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LCMXO640C-3B256C Embedded - FPGAs (Field Programmable Gate Array) от Lattice Semiconductor

LCMXO640C-3B256C — это компонент категории Embedded - FPGAs (Field Programmable Gate Array) от Lattice Semiconductor в упаковке упаковке, указанной производителем. Его обычно проверяют для IC FPGA 159 I/O 256CABGA. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

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LCMXO640C-3B256C Embedded - FPGAs (Field Programmable Gate Array) от Lattice Semiconductor | TrustCompo
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  • Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
  • Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
  • 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.

Ключевые характеристики

Номер детали

LCMXO640C-3B256C

Внутренний код

TCE000118262

Упаковка

-

Производитель
Lattice Semiconductor

Ключевые характеристики

Серия

MachXO

Минимальное количество

1

Категория
Integrated Circuits (ICs)
Описание

IC FPGA 159 I/O 256CABGA

Основные характеристики

-

Техническое описание
Открыть datasheet LCMXO640C-3B256C

Сигналы доверия

Качество и доверие

Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.

4 сертификата
  • ISO 9001

    Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.

  • AS9120B

    Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.

  • ISO 14001

    Экологическая дисциплина в операционных и складских процессах.

  • ESD Control

    Стандарты защиты от электростатического разряда для чувствительных компонентов.

RFQ checklist

Процесс заказа

Подтвердите ключевые данные закупки для LCMXO640C-3B256C до RFQ, выпуска PO и планирования отгрузки.

  1. 1

    Подтвердить MPN

    Укажите точный part number, производителя, package и approval constraints в RFQ.

  2. 2

    Проверить склад и цену

    Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.

  3. 3

    Согласовать документы

    Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.

  4. 4

    Организовать отгрузку

    Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.

Перед выпуском PO

Проверка детали

  • Точный MPN подтвержден: LCMXO640C-3B256C
  • Корпус для проверки: -

Коммерческие условия

  • Live stock и срок поставки подтверждены через RFQ
  • Финальная цена и налоговые условия подтверждены до выпуска PO

Отгрузка и документы

  • Ship-from location: склад Hong Kong
  • Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя

Обзор продукта

Обзор

Проверьте sourcing context для LCMXO640C-3B256C от Lattice Semiconductor, включая идентификацию товара, применимость, package notes и закупочные детали.

Introduction
The MachXO is optimized to meet the requirements of applications traditionally addressed by CPLDs and low capacity FPGAs: glue logic, bus bridging, bus interfacing, power-up control, and control logic.
These devices bring together the best features of CPLD and FPGA devices on a single chip.
Features
• Non-volatile, Infinitely Reconfigurable
• Instant-on
– powers up in microseconds
• Single chip, no external configuration memory required
• Excellent design security, no bit stream to intercept
• Reconfigure SRAM based logic in milliseconds
• SRAM and non-volatile memory programmable through JTAG port
• Supports background programming of non-volatile memory
• Sleep Mode
• Allows up to 100x static current reduction
• TransFR™ Reconfiguration (TFR)
• In-field logic update while system operates
• High I/O to Logic Density
• 256 to 2280 LUT4s
• 73 to 271 I/Os with extensive package options
• Density migration supported
• Lead free/RoHS compliant packaging
• Embedded and Distributed Memory
• Up to 27.6 Kbits sysMEM™ Embedded Block RAM
• Up to 7.5 Kbits distributed RAM
• Dedicated FIFO control logic
• Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide range of interfaces: − LVCMOS 3.3/2.5/1.8/1.5/1.2 − LVTTL − PCI − LVDS, Bus-LVDS, LVPECL, RSDS
• sysCLOCK™ PLLs
• Up to two analog PLLs per device
• Clock multiply, divide, and phase shifting
• System Level Support
• IEEE Standard 1149.1 Boundary Scan
• Onboard oscillator
• Devices operate with 3.3V, 2.5V, 1.8V or 1.2V power supply
• IEEE 1532 compliant in-system programming

Технические параметры

Параметры

Сравните сгруппированные параметры LCMXO640C-3B256C от Lattice Semiconductor, включая package, series, key attributes и technical values для engineering и sourcing review.

