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MT16HTF51264HZ-800C1 Memory - Modules от Micron Technology

MT16HTF51264HZ-800C1 — это компонент категории Memory - Modules от Micron Technology в упаковке 2010. Его обычно проверяют для MODULE DDR2 SDRAM 4GB 200SODIMM. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

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MT16HTF51264HZ-800C1 Memory - Modules от Micron Technology | TrustCompo
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  • Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
  • Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
  • 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.

Ключевые характеристики

Номер детали

MT16HTF51264HZ-800C1

Внутренний код

TCE000114984

Упаковка

2010

Производитель
Micron Technology

Ключевые характеристики

Серия

-

Минимальное количество

1

Категория
Memory Cards, Modules
Подкатегория
Memory - Modules
Описание

MODULE DDR2 SDRAM 4GB 200SODIMM

Основные характеристики

-

Техническое описание
Открыть datasheet MT16HTF51264HZ-800C1

Сигналы доверия

Качество и доверие

Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.

4 сертификата
  • ISO 9001

    Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.

  • AS9120B

    Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.

  • ISO 14001

    Экологическая дисциплина в операционных и складских процессах.

  • ESD Control

    Стандарты защиты от электростатического разряда для чувствительных компонентов.

RFQ checklist

Процесс заказа

Подтвердите ключевые данные закупки для MT16HTF51264HZ-800C1 до RFQ, выпуска PO и планирования отгрузки.

  1. 1

    Подтвердить MPN

    Укажите точный part number, производителя, package и approval constraints в RFQ.

  2. 2

    Проверить склад и цену

    Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.

  3. 3

    Согласовать документы

    Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.

  4. 4

    Организовать отгрузку

    Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.

Перед выпуском PO

Проверка детали

  • Точный MPN подтвержден: MT16HTF51264HZ-800C1
  • Корпус для проверки: 2010

Коммерческие условия

  • Live stock и срок поставки подтверждены через RFQ
  • Финальная цена и налоговые условия подтверждены до выпуска PO

Отгрузка и документы

  • Ship-from location: склад Hong Kong
  • Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя

Технические параметры

Параметры

Сравните сгруппированные параметры MT16HTF51264HZ-800C1 от Micron Technology, включая package, series, key attributes и technical values для engineering и sourcing review.

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    ECCN

    EAR99

  • Product Attribute

    Factory Lead Time

    5 Weeks

  • Product Attribute

    Part Status

    Obsolete

  • Product Attribute

    Published

    2010

  • Product Attribute

    Peak Reflow Temperature (Cel)

    260

MT16HTF51264HZ-800C1 Product Attribute
ПараметрЗначение
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

5 Weeks
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Obsolete
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2010
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

CMOS
Max Supply Voltage

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

1.9V
Output Characteristics

Review the output characteristics to understand how the device behaves under various load and supply conditions. This includes voltage, current, and timing parameters. Verify these against your application requirements and the datasheet to ensure proper operation.

3-STATE
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

ZIG-ZAG
Contact Plating

Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.

Gold
Number of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Reflow Temperature-Max (s)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

30
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Number of Ports

Indicates how many independent connection points or interfaces the component provides. Compare this when selecting connectors, switches, or modules for multi-channel designs. Verify against the datasheet to ensure the port count matches your system's required I/O configuration.

1
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

1.8V
Minimum Supply Voltage

Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.

1.7V
Operating Supply Voltage

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

1.8V
Minimum Operating Temperature

Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs.

0°C
Memory Type

Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed.

DDR2 SDRAM
Max Operating Temperature

Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage.

70°C
Temperature Grade

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

COMMERCIAL
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Socket
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.6mm
Number of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

200
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Micron Technology
I/O Type

Defines the electrical interface type for input and output signals, such as digital, analog, or serial. This determines compatibility with your system's logic levels and communication protocols. Always confirm with the datasheet.

