XC3S2000-4FGG456I Embedded - FPGAs (Field Programmable Gate Array) от Xilinx
XC3S2000-4FGG456I — это компонент категории Embedded - FPGAs (Field Programmable Gate Array) от Xilinx в упаковке BGA. Его обычно проверяют для IC FPGA 333 I/O 456FBGA. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
4 сертификата
ISO 9001
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
AS9120B
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
ISO 14001
Экологическая дисциплина в операционных и складских процессах.
ESD Control
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Процесс заказа
Подтвердите ключевые данные закупки для XC3S2000-4FGG456I до RFQ, выпуска PO и планирования отгрузки.
1
Подтвердить MPN
Укажите точный part number, производителя, package и approval constraints в RFQ.
2
Проверить склад и цену
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
3
Согласовать документы
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
4
Организовать отгрузку
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Проверка детали
Точный MPN подтвержден: XC3S2000-4FGG456I
Корпус для проверки: BGA
Коммерческие условия
Live stock и срок поставки подтверждены через RFQ
Финальная цена и налоговые условия подтверждены до выпуска PO
Отгрузка и документы
Ship-from location: склад Hong Kong
Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя
Обзор продукта
Обзор
Проверьте sourcing context для XC3S2000-4FGG456I от Xilinx, включая идентификацию товара, применимость, package notes и закупочные детали.
Features • Surface mouont type suitable for auto pick-and-place • Reflow soldering compatible • Supply voltage VCC=3.3/ 5.0V available • for DTV, DVD Applications
Технические параметры
Параметры
Сравните сгруппированные параметры XC3S2000-4FGG456I от Xilinx, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Parameter
Triac Type
Active
Product Parameter
Typical Quiescent Current (mA)
CMOS
Product Parameter
Transformer Type
yes
Product Parameter
On-state Resistance Match-Nom
Not Qualified
Product Parameter
Transmission Media Type
1.2V
Product Parameter
Total Resistance
Tray
XC3S2000-4FGG456I Product Parameter
Параметр
Значение
Triac Type
Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.
Active
Typical Quiescent Current (mA)
Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.
CMOS
Transformer Type
Indicates the construction or configuration of the transformer, such as flyback, forward, or planar. Affects performance, size, and application suitability. Refer to datasheet for detailed specifications and recommended usage.
yes
On-state Resistance Match-Nom
Indicates the nominal matching of on-state resistance between multiple channels in a device, such as a dual MOSFET or analog switch. This parameter is critical for parallel operation and current sharing. Verify the specified match against the datasheet to ensure balanced performance.
Not Qualified
Transmission Media Type
Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.
1.2V
Total Resistance
Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.
Tray
Nominal Attenuation
Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.
e1
Accessory Type
Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.
BOTTOM
Minimum Operating Supply Voltage
Specifies the lowest supply voltage at which the component remains fully functional. Compare this value with your system's power rail tolerance and verify it against the datasheet's recommended operating conditions to ensure reliable startup and operation.
BALL
Voltage Rating
Specifies the maximum continuous voltage the component can safely withstand without damage or performance degradation. Critical for ensuring proper operating margins in power supplies, signal lines, and isolation barriers. Always confirm with the datasheet for absolute maximum ratings.
30
Maximum Data Rate
Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.
1mm
Maximum Operating Supply Voltage
Highest supply voltage at which the component can operate normally without damage or performance degradation. Exceeding this limit may cause overheating or failure. Always check this parameter against your power supply design to ensure the component operates within its safe voltage range for reliable long-term performance.
250
Speed Grade
Speed grade indicates the maximum operating frequency or propagation delay category for digital ICs, memory, or programmable logic. Compare grades when selecting parts for timing-critical designs. Verify the exact speed rating in the datasheet to ensure it meets your system's clock and signal integrity requirements.
4
Number of Turns
Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance.
23mm
Typical Switching Frequency (kHz)
Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions.
Field Programmable Gate Arrays
Drain to Source Resistance
This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.
3A991.D
Collector-Emitter Voltage-Max
Maximum voltage that can be applied between collector and emitter without breakdown. Critical for BJT and IGBT selection. Verify against datasheet to ensure safe operation within your circuit's supply and transient conditions.