  • Product Parameter

    Typical Quiescent Current (mA)

    CMOS

  • Product Parameter

    Drain to Source Resistance

    EAR99

  • Product Parameter

    On-state Resistance Match-Nom

    Not Qualified

  • Product Parameter

    Transmission Media Type

    1.8V

  • Product Parameter

    Transformer Type

    no

  • Product Parameter

    Total Resistance

    Tray

LCMXO640C-3B256C Product Parameter
ПараметрЗначение
Typical Quiescent Current (mA)

Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.

CMOS
Drain to Source Resistance

This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.

EAR99
On-state Resistance Match-Nom

Indicates the nominal matching of on-state resistance between multiple channels in a device, such as a dual MOSFET or analog switch. This parameter is critical for parallel operation and current sharing. Verify the specified match against the datasheet to ensure balanced performance.

Not Qualified
Transmission Media Type

Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.

1.8V
Transformer Type

Indicates the construction or configuration of the transformer, such as flyback, forward, or planar. Affects performance, size, and application suitability. Refer to datasheet for detailed specifications and recommended usage.

no
Total Resistance

Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.

Tray
Number of Turns

Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance.

14mm
Accessory Type

Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.

BOTTOM
Minimum Operating Supply Voltage

Specifies the lowest supply voltage at which the component remains fully functional. Compare this value with your system's power rail tolerance and verify it against the datasheet's recommended operating conditions to ensure reliable startup and operation.

BALL
Triac Type

Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.

Obsolete
Nominal Attenuation

Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.

e0
Maximum Operating Supply Voltage

Highest supply voltage at which the component can operate normally without damage or performance degradation. Exceeding this limit may cause overheating or failure. Always check this parameter against your power supply design to ensure the component operates within its safe voltage range for reliable long-term performance.

240
Voltage Rating

Specifies the maximum continuous voltage the component can safely withstand without damage or performance degradation. Critical for ensuring proper operating margins in power supplies, signal lines, and isolation barriers. Always confirm with the datasheet for absolute maximum ratings.

30
Maximum Data Rate

Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.

0.8mm
Output Current Flow Direction

Specifies whether the output current flows from the device into the load or from the load into the device. This matters for sourcing versus sinking configurations. Verify against the datasheet to ensure correct circuit topology and avoid reverse current damage.

8542.39.00.01
Number of LABs/CLBs

Indicates the count of logic array blocks or configurable logic blocks in an FPGA or CPLD. This metric helps compare logic capacity and complexity across devices. Verify against the datasheet for your specific design requirements.

80
Number of Logic Elements/Cells

Indicates the total count of programmable logic elements or cells in the FPGA or CPLD. This parameter determines the device's logic capacity and complexity. Compare this value with your design requirements to ensure sufficient resources. Always verify against the datasheet for exact specifications.

640
Collector-Emitter Voltage-Max

Maximum voltage that can be applied between collector and emitter without breakdown. Critical for BJT and IGBT selection. Verify against datasheet to ensure safe operation within your circuit's supply and transient conditions.

FLASH PLD
Reference Point

Indicates the physical or electrical reference point used for measurements, alignment, or calibration. Verify this against the datasheet when mounting or testing components to ensure accurate readings and proper system integration.

640
Typical Switching Frequency (kHz)

Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions.

Field Programmable Gate Arrays
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

MachXO
Rated Power Dissipation (P)

Maximum power the component can safely dissipate as heat under specified conditions. Compare this rating with your circuit's expected power loss to ensure reliable operation. Verify against the datasheet for derating curves and ambient temperature limits.

4.9 ns
Number of Channels

Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.

IT CAN ALSO OPERATE AT 2.5V AND 3.3V
Filter Type

Specifies the filter topology used in the component, such as low-pass, high-pass, band-pass, or notch. This determines the frequency response and attenuation characteristics. Engineers must verify the filter type against the datasheet to ensure it meets the required signal conditioning and interference rejection for the application.

256
Output Peak Current Limit

Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.

1.7mm
Capacitance

Capacitance value of the component, typically expressed in farads (pF, nF, µF). This parameter determines energy storage and filtering characteristics. Compare capacitance when selecting capacitors for power supply decoupling, signal coupling, or timing applications. Always check the rated voltage and tolerance in the datasheet.

159
LCMXO640C-3B256C Product Attribute
ПараметрЗначение
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Surface Mount
Locking Feature

Indicates the locking mechanism used to secure the connector or terminal in place. Choose the appropriate type for your application to ensure reliable mating and vibration resistance. Verify compatibility with the mating part and datasheet specifications.

