74AVC1T45GM,115 Logic - Translators, Level Shifters от Nexperia

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

The amount of current the device draws from its power supply during normal operation. This is essential for power budget calculations, thermal management, and selecting appropriate power sources. Check datasheet for typical and maximum values under specified conditions.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Review the output characteristics to understand how the device behaves under various load and supply conditions. This includes voltage, current, and timing parameters. Verify these against your application requirements and the datasheet to ensure proper operation.

Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches.

Specifies the logic family and function of the integrated circuit, such as AND gate, flip-flop, or buffer. This attribute helps engineers select the correct logic device for their circuit design. Verify the exact type against the datasheet to ensure compatibility with voltage levels and speed requirements.

Indicates the product family or series to which the component belongs. Helps identify related parts with similar characteristics. Verify the family name against the manufacturer's datasheet to ensure compatibility and correct sourcing.

Specifies the maximum current the output can source when the logic level is high. This is critical for driving loads such as LEDs, relays, or logic inputs. Check this value against your load requirements to avoid output saturation or damage.

Specifies whether the output voltage is positive or negative relative to common. Critical for power supplies, amplifiers, and converters. Verify against datasheet to ensure correct system biasing and avoid reverse polarity damage.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Indicates how many independent connection points or interfaces the component provides. Compare this when selecting connectors, switches, or modules for multi-channel designs. Verify against the datasheet to ensure the port count matches your system's required I/O configuration.

Specifies the current the device can sink when its output is driven to a low logic state. Compare this value with the input current of connected loads to ensure reliable logic levels. Verify against the datasheet for maximum ratings and temperature effects.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.

Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

Specifies the number of transmitter channels available in the component. This is important for multi-channel communication systems where each transmitter drives a separate line. Verify that the number of transmitters meets your output requirements and that the electrical characteristics match your bus specifications.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Quiescent current is the current drawn by the device when it is in standby or no-load condition. It affects battery life in portable applications. Compare this value across similar components to ensure low power consumption. Always verify against the datasheet for your specific operating conditions.

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Specifies the architecture of the voltage level translator, such as unidirectional or bidirectional, and its logic family compatibility. This determines how signals are shifted between different voltage domains. Verify the translator type against your application's requirements and the datasheet to ensure proper signal integrity and voltage compatibility.

Specifies the electrical channel configuration, such as unidirectional or bidirectional, for signal or power routing. This attribute is critical for selecting components like multiplexers, isolators, or level shifters. Verify the channel type against your application requirements and the datasheet to ensure correct signal flow and compatibility.

Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.

Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior.

Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.

Specifies the highest voltage that can be applied between the positive and negative supply rails of a dual-supply device. Exceeding this limit may damage the component. Verify this parameter against the datasheet for proper power supply design and reliability.

Specifies the supply voltage for side B of the component. This is critical for level shifters, bus switches, or dual-supply devices. Verify it matches your system's B-side rail to ensure proper logic levels and avoid damage.

Specifies the supply voltage for side A of a dual-supply device. This parameter is critical for level shifting or bus switch applications. Verify it against the datasheet to ensure compatibility with the logic levels of the connected circuitry.

Indicates the lowest dual supply voltage (positive and negative rails) at which the component operates correctly. This is critical for op-amps, ADCs, and other analog devices. Ensure your power rails meet this minimum to avoid malfunction or degraded performance.

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.