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XC3S500E-4FTG256C Embedded - FPGAs (Field Programmable Gate Array) от Xilinx

XC3S500E-4FTG256C — это компонент категории Embedded - FPGAs (Field Programmable Gate Array) от Xilinx в упаковке BGA. Его обычно проверяют для IC FPGA 190 I/O 256FTBGA. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

В наличииDatasheet

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XC3S500E-4FTG256C Embedded - FPGAs (Field Programmable Gate Array) от Xilinx | TrustCompo
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  • Гарантия 365 днейПоддержка после покупки помогает закупщикам разбирать вопросы качества в понятный срок проверки.
  • Отправка в течение 24-48 часовДоступные позиции могут быть быстро отправлены после подтверждения цены, количества и деталей доставки.
  • 100% проверка на контрафактКомпоненты проходят проверку подлинности и инспекцию перед отгрузкой.

Ключевые характеристики

Номер детали

XC3S500E-4FTG256C

Внутренний код

TCE000120904

Упаковка

BGA

Производитель
Xilinx

Ключевые характеристики

Серия

Spartan®-3E

Минимальное количество

1

Категория
Integrated Circuits (ICs)
Описание

IC FPGA 190 I/O 256FTBGA

Основные характеристики

-

Техническое описание
Открыть datasheet XC3S500E-4FTG256C

Сигналы доверия

Качество и доверие

Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.

4 сертификата
  • ISO 9001

    Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.

  • AS9120B

    Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.

  • ISO 14001

    Экологическая дисциплина в операционных и складских процессах.

  • ESD Control

    Стандарты защиты от электростатического разряда для чувствительных компонентов.

RFQ checklist

Процесс заказа

Подтвердите ключевые данные закупки для XC3S500E-4FTG256C до RFQ, выпуска PO и планирования отгрузки.

  1. 1

    Подтвердить MPN

    Укажите точный part number, производителя, package и approval constraints в RFQ.

  2. 2

    Проверить склад и цену

    Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.

  3. 3

    Согласовать документы

    Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.

  4. 4

    Организовать отгрузку

    Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.

Перед выпуском PO

Проверка детали

  • Точный MPN подтвержден: XC3S500E-4FTG256C
  • Корпус для проверки: BGA

Коммерческие условия

  • Live stock и срок поставки подтверждены через RFQ
  • Финальная цена и налоговые условия подтверждены до выпуска PO

Отгрузка и документы

  • Ship-from location: склад Hong Kong
  • Способ доставки: DHL, FedEx, UPS или аккаунт экспедитора покупателя

Обзор продукта

Обзор

Проверьте sourcing context для XC3S500E-4FTG256C от Xilinx, включая идентификацию товара, применимость, package notes и закупочные детали.


Features
• Surface mouont type suitable for auto pick-and-place
• Reflow soldering compatible
• Supply voltage VCC=3.3/ 5.0V available
• for DTV, DVD Applications

Технические параметры

Параметры

Сравните сгруппированные параметры XC3S500E-4FTG256C от Xilinx, включая package, series, key attributes и technical values для engineering и sourcing review.

  • Product Parameter

    Maximum Operating Supply Voltage

    260

  • Product Parameter

    Triac Type

    Active

  • Product Parameter

    Typical Quiescent Current (mA)

    CMOS

  • Product Parameter

    Drain to Source Resistance

    EAR99

  • Product Parameter

    Transformer Type

    yes

  • Product Parameter

    On-state Resistance Match-Nom

    Not Qualified

XC3S500E-4FTG256C Product Parameter
ПараметрЗначение
Maximum Operating Supply Voltage

Highest supply voltage at which the component can operate normally without damage or performance degradation. Exceeding this limit may cause overheating or failure. Always check this parameter against your power supply design to ensure the component operates within its safe voltage range for reliable long-term performance.

260
Triac Type

Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.

Active
Typical Quiescent Current (mA)

Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.

CMOS
Drain to Source Resistance

This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.

EAR99
Transformer Type

Indicates the construction or configuration of the transformer, such as flyback, forward, or planar. Affects performance, size, and application suitability. Refer to datasheet for detailed specifications and recommended usage.

yes
On-state Resistance Match-Nom

Indicates the nominal matching of on-state resistance between multiple channels in a device, such as a dual MOSFET or analog switch. This parameter is critical for parallel operation and current sharing. Verify the specified match against the datasheet to ensure balanced performance.

Not Qualified
Taper

Specifies the resistance change curve of a potentiometer, such as linear or logarithmic. This affects how the output varies with rotation. Verify the taper type against your circuit requirements and the datasheet to ensure proper volume or control response.

1mm
Transmission Media Type

Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.

1.2V
Total Resistance

Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.

Tray
Nominal Attenuation

Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.

e1
Accessory Type

Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.

BOTTOM
Minimum Operating Supply Voltage

Specifies the lowest supply voltage at which the component remains fully functional. Compare this value with your system's power rail tolerance and verify it against the datasheet's recommended operating conditions to ensure reliable startup and operation.

BALL
Voltage Rating

Specifies the maximum continuous voltage the component can safely withstand without damage or performance degradation. Critical for ensuring proper operating margins in power supplies, signal lines, and isolation barriers. Always confirm with the datasheet for absolute maximum ratings.

30
Speed Grade

Speed grade indicates the maximum operating frequency or propagation delay category for digital ICs, memory, or programmable logic. Compare grades when selecting parts for timing-critical designs. Verify the exact speed rating in the datasheet to ensure it meets your system's clock and signal integrity requirements.

