
DIODE GEN PURP 300V 100MA MINI3
DB2S31400L — это компонент категории Diodes - Rectifiers - Single от Panasonic в упаковке SOD523. Его обычно проверяют для DIODE SCHOTTKY 30V 30MA SSMINI2. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

DB2S31400L
TCE000120976
SOD523
-
1
DIODE SCHOTTKY 30V 30MA SSMINI2
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Сигналы доверия
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
Экологическая дисциплина в операционных и складских процессах.
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Подтвердите ключевые данные закупки для DB2S31400L до RFQ, выпуска PO и планирования отгрузки.
Укажите точный part number, производителя, package и approval constraints в RFQ.
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Технические параметры
Сравните сгруппированные параметры DB2S31400L от Panasonic, включая package, series, key attributes и technical values для engineering и sourcing review.
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Export Classifications & Environmental
RoHS Status
RoHS Compliant
Export Classifications & Environmental
REACH SVHC
No SVHC
Export Classifications & Environmental
HTSUS
8541.10.0070
Export Classifications & Environmental
ECCN Code
EAR99
Export Classifications & Environmental
JESD-609 Code
e6
| Параметр | Значение |
|---|---|
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 1 (Unlimited) |
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | RoHS Compliant |
REACH SVHC Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status. | No SVHC |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8541.10.0070 |
ECCN Code Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally. | EAR99 |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e6 |
| Параметр | Значение |
|---|---|
Diode Type Select the diode classification such as Schottky, Zener, or standard rectifier. This defines the device's electrical behavior and typical applications. Verify the exact type against the datasheet to ensure it meets your circuit requirements for voltage, current, and switching speed. | Schottky |
Speed Specifies the maximum clock frequency or data rate of the component. This is critical for timing and performance. Verify the speed grade in the datasheet to ensure it meets your system's throughput requirements and that signal integrity is maintained at that speed. | Small Signal =< 200mA (Io), Any Speed |
Operating Temperature - Junction Specifies the allowable junction temperature range for a semiconductor device. Exceeding this range can degrade performance or cause failure. Engineers should verify this parameter against the datasheet for thermal management and reliability assessment in their application. | 125°C Max |
Number of Elements Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements. | 1 |
Diode Element Material Semiconductor material used in the diode, such as silicon, germanium, or gallium arsenide. Affects forward voltage, speed, and temperature behavior. Choose based on your application's voltage, current, and switching requirements. Verify with datasheet specifications. | SILICON |
Forward Voltage Forward voltage is the voltage drop across a diode or LED when it conducts current in the forward direction. It affects power dissipation and efficiency. Compare this value with your circuit's supply voltage and check the datasheet for the specified test current. | 1V |
Max Reverse Voltage (DC) Specifies the maximum continuous DC voltage that can be applied in the reverse direction without causing breakdown. Critical for rectifier and protection diodes. Verify against datasheet to ensure safe operating margin in your circuit. | 30V |
Max Repetitive Reverse Voltage (Vrrm) Indicates the highest repetitive reverse voltage the diode can withstand in blocking mode. Engineers compare this to the circuit's peak reverse stress to ensure reliable operation. Always verify against the datasheet for your specific application. | 30V |
Reverse Recovery Time Time for a diode to transition from conducting to blocking state. Critical for switching losses in power circuits. Compare values when designing high-frequency converters or rectifiers. Verify against datasheet under specified test conditions. | 1 ns |
Forward Current Specifies the maximum continuous forward current the component can handle without damage. Compare this rating with your circuit's operating current to ensure reliable performance. Always verify against the datasheet for derating curves and temperature conditions. | 30mA |
Average Rectified Current Average value of the rectified current that the device can handle continuously. Compare this rating with your circuit's average load current to ensure reliable operation. Verify against the datasheet's thermal and derating curves for safe design. | 30mA |
Peak Reverse Current Specifies the highest reverse current that flows through the component when the rated reverse voltage is applied. Compare this value across diodes and rectifiers to ensure minimal leakage and stable operation. Verify against the datasheet for your operating temperature and voltage conditions. | 300nA |
Max Forward Surge Current (Ifsm) Specifies the maximum non-repetitive forward surge current the diode can handle for a short duration, typically during inrush or fault conditions. Compare with your circuit's worst-case surge to prevent damage. Check the datasheet for pulse duration and waveform. | 150mA |
