
IC FPGA 232 I/O 320FBGA ALIAS: XC3S500E-5FG320C
XC3S500E-4FTG256C — это компонент категории Embedded - FPGAs (Field Programmable Gate Array) от Xilinx в упаковке BGA. Его обычно проверяют для IC FPGA 190 I/O 256FTBGA. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

XC3S500E-4FTG256C
TCE000120904
BGA
Spartan®-3E
1
IC FPGA 190 I/O 256FTBGA
-
Сигналы доверия
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
Экологическая дисциплина в операционных и складских процессах.
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Подтвердите ключевые данные закупки для XC3S500E-4FTG256C до RFQ, выпуска PO и планирования отгрузки.
Укажите точный part number, производителя, package и approval constraints в RFQ.
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Обзор продукта
Проверьте sourcing context для XC3S500E-4FTG256C от Xilinx, включая идентификацию товара, применимость, package notes и закупочные детали.
Features
• Surface mouont type suitable for auto pick-and-place
• Reflow soldering compatible
• Supply voltage VCC=3.3/ 5.0V available
• for DTV, DVD Applications
Технические параметры
Сравните сгруппированные параметры XC3S500E-4FTG256C от Xilinx, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Parameter
Maximum Operating Supply Voltage
260
Product Parameter
Triac Type
Active
Product Parameter
Typical Quiescent Current (mA)
CMOS
Product Parameter
Drain to Source Resistance
EAR99
Product Parameter
Transformer Type
yes
Product Parameter
On-state Resistance Match-Nom
Not Qualified
| Параметр | Значение |
|---|---|
Maximum Operating Supply Voltage Highest supply voltage at which the component can operate normally without damage or performance degradation. Exceeding this limit may cause overheating or failure. Always check this parameter against your power supply design to ensure the component operates within its safe voltage range for reliable long-term performance. | 260 |
Triac Type Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements. | Active |
Typical Quiescent Current (mA) Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency. | CMOS |
Drain to Source Resistance This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature. | EAR99 |
Transformer Type Indicates the construction or configuration of the transformer, such as flyback, forward, or planar. Affects performance, size, and application suitability. Refer to datasheet for detailed specifications and recommended usage. | yes |
On-state Resistance Match-Nom Indicates the nominal matching of on-state resistance between multiple channels in a device, such as a dual MOSFET or analog switch. This parameter is critical for parallel operation and current sharing. Verify the specified match against the datasheet to ensure balanced performance. | Not Qualified |
Taper Specifies the resistance change curve of a potentiometer, such as linear or logarithmic. This affects how the output varies with rotation. Verify the taper type against your circuit requirements and the datasheet to ensure proper volume or control response. | 1mm |
Transmission Media Type Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues. | 1.2V |
Total Resistance Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation. | Tray |
Nominal Attenuation Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies. | e1 |
Accessory Type Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application. | BOTTOM |
Minimum Operating Supply Voltage Specifies the lowest supply voltage at which the component remains fully functional. Compare this value with your system's power rail tolerance and verify it against the datasheet's recommended operating conditions to ensure reliable startup and operation. | BALL |
Voltage Rating Specifies the maximum continuous voltage the component can safely withstand without damage or performance degradation. Critical for ensuring proper operating margins in power supplies, signal lines, and isolation barriers. Always confirm with the datasheet for absolute maximum ratings. | 30 |
Speed Grade Speed grade indicates the maximum operating frequency or propagation delay category for digital ICs, memory, or programmable logic. Compare grades when selecting parts for timing-critical designs. Verify the exact speed rating in the datasheet to ensure it meets your system's clock and signal integrity requirements. | 4 |
Typical Switching Frequency (kHz) Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions. | Field Programmable Gate Arrays |
Filter Type Specifies the filter topology used in the component, such as low-pass, high-pass, band-pass, or notch. This determines the frequency response and attenuation characteristics. Engineers must verify the filter type against the datasheet to ensure it meets the required signal conditioning and interference rejection for the application. | 256 |
Number of Turns Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance. | 17mm |
Collector-Emitter Voltage-Max Maximum voltage that can be applied between collector and emitter without breakdown. Critical for BJT and IGBT selection. Verify against datasheet to ensure safe operation within your circuit's supply and transient conditions. | FIELD PROGRAMMABLE GATE ARRAY |
Minimum Switching Frequency Specifies the lowest switching frequency at which the power device can operate reliably. Compare this value with your application's required switching speed to ensure proper performance. Verify against the datasheet's recommended operating conditions. | 1.21.2/3.32.5V |
Terminal Block Type Specifies the mechanical configuration of the terminal block, such as pluggable, fixed, or barrier style. This affects mounting, wiring, and compatibility with mating connectors. Verify the exact type against the datasheet to ensure proper fit and reliable electrical connections in your assembly. | 45kB |
