI003?

Для S25FL128SAGMFI003 сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.