Lead Free
Resistance

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

3.3V
Max Supply Voltage

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Surface Mount
Threshold Voltage

The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.

14mm
Converter Type

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

3 (168 Hours)
Housing Material

Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.

Non-RoHS Compliant
Interface Type

Specifies the communication protocol used by the component to exchange data with a host controller or other devices. Common examples include I2C, SPI, UART, USB, and CAN. Verify compatibility with your system's bus architecture and voltage levels before integration.

not_compliant
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

2013
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Lattice Semiconductor
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Embedded - FPGAs (Field Programmable Gate Array)
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

MachXO
Specifications

Review the complete technical specifications for this electronic component, including electrical ratings, mechanical dimensions, and environmental limits. Verify these parameters against your application requirements and the manufacturer's datasheet to ensure compatibility and reliable operation.

TIN LEAD
Number of Macro Cells

Indicates the total number of macro cells in a CPLD or FPGA, which determines the logic capacity and complexity of designs you can implement. Compare this value against your required logic functions and check the datasheet for exact architecture and routing constraints.

320
Number of I/O

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

159
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

256-LFBGA, CSPBGA
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

LCMXO640
Material Flammability Rating

Indicates the flammability classification of the insulating material used in the component, typically following UL 94 standards. This rating helps engineers assess fire safety and compliance with regulatory requirements. Check the datasheet for the specific test method and thickness conditions.

SRAM
Temperature Coefficient

Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.

1.71V~3.465V
Current Rating (Amps)

Specifies the maximum continuous current the component can safely carry under specified conditions. Compare this rating with your circuit's expected load to prevent overheating or failure. Always verify against the datasheet for temperature derating and mounting considerations.

17mA
Non-repetitive Peak Reverse Power Dissipation

Maximum allowable single-pulse reverse power that a diode or rectifier can withstand without damage. Compare this rating when designing for surge conditions. Verify against the datasheet's pulse duration and waveform to ensure safe operation.

7
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

0°C~85°C TJ
Output Low Current-Max

Maximum current the output can sink while maintaining a valid low logic level. This parameter is essential for driving loads like LEDs, relays, or logic inputs. Check this value against your load requirements to avoid output saturation or logic errors.

MACROCELL
Data Rate

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

256
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

420MHz
Manufacturer's Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

LCMXO640C-3B256C
Contact Finish

Specifies the plating material on the contact surface, affecting conductivity, corrosion resistance, and durability. Compare finishes like gold, tin, or silver for mating cycle requirements and environmental exposure. Verify the exact finish and thickness in the datasheet to ensure reliable performance in your application.

S-PBGA-B256
Minimum Operating Temperature

Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs.

159
FFC, FCB Thickness

This attribute specifies the thickness of a flat flexible cable (FFC) or flat circuit board (FCB). It is important for ensuring proper insertion into connectors and for mechanical fit in tight enclosures. Engineers must verify this dimension against the connector's specifications to guarantee reliable contact and avoid damage during assembly.

17mA

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Документы уведомлений

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Публичные PCN / PDN записи сейчас не показаны

Для LCMXO640C-3B256C сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.

Частые вопросы

FAQ по товару

Точные ответы для покупателей, которые проверяют ordering code LCMXO640C-3B256C, упаковку, наличие, datasheet и путь замены.

Что означает LCMXO640C-3B256C?

LCMXO640C-3B256C — это точный ordering code для компонента категории Embedded - FPGAs (Field Programmable Gate Array) от Lattice Semiconductor. Текущий корпус указан как -, а контекст позиции включает IC FPGA 159 I/O 256CABGA. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.

Как покупателям проверить ordering code LCMXO640C-3B256C?

Рассматривайте LCMXO640C-3B256C как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус -, документацию производителя Lattice Semiconductor, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.

В каком корпусе поставляется LCMXO640C-3B256C?

LCMXO640C-3B256C сейчас указан с корпусом - от Lattice Semiconductor. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.

LCMXO640C-3B256C сейчас доступен для заказа?

LCMXO640C-3B256C сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (-), указанный склад (25839), доступное количество (19618), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.

Где сравнить альтернативы для LCMXO640C-3B256C?

Для LCMXO640C-3B256C сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.