
IC SERIAL CFG PROM 128K 8-SOIC
EPCQ128SI16N — это компонент категории Memory - Configuration Proms for FPGAs от Intel в упаковке 16SOIC. Его обычно проверяют для IC CONFIG DEVICE 128MBIT 16SOIC. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

EPCQ128SI16N
TCE000120214
16SOIC
EPCQ
1
IC CONFIG DEVICE 128MBIT 16SOIC
-
Сигналы доверия
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RFQ checklist
Подтвердите ключевые данные закупки для EPCQ128SI16N до RFQ, выпуска PO и планирования отгрузки.
Укажите точный part number, производителя, package и approval constraints в RFQ.
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Перед выпуском PO
Обзор продукта
Проверьте sourcing context для EPCQ128SI16N от Intel, включая идентификацию товара, применимость, package notes и закупочные детали.
FeaturesEPCQ devices offer the following features:
• Serial or quad-serial FPGA configuration in devices that support active serial (AS) x1 or AS x4 configuration schemes
• Low cost, low pin count, and non-volatile memory
• 2.7-V to 3.6-V operation
• Available in 8- and 16-pin small-outline integrated circuit (SOIC) package
• Reprogrammable memory with more than 100,000 erase or program cycles
• Write protection support for memory sectors using status register bits
• Fast read, extended dual input fast read, and extended quad input fast read of the entire memory using a single operation code
• Write bytes, extended dual input fast write bytes, and extended quad input fast write bytes of the entire memory using a single operation code
• Reprogrammable with an external microprocessor using the SRunner software driver
• In-system programming (ISP) support with the SRunner software driver
• ISP support with USB-Blaster, EthernetBlaster II, or EthernetBlaster download cables
Технические параметры
Сравните сгруппированные параметры EPCQ128SI16N от Intel, включая package, series, key attributes и technical values для engineering и sourcing review.
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
Packaging
Tube
Product Attribute
Mounting Type
Surface Mount
Product Attribute
Part Status
Obsolete
Product Attribute
Operating Temperature
-40°C~85°C
Product Attribute
Categories
Integrated Circuits (ICs)
| Параметр | Значение |
|---|---|
REACH Status Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold. | REACH Unaffected |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tube |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~85°C |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | DUAL |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | GULL WING |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Qualification Status Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements. | Not Qualified |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 10.3mm |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 16-SOIC (0.295, 7.50mm Width) |
Number of Functions Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements. | 1 |
Surface Mount Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process. | YES |
Reflow Temperature-Max (s) Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions. | 40 |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 7.5mm |
Number of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 16 |
Terminal Pitch Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing. | 1.27mm |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 3.3V |
REACH Compliance Code Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market. | compliant |
HTS Code Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping. | 8542.32.00.51 |
Endurance Indicates the number of program/erase cycles a memory device can withstand before performance degrades. This is critical for flash and EEPROM in applications with frequent writes. Engineers compare endurance to ensure data retention and reliability over the product's lifetime. Verify the specified endurance rating in the datasheet. | 100000 Write/Erase Cycles |
Published Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions. | 2018 |
Clock Frequency Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values. | 20MHz |
Standby Current-Max Maximum current drawn by the component when in standby or sleep mode. Lower values extend battery life in portable designs. Verify against datasheet conditions, as standby current can vary with supply voltage and temperature. | 0.0001A |
Memory Width Specifies the number of bits transferred simultaneously between the memory device and the controller. Wider buses enable higher data throughput. Verify this parameter against the datasheet to ensure compatibility with your system's bus architecture and expected performance. | 1 |
Operating Mode Specifies the functional mode of the component, such as continuous, pulsed, or burst. Engineers compare this to ensure the device operates correctly in their circuit topology. Verify the mode against the datasheet to match your application's requirements. | SYNCHRONOUS |
Memory IC Type Specifies the memory technology and architecture of the integrated circuit, such as SRAM, DRAM, or Flash. Buyers use this to match the memory type required by their application. Verify the exact part number and datasheet for compatibility. | FLASH |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Flash Memories |
Memory Density Specifies the total memory capacity of a device, typically expressed in bits or bytes. This attribute is essential for selecting memory ICs, storage modules, or microcontrollers with embedded memory. Compare density to ensure sufficient storage for your application's code and data. | 134217728 bit |
Programmable Type Specifies the non-volatile memory technology used for device configuration, such as OTP, flash, or EEPROM. This determines how firmware or settings are stored and updated. Verify the programmable type against the datasheet to ensure it matches your production programming and field update requirements. | In System Programmable |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Intel |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | 3A991B1B1 |
Memory Organization Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration. | 128MX1 |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | EPCQ128 |
Manufacturer's Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | EPCQ128SI16N |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Memory - Configuration Proms for FPGAs |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | EPCQ |
Write Cycle Time-Max (tWC) Specifies the maximum duration required to complete a single write operation in non-volatile memory. Compare this timing parameter across devices to ensure compatibility with your system's write timing budget. Always verify against the datasheet for worst-case conditions. | 8ms |
| Параметр | Значение |
|---|---|
Supply Voltage-Max (Vsup) Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings. | 3.6V |
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Nickel/Palladium/Gold (Ni/Pd/Au) |
Power Supplies Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues. | 3/3.3V |
Supply Voltage-Min (Vsup) Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures. | 2.7V |
Supply Voltage Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage. | 2.7V~3.6V |
Memory Size Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in. | 128MB |
Supply Current-Max Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load. | 0.02mA |
Parallel/Serial Indicates whether the component communicates via parallel or serial interface. This affects wiring complexity, data transfer speed, and compatibility with your microcontroller or system bus. Verify the interface type against your design requirements and the datasheet before integration. | SERIAL |
Programming Voltage Programming voltage is the specific voltage required to write or erase data in programmable devices like EEPROMs, flash memory, or microcontrollers. It must be applied precisely during programming; incorrect levels can cause write failures or permanent damage, so always follow the datasheet's programming procedure. | 3.3V |
| Параметр | Значение |
|---|---|
Height Seated (Max) Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts. | 2.65mm |
| Параметр | Значение |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | RoHS Compliant |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e4 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
JESD-30 Code JEDEC standard code that defines the package outline and dimensions. Use it to verify physical compatibility and footprint before PCB design. Compare with the datasheet to ensure the component meets your assembly and manufacturing requirements. | R-PDSO-G16 |
ECCN Code Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally. | EAR99 |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.32.0071 |
Предпросмотр datasheet
Просмотрите datasheet для EPCQ128SI16N от Intel, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.
Документы уведомлений
Для EPCQ128SI16N сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
Посмотрите больше компонентов из той же подкатегории, чтобы сравнить наличие, совместимость и варианты закупки.

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Частые вопросы
Точные ответы для покупателей, которые проверяют ordering code EPCQ128SI16N, упаковку, наличие, datasheet и путь замены.
EPCQ128SI16N — это точный ordering code для компонента категории Memory - Configuration Proms for FPGAs от Intel. Текущий корпус указан как 16SOIC, а контекст позиции включает IC CONFIG DEVICE 128MBIT 16SOIC. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Рассматривайте EPCQ128SI16N как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус 16SOIC, документацию производителя Intel, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
EPCQ128SI16N сейчас указан с корпусом 16SOIC от Intel. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
EPCQ128SI16N сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (16SOIC), указанный склад (11076), доступное количество (11076), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Для EPCQ128SI16N сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.