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FGA60N65SMD Transistors - IGBTs - Single от ON Semiconductor

FGA60N65SMD — это компонент категории Transistors - IGBTs - Single от ON Semiconductor в упаковке SC-65-3. Его обычно проверяют для IGBT 650V 120A 600W TO3P. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

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FGA60N65SMD Transistors - IGBTs - Single от ON Semiconductor | TrustCompo
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  • Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
  • Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
  • 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.

Ключевые характеристики

Номер детали

FGA60N65SMD

Внутренний код

TCE000086605

Упаковка

SC-65-3

Производитель
ON Semiconductor

Ключевые характеристики

Серия

-

Минимальное количество

1

Подкатегория
Transistors - IGBTs - Single
Описание

IGBT 650V 120A 600W TO3P

Основные характеристики

-

Техническое описание
Открыть datasheet FGA60N65SMD

Сигналы доверия

Качество и доверие

Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.

4 сертификата
  • ISO 9001

    Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.

  • AS9120B

    Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.

  • ISO 14001

    Экологическая дисциплина в операционных и складских процессах.

  • ESD Control

    Стандарты защиты от электростатического разряда для чувствительных компонентов.

RFQ checklist

Процесс заказа

Подтвердите ключевые данные закупки для FGA60N65SMD до RFQ, выпуска PO и планирования отгрузки.

  1. 1

    Подтвердить MPN

    Укажите точный part number, производителя, package и approval constraints в RFQ.

  2. 2

    Проверить склад и цену

    Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.

  3. 3

    Согласовать документы

    Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.

  4. 4

    Организовать отгрузку

    Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.

Перед выпуском PO

Проверка детали

  • Точный MPN подтвержден: FGA60N65SMD
  • Корпус для проверки: SC-65-3

Коммерческие условия

  • Live stock и срок поставки подтверждены через RFQ
  • Финальная цена и налоговые условия подтверждены до выпуска PO

Отгрузка и документы

  • Ship-from location: склад Hong Kong
  • Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя

Технические параметры

Параметры

Сравните сгруппированные параметры FGA60N65SMD от ON Semiconductor, включая package, series, key attributes и technical values для engineering и sourcing review.

  • Product Attribute

    Part Status

    Active

  • Product Attribute

    Lifecycle Status

    ACTIVE (Last Updated: 4 days ago)

  • Product Attribute

    Mounting Type

    Through Hole

  • Product Attribute

    Published

    2008

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    ECCN

    EAR99

FGA60N65SMD Product Attribute
ПараметрЗначение
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
Lifecycle Status

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

ACTIVE (Last Updated: 4 days ago)
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Through Hole
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2008
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tube
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

7 Weeks
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

15.8mm
Element Configuration

Describes the internal arrangement of components, such as resistor networks or switch contacts. This affects the circuit topology and pinout. Engineers must verify this configuration against the datasheet to ensure correct integration into the PCB layout and proper functionality.

Single
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

ON Semiconductor
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-55°C~175°C TJ
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Discrete Semiconductor Products
Transistor Element Material

Specifies the semiconductor material used in the transistor's active region. This affects electrical characteristics such as switching speed and voltage rating. Verify the material against the datasheet when selecting for high-frequency or high-power applications.

SILICON
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Through Hole
Number of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

3
Number of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

3
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

5mm
Gate-Emitter Thr Voltage-Max

Maximum gate-emitter voltage at which the device begins to conduct. Important for determining drive voltage requirements and ensuring reliable turn-on. Compare with your gate driver output to avoid insufficient drive or accidental turn-on.

6V
Gate-Emitter Voltage-Max

Maximum allowable voltage between gate and emitter terminals. Exceeding this rating can damage the device. Ensure your gate driver output stays within this limit, including overshoot and ringing. Check datasheet for absolute maximum ratings.

20V
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Insulated Gate BIP Transistors
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Transistors - IGBTs - Single
Polarity/Channel Type

Indicates whether the semiconductor is N-channel, P-channel, NPN, PNP, or other polarity type. This determines the required gate or base drive voltage and circuit configuration. Verify against the datasheet to ensure compatibility with your application's power supply and control logic.

N-CHANNEL
HTS Code

Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.

8541.29.00.95
Additional Feature

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

LOW CONDUCTION LOSS
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

TO-3P-3, SC-65-3
Weight

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

6.401g
Max Power Dissipation

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

600W
Max Collector Current

Maximum continuous collector current that the transistor can handle without damage. Compare this rating with your circuit's peak current demand. Always verify against the datasheet for thermal limits and derating conditions.

120A
Transistor Application

Specifies the intended circuit role, such as switching, amplification, or RF. Engineers compare this to ensure the transistor's characteristics match the design's requirements. Verify against the datasheet's application section before selecting.

POWER CONTROL
Gate Charge

Total charge required to drive the gate to a specified voltage. Determines gate drive power and switching speed. Lower gate charge enables faster switching and higher efficiency. Check datasheet for test conditions and gate voltage.

189nC
Td (on/off) @ 25°C

Delay time from the input signal edge to the beginning of output transition, measured at 25°C. Critical for timing analysis in switching circuits. Verify against datasheet for load conditions and supply voltage.

