C164CI8E25MDBKXQMA1 Embedded - Microcontrollers от Infineon Technologies
C164CI8E25MDBKXQMA1 — это компонент категории Embedded - Microcontrollers от Infineon Technologies в упаковке QFP. Его обычно проверяют для IC MCU 16BIT 64KB OTP 80MQFP. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
4 сертификата
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для C164CI8E25MDBKXQMA1 до RFQ, выпуска PO и планирования отгрузки.
1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
Точный MPN подтвержден: C164CI8E25MDBKXQMA1
Корпус для проверки: QFP
Коммерческие условия
Live stock и срок поставки подтверждены через RFQ
Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
Ship-from location: склад Hong Kong
Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Обзор продукта
Обзор
Проверьте sourcing context для C164CI8E25MDBKXQMA1 от Infineon Technologies, включая идентификацию товара, применимость, package notes и закупочные детали.
Summary of Features • High Performance 16-bit CPU with 4-Stage Pipeline – 80 ns Instruction Cycle Time at 25 MHz CPU Clock – 400 ns Multiplication (16 × 16 bit), 800 ns Division (32 / 16 bit) – Enhanced Boolean Bit Manipulation Facilities – Additional Instructions to Support HLL and Operating Systems – Register-Based Design with Multiple Variable Register Banks – Single-Cycle Context Switching Support – 16 Mbytes Total Linear Address Space for Code and Data – 1024 Bytes On-Chip Special Function Register Area • 16-Priority-Level Interrupt System with 30 Sources, Sample-Rate down to 40 ns • 8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via Peripheral Event Controller (PEC) • Clock Generation via on-chip PLL (factors 1:1.5/2/2.5/3/4/5), via prescaler or via direct clock input • On-Chip Memory Modules: 2 Kbytes On-Chip Internal RAM (IRAM) • On-Chip Peripheral Modules – Two Multi-Functional General Purpose Timer Units with 5 Timers – Two Serial Channels (Sync./Asynchronous and High-Speed-Synchronous) – On-Chip Real Time Clock • External Address Space for Code and Data – Programmable External Bus Characteristics for Different Address Ranges – Multiplexed or Demultiplexed External Address/Data Buses with 8-bit or 16-bit Data Bus Width – Four Programmable Chip-Select Signals – 4 Mbytes maximum address window size, results in a total external address space of 16 Mbytes, when all chip-select signal (address windows) are active • Idle and Power Down Modes with Flexible Power Management • Programmable Watchdog Timer and Oscillator Watchdog • Up to 63 General Purpose I/O Lines, partly with Selectable Input Thresholds and Hysteresis • Power Supply: the C161S can operate from a 5 V or a 3 V power supply (see Table 1) • Supported by a Large Range of Development Tools like C-Compilers, Macro-Assembler Packages, Emulators, Evaluation Boards, HLL-Debuggers, Simulators, Logic Analyzer Disassemblers, Programming Boards • On-Chip Bootstrap Loader • 80-Pin MQFP Package
Технические параметры
Параметры
Сравните сгруппированные параметры C164CI8E25MDBKXQMA1 от Infineon Technologies, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Parameter
Peripherals
POR, PWM, WDT
Product Parameter
Core Size
16-Bit
Product Parameter
Data Converter
A/D 8x10b
Product Parameter
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Product Parameter
RAM Size
4K x 8
Product Parameter
Program Memory Size
64KB 64K x 8
C164CI8E25MDBKXQMA1 Product Parameter
Параметр
Значение
Peripherals
Lists the integrated peripheral components such as ADCs, DACs, PWM controllers, comparators, and communication modules. These features reduce external component count and system cost. Engineers should compare available peripherals to ensure they cover all required functions without additional ICs.
POR, PWM, WDT
Core Size
Indicates the bit width of the processor core, such as 8-bit, 16-bit, or 32-bit. This determines the maximum data size the CPU can handle in one operation. Compare this with your software requirements and memory addressing needs to ensure compatibility with your application.
16-Bit
Data Converter
Specifies whether the component is an analog-to-digital or digital-to-analog converter. This attribute helps identify the conversion direction and architecture. Verify the exact type and resolution in the datasheet to ensure compatibility with your signal chain and system requirements.
A/D 8x10b
uPs/uCs/Peripheral ICs Type
Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements.
MICROCONTROLLER
RAM Size
Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering.
4K x 8
Program Memory Size
Indicates the amount of non-volatile memory available for storing firmware or program code. This determines the maximum code size that can be executed. Verify that the program memory size is sufficient for your application's firmware, including future updates or additional features.
64KB 64K x 8
ROM (words)
Indicates the read-only memory capacity in words, representing the number of addressable storage units for firmware or fixed data. Compare sizes to ensure sufficient code space for your application. Check the datasheet for exact word width.
65536
Program Memory Type
Technology used for storing firmware, such as Flash, EEPROM, or OTP. Determines reprogrammability, endurance, and write speed. Choose based on update requirements and production volume. Verify the memory size and programming interface in the datasheet.
OTP
DMA Channels
Number of independent direct memory access channels available on the microcontroller or processor. Compare this when selecting devices for data-intensive applications to ensure sufficient bandwidth for peripherals without CPU load. Verify against the datasheet for exact channel mapping and features.
