
IC MCU 8BIT 16KB FLASH 48SQFP
LC87F5M64AU-QIP-E — это компонент категории Embedded - Microcontrollers от ON Semiconductor в упаковке упаковке, указанной производителем. Его обычно проверяют для IC MCU 8BIT 64KB FLASH 64QIPE. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

LC87F5M64AU-QIP-E
TCE000118249
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1
IC MCU 8BIT 64KB FLASH 64QIPE
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Сигналы доверия
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
Экологическая дисциплина в операционных и складских процессах.
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Подтвердите ключевые данные закупки для LC87F5M64AU-QIP-E до RFQ, выпуска PO и планирования отгрузки.
Укажите точный part number, производителя, package и approval constraints в RFQ.
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Обзор продукта
Проверьте sourcing context для LC87F5M64AU-QIP-E от ON Semiconductor, включая идентификацию товара, применимость, package notes и закупочные детали.
ispMACH 4000 Introduction
The high performance ispMACH 4000 family from Lattice offers a SuperFAST CPLD solution.
The family is a blend of Lattice’s two most popular architectures: the ispLSI® 2000 and ispMACH 4A. Retaining the best of both families, the ispMACH 4000 architecture focuses on significant innovations to combine the highest performance with low power in a flexible CPLD family.
Features
• High Performance
• fMAX = 400MHz maximum operating frequency
• tPD = 2.5ns propagation delay
• Up to four global clock pins with programmable clock polarity control
• Up to 80 PTs per output
• Ease of Design
• Enhanced macrocells with individual clock, reset, preset and clock enable controls
• Up to four global OE controls
• Individual local OE control per I/O pin
• Excellent First-Time-FitTM and refit
• Fast path, SpeedLockingTM Path, and wide-PT path
• Wide input gating (36 input logic blocks) for fast counters, state machines and address decoders
• Zero Power (ispMACH 4000Z) and Low Power (ispMACH 4000V/B/C)
• Typical static current 10µA (4032Z)
• Typical static current 1.3mA (4000C)
• 1.8V core low dynamic power
• ispMACH 4000Z operational down to 1.6V VCC
• Broad Device Offering
• Multiple temperature range support
– Commercial: 0 to 90°C junction (Tj)
– Industrial: -40 to 105°C junction (Tj)
– Extended: -40 to 130°C junction (Tj)
• For AEC-Q100 compliant devices, refer to LA-ispMACH 4000V/Z Automotive Data Sheet
• Easy System Integration
• Superior solution for power sensitive consumer applications
• Operation with 3.3V, 2.5V or 1.8V LVCMOS I/O
• Operation with 3.3V (4000V), 2.5V (4000B) or 1.8V (4000C/Z) supplies
• 5V tolerant I/O for LVCMOS 3.3, LVTTL, and PCI interfaces
• Hot-socketing
• Open-drain capability
• Input pull-up, pull-down or bus-keeper
• Programmable output slew rate
• 3.3V PCI compatible
• IEEE 1149.1 boundary scan testable
• 3.3V/2.5V/1.8V In-System Programmable (ISP™) using IEEE 1532 compliant interface
• I/O pins with fast setup path
• Lead-free package options
Технические параметры
Сравните сгруппированные параметры LC87F5M64AU-QIP-E от ON Semiconductor, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Attribute
Packaging
Tray
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
ECCN
EAR99
Product Attribute
Lead Free
Lead Free
Product Attribute
Mounting Type
Surface Mount
Product Attribute
Factory Lead Time
4 Weeks
| Параметр | Значение |
|---|---|
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tray |
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | EAR99 |
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Factory Lead Time Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions. | 4 Weeks |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | GULL WING |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Published Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions. | 2013 |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 0.8mm |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | QUAD |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~85°C TA |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Microcontrollers |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - Microcontrollers |
HTS Code Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping. | 8542.31.00.01 |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | ON Semiconductor |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 12MHz |
Memory Type Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed. | FLASH, ROM |
Surface Mount Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process. | YES |
Radiation Hardening Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet. | No |
Number of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 64 |
Number of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 64 |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 64 |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Operating Supply Voltage Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction. | 3V |
Number of I/O Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application. | 50 |
Max Power Dissipation Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions. | 300mW |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 64-BQFP |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | LC87F5M64AU-QIP-E |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | 2-Wire, UART, USART |
