MC74LVX125DTG Logic - Buffers, Drivers, Receivers, Transceivers от ON Semiconductor
MC74LVX125DTG — это компонент категории Logic - Buffers, Drivers, Receivers, Transceivers от ON Semiconductor в упаковке TSSOP. Его обычно проверяют для IC BUF NON-INVERT 3.6V 14TSSOP. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
4 сертификата
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для MC74LVX125DTG до RFQ, выпуска PO и планирования отгрузки.
1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
Точный MPN подтвержден: MC74LVX125DTG
Корпус для проверки: TSSOP
Коммерческие условия
Live stock и срок поставки подтверждены через RFQ
Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
Ship-from location: склад Hong Kong
Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Обзор продукта
Обзор
Проверьте sourcing context для MC74LVX125DTG от ON Semiconductor, включая идентификацию товара, применимость, package notes и закупочные детали.
The MC74LVX125 is an advanced high speed CMOS quad bus buffer. The inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V systems to 3.0 V systems. Features • High Speed: tPD = 4.4 ns (Typ) at VCC = 3.3 V • Low Power Dissipation: ICC = 4 μA (Max) at TA = 25°C • Power Down Protection Provided on Inputs • Balanced Propagation Delays • Low Noise: VOLP = 0.5 V (Max) • Pin and Function Compatible with Other Standard Logic Families • Latchup Performance Exceeds 300 mA • ESD Performance: Human Body Model >2000 V Machine Model >200 V • These Devices are Pb−Free and are RoHS Compliant
Технические параметры
Параметры
Сравните сгруппированные параметры MC74LVX125DTG от ON Semiconductor, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Attribute
Part Status
Active
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
ECCN
EAR99
Product Attribute
Lead Free
Lead Free
Product Attribute
Packaging
Tube
Product Attribute
Mounting Type
Surface Mount
MC74LVX125DTG Product Attribute
Параметр
Значение
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Active
REACH Status
Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.
REACH Unaffected
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
EAR99
Lead Free
Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.
Lead Free
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tube
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Lifecycle Status
Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.
ACTIVE (Last Updated: 1 week ago)
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
2005
Halogen Free
Confirms whether the component is manufactured without halogenated compounds, such as bromine or chlorine, which are restricted in many industries due to environmental and safety regulations. Important for compliance with green standards and for use in sensitive applications.
Halogen Free
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
DUAL
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
260
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
GULL WING
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
CMOS
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
-40°C~85°C TA
Polarity
Specifies whether the component or signal has a defined positive and negative orientation, such as for diodes, electrolytic capacitors, or connectors. Incorrect polarity can cause failure or unsafe operation. Always check the datasheet and board markings before installation.
Non-Inverting
Terminal Pitch
Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.
0.65mm
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
14-TSSOP (0.173, 4.40mm Width)
Factory Lead Time
Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.
45 Weeks
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
ON Semiconductor
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
Bus Driver/Transceivers
Packing Method
Specifies the packaging format for delivery, such as tube, reel, tray, or tape and reel. This affects handling, storage, and assembly processes. Verify the packing method against your production requirements and the datasheet to ensure compatibility with your pick-and-place equipment.
RAIL
Family
Indicates the product family or series to which the component belongs. Helps identify related parts with similar characteristics. Verify the family name against the manufacturer's datasheet to ensure compatibility and correct sourcing.
LV/LV-A/LVX/H
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Logic - Buffers, Drivers, Receivers, Transceivers
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
No
Reflow Temperature-Max (s)
Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.
40
Pin Count
Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.
14
Number of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
14
Number of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
14
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
yes
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
5mm
Number of Functions
Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.
4
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
2.7V
Max Power Dissipation
Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.
180mW
Number of Ports
Indicates how many independent connection points or interfaces the component provides. Compare this when selecting connectors, switches, or modules for multi-channel designs. Verify against the datasheet to ensure the port count matches your system's required I/O configuration.
2
Number of Outputs
Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.
4
Output Type
Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches.
3-State
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
74LVX
Quiescent Current
Quiescent current is the current drawn by the device when it is in standby or no-load condition. It affects battery life in portable applications. Compare this value across similar components to ensure low power consumption. Always verify against the datasheet for your specific operating conditions.
4μA
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
74LVX125
Manufacturer's Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
1 (Unlimited)
RoHS Status
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
ROHS3 Compliant
JESD-609 Code
This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.
e4
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
8542.39.0001
MC74LVX125DTG Product Parameter
Параметр
Значение
Supply Voltage-Max (Vsup)
Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.
3.6V
Terminal Finish
Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.
Nickel/Palladium/Gold (Ni/Pd/Au)
Turn On Delay Time
Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.
19 ns
Number of Channels
Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.
4
Supply Voltage-Min (Vsup)
Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.
2V
Power Supplies
Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.
3.3V
Number of Bits per Element
Specifies the bit width of each logic element in the device. Compare this value to the required data path width for your application. Verify against the datasheet to ensure the logic family and package variant meet your design's bit-level requirements.
1
Supply Voltage
Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.
2V~3.6V
Logic Type
Specifies the logic family or functional type of the integrated circuit, such as AND, OR, inverter, or buffer. This determines voltage levels, speed, and compatibility with other logic families. Verify the exact type against the datasheet to ensure correct circuit operation and signal integrity.
Buffer, Non-Inverting
Control Type
Specifies the interface method used to operate the component, such as analog, digital, or PWM. Engineers compare this to ensure compatibility with their control circuitry. Verify the exact control protocol against the datasheet before integrating into your design.
ENABLE LOW
Logic Function
Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior.
Buffer, Inverting
Output Current High/Low
Specifies the maximum current the output can source or sink in high and low logic states. Compare with the load requirements to ensure reliable logic levels. Verify against the datasheet for absolute maximum ratings and derating conditions.
4mA 4mA
Propagation Delay
Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.
9.7 ns
Предпросмотр datasheet
Datasheet PDF viewer
Просмотрите datasheet для MC74LVX125DTG от ON Semiconductor, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.
Для MC74LVX125DTG сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
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Точные ответы для покупателей, которые проверяют ordering code MC74LVX125DTG, упаковку, наличие, datasheet и путь замены.
Что означает MC74LVX125DTG?
MC74LVX125DTG — это точный ordering code для компонента категории Logic - Buffers, Drivers, Receivers, Transceivers от ON Semiconductor. Текущий корпус указан как TSSOP, а контекст позиции включает IC BUF NON-INVERT 3.6V 14TSSOP. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code MC74LVX125DTG?
Рассматривайте MC74LVX125DTG как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус TSSOP, документацию производителя ON Semiconductor, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется MC74LVX125DTG?
MC74LVX125DTG сейчас указан с корпусом TSSOP от ON Semiconductor. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
MC74LVX125DTG сейчас доступен для заказа?
MC74LVX125DTG сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (TSSOP), указанный склад (120471), доступное количество (50665), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для MC74LVX125DTG?
Для MC74LVX125DTG сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.