NO
Supply Voltage-Max (Vsup)
Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.
5.5V
Has ADC
Check this attribute to confirm whether the component integrates an analog-to-digital converter. This is critical for microcontrollers, sensors, and mixed-signal ICs where analog inputs need digital processing. Verify against the datasheet to ensure the ADC meets your resolution and sampling requirements.
YES
PWM Channels
Number of independent pulse-width modulation outputs available on the component. Compare this when selecting microcontrollers, motor drivers, or LED controllers to ensure enough channels for your application. Verify against the datasheet for channel mapping and shared timer limitations.
YES
Oscillator Type
Specifies the oscillator circuit type used for clock generation in the component. Compare crystal, ceramic, RC, or MEMS types to match frequency stability and startup requirements. Verify against the datasheet for your application.
External
DAC Channels
Number of digital-to-analog converter channels integrated in the device. Compare this to the number of analog outputs you need in your system. Verify against the datasheet to ensure the DAC resolution and output drive capability match your application requirements.
NO
Supply Voltage-Min (Vsup)
Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.
4.75V
Bit Size
Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements.
16
Speed
Specifies the maximum clock frequency or data rate of the component. This is critical for timing and performance. Verify the speed grade in the datasheet to ensure it meets your system's throughput requirements and that signal integrity is maintained at that speed.
25MHz
Voltage - Supply (Vcc/Vdd)
Indicates the recommended supply voltage range for the component. This is critical for proper operation and must be matched to your power rail. Always verify the absolute maximum ratings and recommended operating conditions in the datasheet to avoid damage or malfunction.
4.75V~5.5V
Core Processor
Identifies the processor architecture and core type, such as ARM Cortex-M or RISC-V. Determines instruction set, toolchain compatibility, and performance characteristics. Check the datasheet for core frequency and features to ensure it meets your processing needs.
C166
Connectivity
Indicates the communication interfaces supported by the component, such as UART, SPI, I2C, USB, or Ethernet. Engineers compare this to ensure the device can interface with the rest of the system. Verify the exact interface versions and pin assignments in the datasheet.
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
RoHS Compliant
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
3 (168 Hours)
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
8542.31.0001
JESD-30 Code
JEDEC standard code that defines the package outline and dimensions. Use it to verify physical compatibility and footprint before PCB design. Compare with the datasheet to ensure the component meets your assembly and manufacturing requirements.
S-PQFP-G80
C164CI8E25MDBKXQMA1 Product Attribute
Параметр
Значение
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tray
REACH Status
Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.
REACH Unaffected
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
EAR99
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
1997
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Obsolete
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
GULL WING
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
5V
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
CMOS
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
QUAD
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Embedded - Microcontrollers
Terminal Pitch
Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.
0.65mm
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
-40°C~125°C TA
HTS Code
Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.
8542.31.00.01
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Infineon Technologies
Surface Mount
Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.
YES
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
yes
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
NOT SPECIFIED
Reflow Temperature-Max (s)
Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.
NOT SPECIFIED
Number of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
80
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
14mm
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
14mm
On-Chip Program ROM Width
Specifies the bit width of the on-chip program ROM in microcontrollers and SoCs. Wider ROM allows larger firmware and more complex instructions. Verify against the datasheet to ensure compatibility with your code size and memory architecture.
8
REACH Compliance Code
Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market.
compliant
External Data Bus Width
Number of parallel data lines on the external bus. Determines data transfer rate and interface complexity. Important for microcontrollers, DSPs, and memory devices. Verify with datasheet to match your system's bus architecture and timing requirements.
16
Number of I/O
Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.
59
Clock Frequency
Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values.
20MHz
Address Bus Width
Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design.
22
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
80-QFP
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
SA*C164CI
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
C16xx
Manufacturer's Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
C164CI8E25MDBKXQMA1
C164CI8E25MDBKXQMA1 Package Parameter
Параметр
Значение
Height Seated (Max)
Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.
2.45mm
Предпросмотр datasheet
Datasheet PDF viewer
Просмотрите datasheet для C164CI8E25MDBKXQMA1 от Infineon Technologies, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.
Для C164CI8E25MDBKXQMA1 сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
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Точные ответы для покупателей, которые проверяют ordering code C164CI8E25MDBKXQMA1, упаковку, наличие, datasheet и путь замены.
Что означает C164CI8E25MDBKXQMA1?
C164CI8E25MDBKXQMA1 — это точный ordering code для компонента категории Embedded - Microcontrollers от Infineon Technologies. Текущий корпус указан как QFP, а контекст позиции включает IC MCU 16BIT 64KB OTP 80MQFP. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code C164CI8E25MDBKXQMA1?
Рассматривайте C164CI8E25MDBKXQMA1 как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус QFP, документацию производителя Infineon Technologies, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется C164CI8E25MDBKXQMA1?
C164CI8E25MDBKXQMA1 сейчас указан с корпусом QFP от Infineon Technologies. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
C164CI8E25MDBKXQMA1 сейчас доступен для заказа?
C164CI8E25MDBKXQMA1 сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (QFP), указанный склад (69564), доступное количество (65547), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для C164CI8E25MDBKXQMA1?
Для C164CI8E25MDBKXQMA1 сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.