
Samsung 8GB eMMC 5.1 managed NAND flash memory device.
THGBMNG5D1LBAIL — это компонент категории eMMC от Kioxia в упаковке 153-WFBGA / FBGA-153 (11.5 x 13 mm). Его обычно проверяют для Toshiba Memory / Kioxia legacy 4GB e-MMC 5.0 managed NAND flash module in 153-WFBGA package. На этой странице указаны текущие остатки TrustCompo, уровни цен, данные по корпусу, доступ к datasheet, compliance-атрибуты, варианты отгрузки со склада Hong Kong, подтверждение оплаты и RFQ-варианты для покупателей, которым нужно подтвердить именно этот ordering code.

THGBMNG5D1LBAIL
TCE000120412
153-WFBGA / FBGA-153 (11.5 x 13 mm)
Toshiba / Kioxia e-MMC
1
Toshiba Memory / Kioxia legacy 4GB e-MMC 5.0 managed NAND flash module in 153-WFBGA package.
-
Сигналы доверия
Проверьте credentials TrustCompo, поддержку traceability, anti-counterfeit handling и inspection controls перед отправкой RFQ.
Процессы менеджмента качества для более стабильной закупки и обращения с продукцией.
Контроль дистрибуции авиационного уровня для прослеживаемости и надежности.
Экологическая дисциплина в операционных и складских процессах.
Стандарты защиты от электростатического разряда для чувствительных компонентов.
RFQ checklist
Подтвердите ключевые данные закупки для THGBMNG5D1LBAIL до RFQ, выпуска PO и планирования отгрузки.
Укажите точный part number, производителя, package и approval constraints в RFQ.
Проверьте live availability, MOQ, lead time, финальную цену и налоговые условия до PO.
Подтвердите datasheet, CoC, traceability, lifecycle notes и scope инспекции, если требуется.
Выпустите PO и согласуйте DHL, FedEx, UPS или buyer forwarder shipment из Hong Kong.
Перед выпуском PO
Обзор продукта
Проверьте sourcing context для THGBMNG5D1LBAIL от Kioxia, включая идентификацию товара, применимость, package notes и закупочные детали.
THGBMNG5D1LBAIL is a legacy Toshiba Memory / Kioxia e-MMC managed NAND flash module for embedded boot and storage designs. Public distributor records identify it as a 32Gbit / 4GB eMMC device in a 153-WFBGA package with 200MHz class clock support, 2.7V to 3.6V VCC, VCCQ operation at either 1.8V or 3.3V class depending on host mode, and -25C to +85C operating temperature. Buyers should treat it as a lifecycle-sensitive eMMC line: confirm package, host boot behavior, EXT_CSD fields, firmware expectations, date code, tray condition, and source traceability before purchase or substitution.
Технические параметры
Сравните сгруппированные параметры THGBMNG5D1LBAIL от Kioxia, включая package, series, key attributes и technical values для engineering и sourcing review.
Procurement Notes
Inspection Focus
Confirm Toshiba/Kioxia label context, date code, lot code, tray condition, package marking, and new/unused status.
Procurement Notes
Compatibility Note
Do not substitute by 4GB capacity alone. Review package, VCC/VCCQ rails, boot partitions, RPMB, EXT_CSD fields, firmware behavior, endurance, retention, and host validation.
Procurement Notes
Source Evidence
Request source-path evidence and retain distributor or supplier records before production release.
Product Parameter
Product Type
e-MMC managed NAND flash module
Memory
Capacity
4GB / 32Gbit
Memory
Memory Organization
4G x 8
| Параметр | Значение |
|---|---|
Inspection Focus Highlights key areas to inspect during quality control, such as solder joints, lead integrity, or marking legibility. Helps procurement teams and inspectors focus on critical parameters to ensure component reliability and compliance with specifications. | Confirm Toshiba/Kioxia label context, date code, lot code, tray condition, package marking, and new/unused status. |
Compatibility Note Provides compatibility information with other components, such as voltage levels, logic families, or connector types. Essential for avoiding integration issues in complex systems. Always verify compatibility with your specific design and reference designs. | Do not substitute by 4GB capacity alone. Review package, VCC/VCCQ rails, boot partitions, RPMB, EXT_CSD fields, firmware behavior, endurance, retention, and host validation. |
Source Evidence Describes the documentation or reference that substantiates the attribute values listed for the component. This helps buyers and engineers assess data reliability and traceability. Always check the original datasheet or manufacturer documentation for the most authoritative information. | Request source-path evidence and retain distributor or supplier records before production release. |
| Параметр | Значение |
|---|---|
Product Type Select the category that best describes this electronic component, such as capacitor, resistor, diode, or connector. This classification helps you filter and compare similar parts. Verify the exact type against the datasheet to ensure it matches your application requirements. | e-MMC managed NAND flash module |
| Параметр | Значение |
|---|---|
Capacity Total memory capacity of the module, typically expressed in megabytes or gigabytes. This is a primary selection criterion for system memory upgrades. Verify that the capacity is supported by the motherboard and operating system, and check for any limitations on total memory per channel. | 4GB / 32Gbit |
Memory Organization Specifies the internal arrangement of memory cells, such as rows and columns, often expressed as depth by width. This determines how addresses map to data bits. Verify against the datasheet to ensure compatibility with your system's address bus and data width requirements. | 4G x 8 |
| Параметр | Значение |
|---|---|
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Memory Type Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed. | Managed NAND eMMC |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -25C to +85C |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 153-WFBGA / FBGA-153 |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | Toshiba / Kioxia e-MMC |
Lifecycle Status Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime. | Obsolete / EOL in public distributor records; confirm current source before PO |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Kioxia / Toshiba Memory legacy |
Manufacturer Part Number Unique alphanumeric identifier assigned by the original manufacturer to specify a particular component version. Use this number to cross-reference datasheets, verify exact specifications, and ensure compatibility with your design. Always confirm it matches the part you intend to order. | THGBMNG5D1LBAIL |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | eMMC 5.0 class |
Clock Frequency Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values. | 200 MHz class |
| Параметр | Значение |
|---|---|
VCCQ Indicates the supply voltage for the I/O interface circuitry of the device. It determines the logic levels for communication with other components. Engineers must match this voltage to the bus voltage of the system to avoid signal integrity issues or damage. | 1.7V to 1.95V or 2.7V to 3.6V, host mode dependent |
Package Size Specifies the physical dimensions of the component package, such as length, width, and height. This attribute helps determine board space requirements and compatibility with assembly processes. Verify against the datasheet for precise measurements. | 11.5 x 13 mm |
VCC Specifies the core supply voltage required for the internal logic of the device. This is essential for power design and ensuring reliable operation. Engineers must verify that the power supply meets the specified voltage and tolerances under all load conditions. | 2.7V to 3.6V |
Предпросмотр datasheet
Просмотрите datasheet для THGBMNG5D1LBAIL от Kioxia, чтобы проверить package, electrical characteristics, application notes и document evidence до RFQ.
Документы уведомлений
Для THGBMNG5D1LBAIL сейчас не показан публичный product notice document. Подтвердите PCN, PDN, EOL, date code и lifecycle status во время RFQ до производственной закупки.
Связанные варианты закупки
Посмотрите больше компонентов из той же подкатегории, чтобы сравнить наличие, совместимость и варианты закупки.