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
Indicates the total count of programmable logic elements or cells in the FPGA or CPLD. This parameter determines the device's logic capacity and complexity. Compare this value with your design requirements to ensure sufficient resources. Always verify against the datasheet for exact specifications.
46080
Filter Type
Specifies the filter topology used in the component, such as low-pass, high-pass, band-pass, or notch. This determines the frequency response and attenuation characteristics. Engineers must verify the filter type against the datasheet to ensure it meets the required signal conditioning and interference rejection for the application.
456
Output Peak Current Limit
Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.
2.6mm
Power Supplies
Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.
Spartan®-3
Capacitance
Capacitance value of the component, typically expressed in farads (pF, nF, µF). This parameter determines energy storage and filtering characteristics. Compare capacitance when selecting capacitors for power supply decoupling, signal coupling, or timing applications. Always check the rated voltage and tolerance in the datasheet.
333
Minimum Switching Frequency
Specifies the lowest switching frequency at which the power device can operate reliably. Compare this value with your application's required switching speed to ensure proper performance. Verify against the datasheet's recommended operating conditions.
1.21.2/3.32.5V
Output High Voltage-Min
Specifies the minimum voltage level that the output can drive when in a high logic state. Compare this value with the input high threshold of the receiving device to ensure proper logic compatibility. Verify against the datasheet for your operating conditions.
737280
Terminal Block Type
Specifies the mechanical configuration of the terminal block, such as pluggable, fixed, or barrier style. This affects mounting, wiring, and compatibility with mating connectors. Verify the exact type against the datasheet to ensure proper fit and reliable electrical connections in your assembly.
90kB
Number of LABs/CLBs
Indicates the count of logic array blocks or configurable logic blocks in an FPGA or CPLD. This metric helps compare logic capacity and complexity across devices. Verify against the datasheet for your specific design requirements.
5120
Configuration
Specifies the internal circuit topology or arrangement of the component, such as single, dual, or bridge configuration. This attribute helps engineers select the right part for their circuit design. Always verify the exact configuration against the datasheet to ensure compatibility with your application.
2000000
XC3S2000-4FGG456I Product Attribute
Параметр
Значение
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Housing Material
Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.
ROHS3 Compliant
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
Surface Mount
Max Supply Voltage
Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.
Surface Mount
Converter Type
Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.
3 (168 Hours)
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
2009
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Embedded - FPGAs (Field Programmable Gate Array)
Threshold Voltage
The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.
23mm
Input Power-Max (CW)
Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.
10 Weeks
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Xilinx
Number of I/O
Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.
333
Temperature Coefficient
Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.
1.14V~1.26V
Resistance
Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.
1.2V
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
-40°C~100°C TJ
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
Spartan®-3
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
456-BBGA
Data Rate
Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.
456
Temperature Grade
Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.
456
Bus Directional
Indicates whether the bus supports data flow in one direction only or in both directions. This affects signal routing and buffer design. Verify against the datasheet to ensure compatibility with your system's communication requirements.
0.61 ns
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
630MHz
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
XC3S2000
Manufacturer's Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
XC3S2000-4FGG456I
Предпросмотр datasheet
Datasheet PDF viewer
Просмотрите datasheet для XC3S2000-4FGG456I от Xilinx, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.
Для XC3S2000-4FGG456I сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
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Точные ответы для покупателей, которые проверяют ordering code XC3S2000-4FGG456I, упаковку, наличие, datasheet и путь замены.
Что означает XC3S2000-4FGG456I?
XC3S2000-4FGG456I — это точный ordering code для компонента категории Embedded - FPGAs (Field Programmable Gate Array) от Xilinx. Текущий корпус указан как BGA, а контекст позиции включает IC FPGA 333 I/O 456FBGA. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Как покупателям проверить ordering code XC3S2000-4FGG456I?
Рассматривайте XC3S2000-4FGG456I как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус BGA, документацию производителя Xilinx, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
В каком корпусе поставляется XC3S2000-4FGG456I?
XC3S2000-4FGG456I сейчас указан с корпусом BGA от Xilinx. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
XC3S2000-4FGG456I сейчас доступен для заказа?
XC3S2000-4FGG456I сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (BGA), указанный склад (41200), доступное количество (17422), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Где сравнить альтернативы для XC3S2000-4FGG456I?
Для XC3S2000-4FGG456I сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.