BUK9K5R1-30EX Transistors - FETs, MOSFETs - Arrays от Nexperia

Specifies the field-effect transistor technology, such as MOSFET, JFET, or HEMT. This determines switching speed, on-resistance, and voltage ratings. Verify the exact technology against the datasheet to ensure compatibility with your circuit design and performance requirements.

Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.

Maximum voltage that can be applied between drain and source terminals without causing breakdown. Critical for MOSFET selection in power circuits. Verify against datasheet for safe operating area and derating.

Indicates special characteristics of the field-effect transistor, such as logic-level gate drive, low threshold, or built-in ESD protection. Compare features to ensure compatibility with your driving circuit and application requirements. Verify against the datasheet for exact specifications.

Specifies the internal circuit topology or arrangement of the component, such as single, dual, or bridge configuration. This attribute helps engineers select the right part for their circuit design. Always verify the exact configuration against the datasheet to ensure compatibility with your application.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

JEDEC standard code that defines the package outline and dimensions. Use it to verify physical compatibility and footprint before PCB design. Compare with the datasheet to ensure the component meets your assembly and manufacturing requirements.

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Indicates how the component's case or package is electrically connected, such as to ground, a supply rail, or left floating. This affects thermal management, shielding, and circuit isolation. Always confirm with the datasheet to ensure proper PCB layout and avoid unintended shorts or noise coupling.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Specifies the functional mode of the component, such as continuous, pulsed, or burst. Engineers compare this to ensure the device operates correctly in their circuit topology. Verify the mode against the datasheet to match your application's requirements.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Specifies the intended circuit role, such as switching, amplification, or RF. Engineers compare this to ensure the transistor's characteristics match the design's requirements. Verify against the datasheet's application section before selecting.

Specifies the semiconductor material used in the transistor's active region. This affects electrical characteristics such as switching speed and voltage rating. Verify the material against the datasheet when selecting for high-frequency or high-power applications.

Maximum continuous current the MOSFET can conduct in the on-state without exceeding thermal limits. Compare this rating with your circuit's peak and average current demands. Always verify against the datasheet's thermal resistance and ambient temperature conditions.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Maximum on-state resistance between drain and source for MOSFETs when fully enhanced. This parameter affects power dissipation and efficiency in switching applications. Lower resistance reduces losses and heat. Compare this value with your current requirements and check the gate drive voltage in the datasheet.

Minimum drain-to-source breakdown voltage for MOSFETs. This value indicates the maximum voltage the device can block in the off-state. Engineers compare it with the operating voltage to ensure sufficient safety margin. Always verify against the datasheet for the specific test conditions.

Classification of field-effect transistor based on channel polarity and mode, such as N-channel or P-channel, enhancement or depletion. This determines the required gate drive polarity and circuit topology. Engineers select the appropriate type for switching or amplification applications. Always confirm the exact type from the datasheet before design.

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

Maximum gate threshold voltage at a specified drain current. This parameter indicates the gate voltage needed to begin conduction. Compare it with your gate drive voltage to ensure reliable switching. Verify against the datasheet for your operating conditions.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Maximum input capacitance of the MOSFET at a specified drain-source voltage. This value affects switching speed and gate drive requirements. Compare across devices to estimate switching losses and driver capability. Always verify against the datasheet for your operating conditions.

This is the total charge required to switch the MOSFET gate to a specified gate-source voltage. It determines switching speed and driver power losses. Compare values to optimize efficiency in high-frequency circuits. Verify against datasheet for your operating conditions.

Maximum drain-source on-resistance measured at a specified drain current and gate-source voltage. Lower values reduce conduction losses in power circuits. Compare this parameter when selecting MOSFETs for efficiency and thermal performance, and verify against the datasheet.

Maximum drain current under pulsed conditions, often specified with a pulse width and duty cycle. Compare this value with the continuous drain current rating to understand the device's peak current capability. Verify the pulse conditions in the datasheet to ensure they match your application's switching requirements.

Maximum power the component can safely dissipate under specified conditions. Compare across parts to ensure thermal limits are not exceeded in your application. Always verify against the datasheet's derating curve and ambient temperature ratings.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.