4
Typical Switching Frequency (kHz)

Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions.

Field Programmable Gate Arrays
Filter Type

Specifies the filter topology used in the component, such as low-pass, high-pass, band-pass, or notch. This determines the frequency response and attenuation characteristics. Engineers must verify the filter type against the datasheet to ensure it meets the required signal conditioning and interference rejection for the application.

256
Number of Turns

Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance.

17mm
Collector-Emitter Voltage-Max

Maximum voltage that can be applied between collector and emitter without breakdown. Critical for BJT and IGBT selection. Verify against datasheet to ensure safe operation within your circuit's supply and transient conditions.

FIELD PROGRAMMABLE GATE ARRAY
Minimum Switching Frequency

Specifies the lowest switching frequency at which the power device can operate reliably. Compare this value with your application's required switching speed to ensure proper performance. Verify against the datasheet's recommended operating conditions.

1.21.2/3.32.5V
Terminal Block Type

Specifies the mechanical configuration of the terminal block, such as pluggable, fixed, or barrier style. This affects mounting, wiring, and compatibility with mating connectors. Verify the exact type against the datasheet to ensure proper fit and reliable electrical connections in your assembly.

45kB
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

Spartan®-3E
Number of LABs/CLBs

Indicates the count of logic array blocks or configurable logic blocks in an FPGA or CPLD. This metric helps compare logic capacity and complexity across devices. Verify against the datasheet for your specific design requirements.

1164
Output High Voltage-Min

Specifies the minimum voltage level that the output can drive when in a high logic state. Compare this value with the input high threshold of the receiving device to ensure proper logic compatibility. Verify against the datasheet for your operating conditions.

368640
Number of Logic Elements/Cells

Indicates the total count of programmable logic elements or cells in the FPGA or CPLD. This parameter determines the device's logic capacity and complexity. Compare this value with your design requirements to ensure sufficient resources. Always verify against the datasheet for exact specifications.

10476
Capacitance

Capacitance value of the component, typically expressed in farads (pF, nF, µF). This parameter determines energy storage and filtering characteristics. Compare capacitance when selecting capacitors for power supply decoupling, signal coupling, or timing applications. Always check the rated voltage and tolerance in the datasheet.

149
Configuration

Specifies the internal circuit topology or arrangement of the component, such as single, dual, or bridge configuration. This attribute helps engineers select the right part for their circuit design. Always verify the exact configuration against the datasheet to ensure compatibility with your application.

500000
XC3S500E-4FTG256C Product Attribute
ПараметрЗначение
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Housing Material

Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.

ROHS3 Compliant
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Surface Mount
Locking Feature

Indicates the locking mechanism used to secure the connector or terminal in place. Choose the appropriate type for your application to ensure reliable mating and vibration resistance. Verify compatibility with the mating part and datasheet specifications.

Lead Free
Max Supply Voltage

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Surface Mount
Converter Type

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

3 (168 Hours)
Number of I/O

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

190
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

256-LBGA
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

2008
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Embedded - FPGAs (Field Programmable Gate Array)
Input Power-Max (CW)

Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.

10 Weeks
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Xilinx
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

0°C~85°C TJ
Temperature Grade

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

256
Threshold Voltage

The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.

17mm
Data Rate

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

256
Temperature Coefficient

Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.

1.14V~1.26V
Resistance

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

1.2V
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Spartan®-3E
Manufacturer's Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

XC3S500E-4FTG256C
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

XC3S500E
Bus Directional

Indicates whether the bus supports data flow in one direction only or in both directions. This affects signal routing and buffer design. Verify against the datasheet to ensure compatibility with your system's communication requirements.

0.76 ns
FWFT Support

First-word fall-through (FWFT) support indicates whether a FIFO memory device can output the first stored word without a read request. This feature reduces latency in data streaming. Check the datasheet to confirm FWFT mode availability and its effect on system timing.

9312
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

572MHz

Предпросмотр datasheet

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Просмотрите datasheet для XC3S500E-4FTG256C от Xilinx, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.

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Документы уведомлений

PCN / product notice documents

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Публичные PCN / PDN записи сейчас не показаны

Для XC3S500E-4FTG256C сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.

Частые вопросы

FAQ по товару

Точные ответы для покупателей, которые проверяют ordering code XC3S500E-4FTG256C, упаковку, наличие, datasheet и путь замены.

Что означает XC3S500E-4FTG256C?

XC3S500E-4FTG256C — это точный ordering code для компонента категории Embedded - FPGAs (Field Programmable Gate Array) от Xilinx. Текущий корпус указан как BGA, а контекст позиции включает IC FPGA 190 I/O 256FTBGA. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.

Как покупателям проверить ordering code XC3S500E-4FTG256C?

Рассматривайте XC3S500E-4FTG256C как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус BGA, документацию производителя Xilinx, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.

В каком корпусе поставляется XC3S500E-4FTG256C?

XC3S500E-4FTG256C сейчас указан с корпусом BGA от Xilinx. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.

XC3S500E-4FTG256C есть в наличии у TrustCompo?

На этой странице сейчас показано 1 публичные складские записи для XC3S500E-4FTG256C с указанным количеством 10 шт. Перед заказом подтвердите корпус (BGA), нужное количество, live availability, срок поставки, финальную цену, date code, MOQ, упаковку и документы RFQ.

Где сравнить альтернативы для XC3S500E-4FTG256C?

Для XC3S500E-4FTG256C сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.