Samsung 8GB eMMC 5.1 managed NAND flash memory device.



Micron 32GB industrial eMMC managed NAND flash device in 153-ball TFBGA package.

Kioxia 4Gbit x8 3.3V CMOS NAND E2PROM flash memory device in 48-pin TSOP I package.

Частые вопросы
Точные ответы для покупателей, которые проверяют ordering code THGBMNG5D1LBAIL, упаковку, наличие, datasheet и путь замены.
THGBMNG5D1LBAIL — это точный ordering code для компонента категории eMMC от Kioxia. Текущий корпус указан как 153-WFBGA / FBGA-153 (11.5 x 13 mm), а контекст позиции включает Toshiba Memory / Kioxia legacy 4GB e-MMC 5.0 managed NAND flash module in 153-WFBGA package.. Используйте полный код при запросе склада, цены, datasheet или compliance-подтверждения.
Рассматривайте THGBMNG5D1LBAIL как полный ordering code при RFQ и инженерной проверке. Подтвердите указанный корпус 153-WFBGA / FBGA-153 (11.5 x 13 mm), документацию производителя Kioxia, ordering table в datasheet, reel или packing details и требования внутреннего утверждения до замены или выпуска PO.
THGBMNG5D1LBAIL сейчас указан с корпусом 153-WFBGA / FBGA-153 (11.5 x 13 mm) от Kioxia. Перед утверждением закупки подтвердите manufacturer package drawing, footprint, pinout, tape-and-reel данные и требования к приемке.
THGBMNG5D1LBAIL сейчас помечен на странице как позиция с наличием. Перед заказом подтвердите корпус (153-WFBGA / FBGA-153 (11.5 x 13 mm)), указанный склад (36000), доступное количество (18000), нужное количество, срок поставки, финальную цену, compliance-требования и совпадение точного ordering code через RFQ.
Для THGBMNG5D1LBAIL сейчас не опубликован список связанных альтернатив. Отправьте RFQ с количеством, ограничениями по корпусу и требованиями к утверждению, чтобы TrustCompo помогла проверить возможные replacement options.