Current - Reverse Leakage @ Vr Small current flowing through a semiconductor junction when reverse voltage is applied. Lower leakage is preferred for precision and low-power circuits. Check this parameter at the specified reverse voltage to ensure it meets your application's requirements. | 300nA @ 30V |
Forward Voltage (Vf) Max @ If This is the maximum voltage drop across the diode or LED when conducting the specified forward current. It affects power dissipation and efficiency. Compare this value with your circuit's supply voltage and current to ensure proper operation. Always verify against the datasheet for your specific part. | 1V @ 30mA |
Peak Non-Repetitive Surge Current Maximum allowable surge current for a short duration, typically specified for diodes and thyristors. This value indicates the device's ability to withstand transient overcurrents without damage. Verify against datasheet for reliability in surge-prone applications. | 150mA |
| Параметр | Значение |
|---|---|
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | EAR99 |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Max Operating Temperature Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage. | 125°C |
Minimum Operating Temperature Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs. | -55°C |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tape & Reel (TR) |
Factory Lead Time Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions. | 10 Weeks |
Published Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions. | 2010 |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Discontinued |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | DUAL |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Panasonic |
Element Configuration Describes the internal arrangement of components, such as resistor networks or switch contacts. This affects the circuit topology and pinout. Engineers must verify this configuration against the datasheet to ensure correct integration into the PCB layout and proper functionality. | Single |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Discrete Semiconductor Products |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Diodes - Rectifiers - Single |
Contact Plating Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment. | Tin |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Number of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 2 |
REACH Compliance Code Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market. | unknown |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | FLAT |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | NOT SPECIFIED |
Reflow Temperature-Max (s) Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions. | NOT SPECIFIED |
Number of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 2 |
Height Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations. | 600μm |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | SC-79, SOD-523 |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 800μm |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 1.2mm |
Average Rectified Current (Io) Specifies the maximum average forward current a diode or rectifier can handle continuously. Compare this value with your circuit's average load current to ensure reliable operation. Verify against the datasheet's thermal derating curves for safe operation. | 30mA DC |
HTS Code Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping. | 8541.10.00.60 |
Frequency Band Indicates the range of frequencies over which the component is designed to operate with specified performance. Use to match your application's signal frequency. Confirm with datasheet graphs for impedance, gain, or attenuation across the band. | L B |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | DB2S31400L |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | DB2S314 |
Capacitance @ Vr, F Junction capacitance measured at a specified reverse voltage and frequency. This value affects switching speed and high-frequency performance. Compare it with your circuit's requirements and verify against the datasheet for accurate operation. | 1.5pF @ 10V 1MHz |
Предпросмотр datasheet
Просмотрите datasheet для DB2S31400L от Panasonic, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.
Документы уведомлений
Для DB2S31400L сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
Посмотрите больше компонентов из той же подкатегории, чтобы сравнить наличие, совместимость и варианты закупки.

DIODE GEN PURP 300V 100MA MINI3





Частые вопросы
Точные ответы для покупателей, которые проверяют ordering code DB2S31400L, упаковку, наличие, datasheet и путь замены.
DB2S31400L — это точный ordering code для компонента категории Diodes - Rectifiers - Single от Panasonic. Текущий корпус указан как SOD523, а контекст позиции включает DIODE SCHOTTKY 30V 30MA SSMINI2. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Рассматривайте DB2S31400L как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус SOD523, документацию производителя Panasonic, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
DB2S31400L сейчас указан с корпусом SOD523 от Panasonic. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
DB2S31400L сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (SOD523), указанный склад (96598), доступное количество (84252), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Для DB2S31400L сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.