MMBV3700LT1G — это компонент категории Diodes - RF от ON Semiconductor в упаковке SOT23. Его обычно проверяют для RF DIODE PIN 200V 200MW SOT23-3. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
4 сертификата
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для MMBV3700LT1G до RFQ, выпуска PO и планирования отгрузки.
1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
Точный MPN подтвержден: MMBV3700LT1G
Корпус для проверки: SOT23
Коммерческие условия
Live stock и срок поставки подтверждены через RFQ
Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
Ship-from location: склад Hong Kong
Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Технические параметры
Параметры
Сравните сгруппированные параметры MMBV3700LT1G от ON Semiconductor, включая package, series, key attributes и technical values для engineering и sourcing review.
This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.
e3
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
1 (Unlimited)
RoHS Status
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
RoHS Compliant
REACH SVHC
Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.
No SVHC
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
8541.10.0070
ECCN Code
Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.
EAR99
MMBV3700LT1G Product Parameter
Параметр
Значение
Terminal Finish
Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.
Tin (Sn)
Number of Elements
Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.
1
Diode Element Material
Semiconductor material used in the diode, such as silicon, germanium, or gallium arsenide. Affects forward voltage, speed, and temperature behavior. Choose based on your application's voltage, current, and switching requirements. Verify with datasheet specifications.
SILICON
Max Repetitive Reverse Voltage (Vrrm)
Indicates the highest repetitive reverse voltage the diode can withstand in blocking mode. Engineers compare this to the circuit's peak reverse stress to ensure reliable operation. Always verify against the datasheet for your specific application.
200V
Max Reverse Voltage (DC)
Specifies the maximum continuous DC voltage that can be applied in the reverse direction without causing breakdown. Critical for rectifier and protection diodes. Verify against datasheet to ensure safe operating margin in your circuit.
200V
Reverse Recovery Time
Time for a diode to transition from conducting to blocking state. Critical for switching losses in power circuits. Compare values when designing high-frequency converters or rectifiers. Verify against datasheet under specified test conditions.
300 ns
Capacitance
Capacitance value of the component, typically expressed in farads (pF, nF, µF). This parameter determines energy storage and filtering characteristics. Compare capacitance when selecting capacitors for power supply decoupling, signal coupling, or timing applications. Always check the rated voltage and tolerance in the datasheet.
1pF
Reverse Voltage
Maximum voltage a diode or rectifier can withstand in the reverse direction without breakdown. Compare this rating with your circuit's peak reverse voltage to ensure reliable operation. Always verify against the datasheet's absolute maximum ratings.
20V
Diode Type
Select the diode classification such as Schottky, Zener, or standard rectifier. This defines the device's electrical behavior and typical applications. Verify the exact type against the datasheet to ensure it meets your circuit requirements for voltage, current, and switching speed.
PIN - Single
Diode Forward Resistance-Max
Specifies the highest resistance a diode offers in the forward conduction state. Compare this value when selecting diodes for low-loss power paths or signal switching. Verify against the datasheet under specified test conditions, as forward resistance affects efficiency and heat dissipation.
1Ohm
MMBV3700LT1G Product Attribute
Параметр
Значение
REACH Status
Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.
REACH Unaffected
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
EAR99
Lead Free
Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.
Lead Free
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
2007
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tape & Reel (TR)
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Obsolete
Termination
Describes the method used to connect the component to the circuit board, such as solder, press-fit, or wire wrap. This affects assembly processes, reliability, and repairability. Check the termination type against your PCB footprint and soldering process to ensure compatibility.
SMD/SMT
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
DUAL
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
260
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
GULL WING
Current Rating
Specifies the maximum continuous current the component can safely carry under specified conditions. Compare this value with your circuit's expected load to ensure reliable operation. Always verify against the datasheet for temperature derating and mounting considerations.
10A
Qualification Status
Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements.