| Параметр | Значение |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | RoHS Compliant |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.31.0001 |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e6 |
| Параметр | Значение |
|---|---|
Oscillator Type Specifies the oscillator circuit type used for clock generation in the component. Compare crystal, ceramic, RC, or MEMS types to match frequency stability and startup requirements. Verify against the datasheet for your application. | Internal |
RAM Size Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering. | 2K x 8 |
Core Size Indicates the bit width of the processor core, such as 8-bit, 16-bit, or 32-bit. This determines the maximum data size the CPU can handle in one operation. Compare this with your software requirements and memory addressing needs to ensure compatibility with your application. | 8-Bit |
uPs/uCs/Peripheral ICs Type Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements. | MICROCONTROLLER |
Memory Size Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in. | 64kB |
Program Memory Size Indicates the amount of non-volatile memory available for storing firmware or program code. This determines the maximum code size that can be executed. Verify that the program memory size is sufficient for your application's firmware, including future updates or additional features. | 64KB 64K x 8 |
Bit Size Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements. | 8 |
Program Memory Type Technology used for storing firmware, such as Flash, EEPROM, or OTP. Determines reprogrammability, endurance, and write speed. Choose based on update requirements and production volume. Verify the memory size and programming interface in the datasheet. | FLASH |
Data Bus Width Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance. | 8b |
Watchdog Timer Indicates whether the component includes a watchdog timer and its type. This timer resets the system if software hangs, improving reliability. Verify the timeout period and enable/disable options in the datasheet for your application. | Yes |
Number of Timers/Counters Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features. | 7 |
RAM Size (bytes) Amount of volatile memory available for runtime data and stack. Larger RAM enables more complex applications and buffering. Compare with your software's memory footprint and verify against the datasheet to avoid overflow and ensure reliable operation. | 2048 |
Data Converter Specifies whether the component is an analog-to-digital or digital-to-analog converter. This attribute helps identify the conversion direction and architecture. Verify the exact type and resolution in the datasheet to ensure compatibility with your signal chain and system requirements. | A/D 11x8b |
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Tin/Bismuth (Sn/Bi) |
Peripherals Lists the integrated peripheral components such as ADCs, DACs, PWM controllers, comparators, and communication modules. These features reduce external component count and system cost. Engineers should compare available peripherals to ensure they cover all required functions without additional ICs. | PWM, WDT |
Connectivity Indicates the communication interfaces supported by the component, such as UART, SPI, I2C, USB, or Ethernet. Engineers compare this to ensure the device can interface with the rest of the system. Verify the exact interface versions and pin assignments in the datasheet. | SIO, UART/USART |
Number of Programmable I/O Indicates the total number of input/output pins that can be configured by the user. This is critical for FPGA, CPLD, and microcontroller designs. Verify against the datasheet to ensure sufficient I/O for your application. | 55 |
Power Supplies Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues. | 2.2/5V |
Supply Current-Max Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load. | 18.5mA |
Voltage - Supply (Vcc/Vdd) Indicates the recommended supply voltage range for the component. This is critical for proper operation and must be matched to your power rail. Always verify the absolute maximum ratings and recommended operating conditions in the datasheet to avoid damage or malfunction. | 2.2V~5.5V |
Предпросмотр datasheet
Просмотрите datasheet для LC87F5M64AU-QIP-E от ON Semiconductor, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.
Документы уведомлений
Для LC87F5M64AU-QIP-E сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
Посмотрите больше компонентов из той же подкатегории, чтобы сравнить наличие, совместимость и варианты закупки.

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Частые вопросы
Точные ответы для покупателей, которые проверяют ordering code LC87F5M64AU-QIP-E, упаковку, наличие, datasheet и путь замены.
LC87F5M64AU-QIP-E — это точный ordering code для компонента категории Embedded - Microcontrollers от ON Semiconductor. Текущий корпус указан как -, а контекст позиции включает IC MCU 8BIT 64KB FLASH 64QIPE. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Рассматривайте LC87F5M64AU-QIP-E как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус -, документацию производителя ON Semiconductor, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
LC87F5M64AU-QIP-E сейчас указан с корпусом - от ON Semiconductor. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
LC87F5M64AU-QIP-E сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (-), указанный склад (11043), доступное количество (11043), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Для LC87F5M64AU-QIP-E сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.