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CY8C20160-LDX2I Interface - Sensor, Capacitive Touch от Cypress Semiconductor

CY8C20160-LDX2I — это компонент категории Interface - Sensor, Capacitive Touch от Cypress Semiconductor в упаковке упаковке, указанной производителем. Его обычно проверяют для IC CAPSENSE EXP 6 I/O 16QFN. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

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CY8C20160-LDX2I Interface - Sensor, Capacitive Touch от Cypress Semiconductor | TrustCompo
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  • Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
  • Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
  • 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.

Ключевые характеристики

Номер детали

CY8C20160-LDX2I

Внутренний код

TCE000120419

Упаковка

-

Производитель
Cypress Semiconductor

Ключевые характеристики

Серия

CapSense® Express™

Минимальное количество

1

Категория
Integrated Circuits (ICs)
Описание

IC CAPSENSE EXP 6 I/O 16QFN

Основные характеристики

-

Техническое описание
Открыть datasheet CY8C20160-LDX2I

Сигналы доверия

Качество и доверие

Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.

4 сертификата
  • ISO 9001

    Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.

  • AS9120B

    Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.

  • ISO 14001

    Экологическая дисциплина в операционных и складских процессах.

  • ESD Control

    Стандарты защиты от электростатического разряда для чувствительных компонентов.

RFQ checklist

Процесс заказа

Подтвердите ключевые данные закупки для CY8C20160-LDX2I до RFQ, выпуска PO и планирования отгрузки.

  1. 1

    Подтвердить MPN

    Укажите точный part number, производителя, package и approval constraints в RFQ.

  2. 2

    Проверить склад и цену

    Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.

  3. 3

    Согласовать документы

    Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.

  4. 4

    Организовать отгрузку

    Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.

Перед выпуском PO

Проверка детали

  • Точный MPN подтвержден: CY8C20160-LDX2I
  • Корпус для проверки: -

Коммерческие условия

  • Live stock и срок поставки подтверждены через RFQ
  • Финальная цена и налоговые условия подтверждены до выпуска PO

Отгрузка и документы

  • Ship-from location: склад Hong Kong
  • Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя

Технические параметры

Параметры

Сравните сгруппированные параметры CY8C20160-LDX2I от Cypress Semiconductor, включая package, series, key attributes и technical values для engineering и sourcing review.

  • Product Parameter

    Terminal Finish

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Product Parameter

    Watchdog Timer

    Yes

  • Product Parameter

    Supply Voltage-Max (Vsup)

    5.25V

  • Product Parameter

    Supply Voltage-Min (Vsup)

    2.4V

  • Product Parameter

    Peripherals

    I2C, PWM

  • Product Parameter

    RAM Size

    512B

CY8C20160-LDX2I Product Parameter
ПараметрЗначение
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Nickel/Palladium/Gold (Ni/Pd/Au)
Watchdog Timer

Indicates whether the component includes a watchdog timer and its type. This timer resets the system if software hangs, improving reliability. Verify the timeout period and enable/disable options in the datasheet for your application.

Yes
Supply Voltage-Max (Vsup)

Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.

5.25V
Supply Voltage-Min (Vsup)

Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.

2.4V
Peripherals

Lists the integrated peripheral components such as ADCs, DACs, PWM controllers, comparators, and communication modules. These features reduce external component count and system cost. Engineers should compare available peripherals to ensure they cover all required functions without additional ICs.

I2C, PWM
RAM Size

Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering.

512B
Supply Voltage

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

2.4V~5.25V
Number of Inputs

Defines how many input channels the component supports, such as a multiplexer, logic gate, or amplifier. This determines the maximum number of signals that can be routed or processed. Ensure the input count matches your system's channel requirements and pin configuration.

Up to 6
Proximity Detection

This indicates whether the component includes proximity detection capability, often used in sensors or modules. It helps in touchless interfaces and object detection. Verify the detection range and interface compatibility with your application.

No
Number of GPIO

Indicates the total number of general-purpose input/output pins available on the component. Compare this when selecting microcontrollers or processors for your design. Verify against the datasheet to ensure sufficient pins for your application's interfaces and control signals.

6
CY8C20160-LDX2I Export Classifications & Environmental
ПараметрЗначение
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e4
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

3 (168 Hours)
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.31.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
CY8C20160-LDX2I Product Attribute
ПараметрЗначение
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tray
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2007
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

22 Weeks
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Obsolete
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~85°C
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

CMOS
Frequency

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

400kHz
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

QUAD
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.5mm
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

3V
HTS Code

Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.

8542.31.00.01
Nominal Supply Current

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

1.5mA
Memory Type

Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed.

ROMless
Number of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Surface Mount

Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.

YES
Reflow Temperature-Max (s)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

30
Number of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

16
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

16
Number of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

16
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Cypress Semiconductor
Operating Supply Current

The amount of current the device draws from its power supply during normal operation. This is essential for power budget calculations, thermal management, and selecting appropriate power sources. Check datasheet for typical and maximum values under specified conditions.

1.5mA
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

3mm
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

3mm
Interface

Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.

I2C
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

16-UFQFN
Memory Organization

Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration.

2KX1
Memory Width

Specifies the number of bits transferred simultaneously between the memory device and the controller. Wider buses enable higher data throughput. Verify this parameter against the datasheet to ensure compatibility with your system's bus architecture and expected performance.

1
Memory Density

Specifies the total memory capacity of a device, typically expressed in bits or bytes. This attribute is essential for selecting memory ICs, storage modules, or microcontrollers with embedded memory. Compare density to ensure sufficient storage for your application's code and data.

2048 bit
Data Rate

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

400 kbps
Type

Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches.

Buttons
Additional Feature

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

SRAM IS ORGANISED AS 512MB
LED Driver Channels

Number of independent output channels in an LED driver. Each channel can control a separate LED string or load. More channels allow individual dimming or color control. Verify channel count against datasheet for your application.

Up to 6
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

CapSense® Express™
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Interface - Sensor, Capacitive Touch
Manufacturer's Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

CY8C20160-LDX2I

Предпросмотр datasheet

Datasheet PDF viewer

Просмотрите datasheet для CY8C20160-LDX2I от Cypress Semiconductor, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.

Cypress Semiconductor

CY8C20160-LDX2I

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Документы уведомлений

PCN / product notice documents

0 документов

Публичные PCN / PDN записи сейчас не показаны

Для CY8C20160-LDX2I сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.

Частые вопросы

FAQ по товару

Точные ответы для покупателей, которые проверяют ordering code CY8C20160-LDX2I, упаковку, наличие, datasheet и путь замены.

Что означает CY8C20160-LDX2I?

CY8C20160-LDX2I — это точный ordering code для компонента категории Interface - Sensor, Capacitive Touch от Cypress Semiconductor. Текущий корпус указан как -, а контекст позиции включает IC CAPSENSE EXP 6 I/O 16QFN. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.

Как покупателям проверить ordering code CY8C20160-LDX2I?

Рассматривайте CY8C20160-LDX2I как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус -, документацию производителя Cypress Semiconductor, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.

В каком корпусе поставляется CY8C20160-LDX2I?

CY8C20160-LDX2I сейчас указан с корпусом - от Cypress Semiconductor. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.

CY8C20160-LDX2I сейчас доступен для заказа?

CY8C20160-LDX2I сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (-), указанный склад (80501), доступное количество (41964), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.

Где сравнить альтернативы для CY8C20160-LDX2I?

Для CY8C20160-LDX2I сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.