Not Qualified
Element Configuration
Describes the internal arrangement of components, such as resistor networks or switch contacts. This affects the circuit topology and pinout. Engineers must verify this configuration against the datasheet to ensure correct integration into the PCB layout and proper functionality.
Single
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
ON Semiconductor
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Discrete Semiconductor Products
HTS Code
Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.
8541.10.00.80
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
TO-236-3, SC-59, SOT-23-3
Type
Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches.
Switch
Reflow Temperature-Max (s)
Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.
40
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
yes
Number of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
3
Pin Count
Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.
3
Number of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
3
Reverse Voltage (DC)
Maximum allowable DC voltage applied in the reverse direction across the component. Exceeding this value may cause breakdown or permanent damage. Verify against datasheet for safe operating limits and derating guidelines.
200V
Voltage - Rated DC
Specifies the maximum DC voltage the component can safely handle under rated conditions. Engineers compare this to the circuit's operating voltage to ensure adequate margin. Always verify against the datasheet's derating curves for temperature and reliability.
200V
Power Dissipation
Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions.
200mW
Polarity
Specifies whether the component or signal has a defined positive and negative orientation, such as for diodes, electrolytic capacitors, or connectors. Incorrect polarity can cause failure or unsafe operation. Always check the datasheet and board markings before installation.
Standard
Additional Feature
Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.
HIGH VOLTAGE
Lifecycle Status
Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.
LAST SHIPMENTS (Last Updated: 1 week ago)
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
125°C TJ
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Diodes - RF
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
POSITIVE-INTRINSIC-NEGATIVE
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
PIN Diodes
Diode Resistance Test Current
Specifies the current used to measure the resistance of a diode during testing. This value ensures consistent and comparable measurements. Always verify the test current against the datasheet to interpret resistance readings correctly.
10mA
Frequency Band
Indicates the range of frequencies over which the component is designed to operate with specified performance. Use to match your application's signal frequency. Confirm with datasheet graphs for impedance, gain, or attenuation across the band.
VERY HIGH FREQUENCY
Capacitance @ Vr, F
Junction capacitance measured at a specified reverse voltage and frequency. This value affects switching speed and high-frequency performance. Compare it with your circuit's requirements and verify against the datasheet for accurate operation.
1pF @ 20V 1MHz
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
MMBV3700
Manufacturer's Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
MMBV3700LT1G
Diode Capacitance-Nom
Nominal capacitance of the diode, typically measured at a specified reverse voltage and frequency. This parameter is important for high-frequency applications, affecting switching speed and signal integrity. Check the datasheet for the test conditions and ensure the capacitance meets your circuit design.
1pF
Resistance at If, F
Defines the dynamic resistance of a diode or LED when operated at a specified forward current (If) and frequency (F). This parameter is important for high-frequency applications. Check the datasheet for the exact test conditions and typical values.
1Ohm @ 10mA 100MHz
Предпросмотр datasheet
Datasheet PDF viewer
Просмотрите datasheet для MMBV3700LT1G от ON Semiconductor, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.
Для MMBV3700LT1G сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
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Точные ответы для покупателей, которые проверяют ordering code MMBV3700LT1G, упаковку, наличие, datasheet и путь замены.
Что означает MMBV3700LT1G?
MMBV3700LT1G — это точный ordering code для компонента категории Diodes - RF от ON Semiconductor. Текущий корпус указан как SOT23, а контекст позиции включает RF DIODE PIN 200V 200MW SOT23-3. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code MMBV3700LT1G?
Рассматривайте MMBV3700LT1G как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус SOT23, документацию производителя ON Semiconductor, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется MMBV3700LT1G?
MMBV3700LT1G сейчас указан с корпусом SOT23 от ON Semiconductor. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
MMBV3700LT1G сейчас доступен для заказа?
MMBV3700LT1G сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (SOT23), указанный склад (62962), доступное количество (31537), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для MMBV3700LT1G?
Для MMBV3700LT1G сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.