COMMON
Number of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

200
Memory Width

Specifies the number of bits transferred simultaneously between the memory device and the controller. Wider buses enable higher data throughput. Verify this parameter against the datasheet to ensure compatibility with your system's bus architecture and expected performance.

64
HTS Code

Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.

8542.32.00.36
Access Mode

Describes how data is accessed in memory devices, such as random, sequential, or burst modes. This affects read/write performance and interface design. Choose the appropriate mode based on your application's data access patterns and timing requirements.

DUAL BANK PAGE BURST
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

DRAMs
Memory Density

Specifies the total memory capacity of a device, typically expressed in bits or bytes. This attribute is essential for selecting memory ICs, storage modules, or microcontrollers with embedded memory. Compare density to ensure sufficient storage for your application's code and data.

34359738368 bit
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

67.6mm
Clock Frequency

Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values.

400MHz
Access Time (Max)

Maximum time required to read or write data in memory devices. Lower values indicate faster performance. Critical for timing analysis in digital systems. Verify against the datasheet to ensure it meets your system's speed requirements.

0.4 ns
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Memory - Modules
Memory Organization

Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration.

512MX64
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

200-SODIMM
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Memory Cards, Modules
Additional Feature

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

AUTO/SELF REFRESH; WD-MAX
Manufacturer's Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

MT16HTF51264HZ-800C1
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

200
MT16HTF51264HZ-800C1 Product Parameter
ПараметрЗначение
Number of Elements

Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.

16
Data Bus Width

Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance.

64b
Refresh Cycles

Number of refresh cycles required for memory. This parameter indicates how often the memory must be refreshed to retain data. Compare this value with your system's refresh timing requirements to ensure reliable operation. Verify against the datasheet for your specific memory type.

8192
Max Frequency

Specifies the highest frequency at which the component can operate reliably. Compare this value with your application's required frequency range. Always verify against the datasheet for derating conditions and test setup.

800MHz
Memory Size

Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in.

4GB
Speed

Specifies the maximum clock frequency or data rate of the component. This is critical for timing and performance. Verify the speed grade in the datasheet to ensure it meets your system's throughput requirements and that signal integrity is maintained at that speed.

800MT/s
MT16HTF51264HZ-800C1 Export Classifications & Environmental
ПараметрЗначение
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e4
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

3 (168 Hours)
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.32.0036
MT16HTF51264HZ-800C1 Package Parameter
ПараметрЗначение
Height Seated (Max)

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.

30.15mm

Предпросмотр datasheet

Datasheet PDF viewer

Просмотрите datasheet для MT16HTF51264HZ-800C1 от Micron Technology, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.

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Документы уведомлений

PCN / product notice documents

0 документов

Публичные PCN / PDN записи сейчас не показаны

Для MT16HTF51264HZ-800C1 сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.

Частые вопросы

FAQ по товару

Точные ответы для покупателей, которые проверяют ordering code MT16HTF51264HZ-800C1, упаковку, наличие, datasheet и путь замены.

Что означает MT16HTF51264HZ-800C1?

MT16HTF51264HZ-800C1 — это точный ordering code для компонента категории Memory - Modules от Micron Technology. Текущий корпус указан как 2010, а контекст позиции включает MODULE DDR2 SDRAM 4GB 200SODIMM. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.

Как покупателям проверить ordering code MT16HTF51264HZ-800C1?

Рассматривайте MT16HTF51264HZ-800C1 как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус 2010, документацию производителя Micron Technology, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.

В каком корпусе поставляется MT16HTF51264HZ-800C1?

MT16HTF51264HZ-800C1 сейчас указан с корпусом 2010 от Micron Technology. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.

MT16HTF51264HZ-800C1 сейчас доступен для заказа?

MT16HTF51264HZ-800C1 сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (2010), указанный склад (73075), доступное количество (66865), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.

Где сравнить альтернативы для MT16HTF51264HZ-800C1?

Для MT16HTF51264HZ-800C1 сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.