Power Supplies Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues. | Spartan®-3E |
Number of LABs/CLBs Indicates the count of logic array blocks or configurable logic blocks in an FPGA or CPLD. This metric helps compare logic capacity and complexity across devices. Verify against the datasheet for your specific design requirements. | 1164 |
Output High Voltage-Min Specifies the minimum voltage level that the output can drive when in a high logic state. Compare this value with the input high threshold of the receiving device to ensure proper logic compatibility. Verify against the datasheet for your operating conditions. | 368640 |
Number of Logic Elements/Cells Indicates the total count of programmable logic elements or cells in the FPGA or CPLD. This parameter determines the device's logic capacity and complexity. Compare this value with your design requirements to ensure sufficient resources. Always verify against the datasheet for exact specifications. | 10476 |
Capacitance Capacitance value of the component, typically expressed in farads (pF, nF, µF). This parameter determines energy storage and filtering characteristics. Compare capacitance when selecting capacitors for power supply decoupling, signal coupling, or timing applications. Always check the rated voltage and tolerance in the datasheet. | 149 |
Configuration Specifies the internal circuit topology or arrangement of the component, such as single, dual, or bridge configuration. This attribute helps engineers select the right part for their circuit design. Always verify the exact configuration against the datasheet to ensure compatibility with your application. | 500000 |
| Параметр | Значение |
|---|---|
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Housing Material Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure. | ROHS3 Compliant |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | Surface Mount |
Locking Feature Indicates the locking mechanism used to secure the connector or terminal in place. Choose the appropriate type for your application to ensure reliable mating and vibration resistance. Verify compatibility with the mating part and datasheet specifications. | Lead Free |
Max Supply Voltage Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions. | Surface Mount |
Converter Type Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part. | 3 (168 Hours) |
Number of I/O Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application. | 190 |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 256-LBGA |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 2008 |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - FPGAs (Field Programmable Gate Array) |
Input Power-Max (CW) Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems. | 10 Weeks |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Xilinx |
Radiation Hardening Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet. | 0°C~85°C TJ |
Temperature Grade Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements. | 256 |
Threshold Voltage The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature. | 17mm |
Data Rate Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols. | 256 |
Temperature Coefficient Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment. | 1.14V~1.26V |
Resistance Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation. | 1.2V |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | Spartan®-3E |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | XC3S500E-4FTG256C |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | XC3S500E |
Bus Directional Indicates whether the bus supports data flow in one direction only or in both directions. This affects signal routing and buffer design. Verify against the datasheet to ensure compatibility with your system's communication requirements. | 0.76 ns |
FWFT Support First-word fall-through (FWFT) support indicates whether a FIFO memory device can output the first stored word without a read request. This feature reduces latency in data streaming. Check the datasheet to confirm FWFT mode availability and its effect on system timing. | 9312 |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | 572MHz |
Предпросмотр datasheet
Просмотрите datasheet для XC3S500E-4FTG256C от Xilinx, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.
Документы уведомлений
Для XC3S500E-4FTG256C сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
Посмотрите больше компонентов из той же подкатегории, чтобы сравнить наличие, совместимость и варианты закупки.

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Частые вопросы
Точные ответы для покупателей, которые проверяют ordering code XC3S500E-4FTG256C, упаковку, наличие, datasheet и путь замены.
XC3S500E-4FTG256C — это точный ordering code для компонента категории Embedded - FPGAs (Field Programmable Gate Array) от Xilinx. Текущий корпус указан как BGA, а контекст позиции включает IC FPGA 190 I/O 256FTBGA. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Рассматривайте XC3S500E-4FTG256C как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус BGA, документацию производителя Xilinx, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
XC3S500E-4FTG256C сейчас указан с корпусом BGA от Xilinx. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
На этой странице сейчас показано 1 публичные складские записи для XC3S500E-4FTG256C с указанным количеством 10 шт. Перед заказом подтвердите корпус (BGA), нужное количество, live availability, срок поставки, финальную цену, date code, MOQ, упаковку и документы RFQ.
Для XC3S500E-4FTG256C сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.