18ns/104ns
Fall Time-Max (tf)

Maximum time required for the output signal to transition from high to low level. Critical for high-speed switching circuits to ensure signal integrity and minimize timing errors. Verify against datasheet for load conditions and temperature.

68ns
Vce(on) (Max) @ Vge, Ic

Maximum collector-emitter saturation voltage when the IGBT is fully on, specified at a given gate-emitter voltage and collector current. Compare this value to assess conduction losses and thermal performance. Verify against the datasheet for your operating conditions.

2.5V @ 15V, 60A
Test Condition

Specifies the environmental and electrical conditions under which the component's parameters are measured. Essential for comparing datasheet values across different manufacturers. Always check that test conditions match your application's operating environment.

400V, 60A, 3 Ω, 15V
Collector Emitter Saturation Voltage

Voltage drop across collector-emitter when the device is fully on. Determines conduction losses and efficiency. Lower saturation voltage means less power dissipation. Verify against datasheet for collector current and temperature.

1.9V
Maximum Power Dissipation

Maximum power the component can safely dissipate under specified conditions. Compare across parts to ensure thermal limits are not exceeded in your application. Always verify against the datasheet's derating curve and ambient temperature ratings.

600W
Height

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

20.1mm
Collector Emitter Breakdown Voltage

Specifies the maximum voltage that can be applied between collector and emitter without causing breakdown. Critical for power transistors and switching circuits. Verify against datasheet to ensure safe operating margin under worst-case conditions.

650V
Collector Emitter Voltage (VCEO)

Maximum allowable voltage between collector and emitter with the base terminal open. Exceeding this rating can cause breakdown or permanent damage. Verify against the datasheet for safe operating conditions in your circuit design.

650V
Switching Energy

Energy dissipated during each switching transition (turn-on and turn-off). Directly impacts efficiency and thermal management in power converters. Lower switching energy reduces losses and heat. Verify against datasheet for test conditions and load.

1.54mJ (on), 450μJ (off)
Manufacturer's Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

FGA60N65SMD
FGA60N65SMD Product Parameter
ПараметрЗначение
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Tin (Sn)
Turn On Delay Time

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

18 ns
Number of Elements

Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.

1
Input Type

Specifies the configuration of the input signal path, such as single-ended or differential. This affects noise immunity and interface compatibility. Verify the input type against your signal source and the datasheet to ensure proper connection and performance.

Standard
Current - Collector Pulsed (Icm)

Maximum allowable collector current during short pulses, typically higher than continuous rating. Important for applications with transient loads or inrush currents. Check pulse duration and duty cycle in the datasheet to avoid exceeding safe operating area.

180A
Rise Time-Max

Maximum time for a signal to transition from 10% to 90% of its final amplitude. Critical for switching speed in digital and power circuits. Verify against datasheet timing diagrams to ensure compatibility with your system's speed requirements.

70ns
IGBT Type

Specifies the internal structure or technology variant of the insulated-gate bipolar transistor, such as trench field-stop or planar. Affects switching losses, saturation voltage, and ruggedness. Confirm the type matches your application's voltage and frequency demands.

Field Stop
Reverse Recovery Time

Time for a diode to transition from conducting to blocking state. Critical for switching losses in power circuits. Compare values when designing high-frequency converters or rectifiers. Verify against datasheet under specified test conditions.

47 ns
Turn-Off Delay Time

Measures the time from when the turn-off command is applied to when the device actually begins to switch off. This delay affects switching losses and timing in power circuits. Engineers compare this parameter to ensure proper synchronization and to minimize power dissipation during high-frequency operation.

104 ns
FGA60N65SMD Export Classifications & Environmental
ПараметрЗначение
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8541.29.0095
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Not Applicable

Предпросмотр datasheet

Datasheet PDF viewer

Просмотрите datasheet для FGA60N65SMD от ON Semiconductor, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.

ON Semiconductor

FGA60N65SMD

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Документы уведомлений

PCN / product notice documents

0 документов

Публичные PCN / PDN записи сейчас не показаны

Для FGA60N65SMD сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.

Частые вопросы

FAQ по товару

Точные ответы для покупателей, которые проверяют ordering code FGA60N65SMD, упаковку, наличие, datasheet и путь замены.

Что означает FGA60N65SMD?

FGA60N65SMD — это точный ordering code для компонента категории Transistors - IGBTs - Single от ON Semiconductor. Текущий корпус указан как SC-65-3, а контекст позиции включает IGBT 650V 120A 600W TO3P. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.

Как покупателям проверить ordering code FGA60N65SMD?

Рассматривайте FGA60N65SMD как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус SC-65-3, документацию производителя ON Semiconductor, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.

В каком корпусе поставляется FGA60N65SMD?

FGA60N65SMD сейчас указан с корпусом SC-65-3 от ON Semiconductor. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.

FGA60N65SMD сейчас доступен для заказа?

FGA60N65SMD сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (SC-65-3), указанный склад (188850), доступное количество (38978), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.

Где сравнить альтернативы для FGA60N65SMD?

Для FGA60N65SMD сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.